JPS6363770A - Adhesive for copper-clad laminate - Google Patents
Adhesive for copper-clad laminateInfo
- Publication number
- JPS6363770A JPS6363770A JP20835886A JP20835886A JPS6363770A JP S6363770 A JPS6363770 A JP S6363770A JP 20835886 A JP20835886 A JP 20835886A JP 20835886 A JP20835886 A JP 20835886A JP S6363770 A JPS6363770 A JP S6363770A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- resin
- copper
- pyrogallol
- gallic acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 33
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 33
- 239000003822 epoxy resin Substances 0.000 claims abstract description 25
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 25
- LNTHITQWFMADLM-UHFFFAOYSA-N gallic acid Chemical compound OC(=O)C1=CC(O)=C(O)C(O)=C1 LNTHITQWFMADLM-UHFFFAOYSA-N 0.000 claims abstract description 18
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 claims abstract description 18
- 229920005989 resin Polymers 0.000 claims abstract description 13
- 239000011347 resin Substances 0.000 claims abstract description 13
- 229940074391 gallic acid Drugs 0.000 claims abstract description 11
- 235000004515 gallic acid Nutrition 0.000 claims abstract description 11
- 239000011134 resol-type phenolic resin Substances 0.000 claims abstract description 10
- 229940079877 pyrogallol Drugs 0.000 claims abstract description 9
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 claims abstract description 6
- 239000007787 solid Substances 0.000 claims abstract description 5
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 3
- -1 gallic acid ester Chemical class 0.000 claims description 6
- 239000002683 reaction inhibitor Substances 0.000 claims description 6
- 125000004432 carbon atom Chemical group C* 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims 1
- 238000006243 chemical reaction Methods 0.000 abstract description 8
- 230000000694 effects Effects 0.000 abstract description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 6
- 239000011889 copper foil Substances 0.000 abstract description 6
- 150000002148 esters Chemical class 0.000 abstract description 4
- 238000002156 mixing Methods 0.000 abstract description 4
- 239000000758 substrate Substances 0.000 abstract description 3
- 230000000979 retarding effect Effects 0.000 abstract 2
- 239000002253 acid Substances 0.000 abstract 1
- 230000002411 adverse Effects 0.000 abstract 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 8
- 239000000463 material Substances 0.000 description 6
- 238000005476 soldering Methods 0.000 description 5
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical group OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- DGUJJOYLOCXENZ-UHFFFAOYSA-N 4-[2-[4-(oxiran-2-ylmethoxy)phenyl]propan-2-yl]phenol Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C1=CC=C(O)C=C1 DGUJJOYLOCXENZ-UHFFFAOYSA-N 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 229920003986 novolac Polymers 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- RCJVRSBWZCNNQT-UHFFFAOYSA-N dichloridooxygen Chemical compound ClOCl RCJVRSBWZCNNQT-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000001879 gelation Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000001629 suppression Effects 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N Butyraldehyde Chemical compound CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 1
- 150000001299 aldehydes Chemical class 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000010687 lubricating oil Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- 239000011877 solvent mixture Substances 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Landscapes
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
【発明の詳細な説明】 〔産業上の利用分野〕 この発明は銅張積層板用接着剤に関するものである。[Detailed description of the invention] [Industrial application field] This invention relates to an adhesive for copper-clad laminates.
銅張積層板用接着剤は、たとえば溶融ノ＼ンダ液に浸漬
しでも脹れを生じないこと、回路幅が狭小でも強力な接
着力を保つことなど、積層板加工途中の苛酷な条件に耐
える性質を有することが必要である。そして電気機器の
急速な進歩に伴って、これらの使用条件はますます過酷
になる傾向にあり、常に引き剥がし強さは１．８０ｋｇ
／ｃｍ以上、半田耐熱性は２６０℃で２０秒以上が要求
され。Adhesives for copper-clad laminates can withstand harsh conditions during the processing of laminates, such as not causing swelling even when immersed in molten powder and maintaining strong adhesive strength even when the circuit width is narrow. It is necessary to have the following characteristics. With the rapid advancement of electrical equipment, the conditions for using these devices are becoming increasingly harsh, and the peel strength has always been 1.80 kg.
/cm or more, and soldering heat resistance is required at 260°C for 20 seconds or more.
検査不要時代を迎えようとする昨今では特性レベルと安
定性の向上とが強く要望されるようになって来た。従来
これらの性能要求に対してポリビニルブチラール樹脂、
レゾール型フェノール樹脂およびエポキシ樹脂を配合し
た接着剤が実用化されでいる。この接着剤にエポキシ樹
脂が添加されることによっで銅箔界面との接着力向上、
吸湿した絶縁基材に対する接着力の安定性向上およびエ
ポキシ樹脂の構造もしくは２種以上の配合方法等の選択
に伴う半田耐熱性の向上など多くの好ましい効果が認め
らでいるが、エポキシ樹脂を過剰に添加すると、逆に半
田耐熱性を著しく低下させ、安定した接着力も得難くな
って来る。したがって、さらに反応性の高いレゾール型
フェノール樹脂を使用して硬化物の架橋密度を高め、過
剰のエポキシ樹脂（てよっても半田耐熱性が低下するこ
となく接着力の安定した接着剤を得ようとすると、エポ
キシ樹脂の硬化剤的役割をもつレゾール型フェノール樹
脂が接着剤溶解時に５０〜６０℃程度まで加熱されるこ
とによってエポキシ樹脂と初期反応を起こし、最終硬化
物の接着性能は低下し、著しくシェルライフが短くなる
といった新たな問題が提起されるようになって来た。Nowadays, as we move into an era where inspections are unnecessary, there is a strong demand for improved characteristics and stability. Conventionally, polyvinyl butyral resin,
Adhesives containing resol type phenolic resins and epoxy resins have been put into practical use. By adding epoxy resin to this adhesive, the adhesive strength with the copper foil interface is improved.
Many favorable effects have been observed, such as improved stability of adhesion to moisture-absorbed insulating substrates and improved soldering heat resistance due to selection of epoxy resin structure or combination method of two or more types, but excessive use of epoxy resin On the contrary, if it is added, the soldering heat resistance will be significantly reduced and it will become difficult to obtain stable adhesive strength. Therefore, in order to increase the crosslinking density of the cured product by using a highly reactive resol type phenolic resin, we tried to obtain an adhesive with stable adhesive strength without reducing the soldering heat resistance even if excessive epoxy resin was used. Then, the resol-type phenolic resin, which acts as a curing agent for the epoxy resin, is heated to about 50 to 60 degrees Celsius when the adhesive is melted, causing an initial reaction with the epoxy resin, and the adhesive performance of the final cured product deteriorates significantly. New problems such as shortened shell life have started to be raised.
このように従来の技術においでは、最近の過酷な使用条
件に対応する絶縁基材と銅箔との接着力、その接着力の
安定性、さらに安定した半田耐熱性を兼備する銅張積層
板用接着剤は得られなかったという問題点があった。In this way, in conventional technology, copper-clad laminates that have the adhesive strength between the insulating base material and the copper foil, the stability of that adhesive strength, and stable solder heat resistance to meet the harsh usage conditions of recent years have been developed. There was a problem that adhesive could not be obtained.
上記の問題点を解決するために、この発明はポリビニル
ブチラール樹脂、レゾール型フェノール樹脂およびエポ
キシ樹脂からなる接着剤において、反応抑制剤としでピ
ロガロール、没食子酸または没食子酸エステルを樹脂固
形分対比で０．５〜８．０重量％の割合で配合して銅張
積層板用接着剤とする手段を採用したものである。以下
その詳細を述べる。In order to solve the above problems, the present invention uses pyrogallol, gallic acid, or gallic acid ester as a reaction inhibitor in an adhesive made of polyvinyl butyral resin, resol type phenolic resin, and epoxy resin. The adhesive for copper-clad laminates is prepared by blending the adhesive in a proportion of .5 to 8.0% by weight. The details will be described below.
まず、この発明のポリビニルブチラール樹脂は、ブチラ
ール化度および重合度において持７Ｃ限定されるもので
はないが、ブチラール化度７５重囲％以上、重合度１５
００〜２５００ 程度のものが持て良好な特性を示すの
で望ましいものと言える。また、レゾル型フェノール樹
脂はフェノール、クレゾール、アルキルフェノールまた
はビスフェノールＡなどのフェノール類とアルデヒド類
とをアルカリ性触媒の存在下で反応させて得られる液状
引脂であり特に合成比率など制、限されるものではζい
が、反応生成物がベンゼン環１個につき０．７個以上の
メチロール基を付加したもので、ゲル化時間が１５０℃
で５０〜１５０秒程度のものが特に良好な特性を示すこ
とから望ましいものであると言うことができる。さらに
この発明のエポキシ樹脂はビスフェノールＡグリシジル
エーテル型、フニノールノボラック型、タレゾールノボ
ラック型等のエポキシ樹脂、ハロゲン化エポキシ樹脂、
高分子型エポキシ樹脂、可撓性エポキシ樹脂、多官能エ
ポキシ樹脂などのエポキシ樹脂全般にわたるものである
が、中でもエポキシ当量が１８０〜３５０程度のビスフ
ェノールＡグリシジルエーテル型エポキシ樹脂またはそ
れ以上のエポキシ当量を有するエポキシ樹脂とフェノー
ルノボラック型エポキシ樹脂もしくは多官能エポキシ樹
脂との混合物などはハンダ尉熱性、接着力をより向上さ
せるという点で宅”ましい樹脂である。さらにこの発明
における有機溶剤は上記接着剤を溶解させるものである
ならば特に限定されるものではない。First, the polyvinyl butyral resin of the present invention has a degree of butyralization and a degree of polymerization of 7C, although the degree of butyralization is not limited to 75%, and the degree of polymerization is 75% or more.
A value of about 00 to 2,500 is desirable because it exhibits good properties. In addition, resol type phenolic resin is a liquid lubricant obtained by reacting phenols such as phenol, cresol, alkylphenol, or bisphenol A with aldehydes in the presence of an alkaline catalyst, and there are particular restrictions on the synthesis ratio. However, the reaction product has 0.7 or more methylol groups added to each benzene ring, and the gelation time is 150℃.
It can be said that a time period of about 50 to 150 seconds is desirable because it shows particularly good characteristics. Furthermore, the epoxy resin of the present invention includes epoxy resins such as bisphenol A glycidyl ether type, Funinol novolac type, Talesol novolac type, halogenated epoxy resins,
It covers a wide range of epoxy resins such as polymeric epoxy resins, flexible epoxy resins, and multifunctional epoxy resins, but among them, bisphenol A glycidyl ether type epoxy resins with an epoxy equivalent of about 180 to 350 or higher epoxy equivalents are used. A mixture of an epoxy resin and a phenol novolak type epoxy resin or a polyfunctional epoxy resin is a desirable resin in that it further improves soldering heat resistance and adhesive strength.Furthermore, the organic solvent in this invention is a mixture of the above-mentioned adhesive. There is no particular limitation as long as it dissolves.
つぎに、この発明においでレゾール型フェノール樹脂と
エポキシ樹脂とが溶解時の５０〜６０℃程度の加熱のも
とに起こす反応の抑制剤として配合するピロガロールま
たは没食子酸さらにはそつエステルはそれぞれ
〔ここでＲは炭素数１〜１８のアル千ル基〕で示される
一連の化合物であり、その配合量を樹脂固形分対比で０
，５〜８．０重量％とする理由は、０．５重量％未満の
少量ではレゾール型フェノール樹脂とエポキシ樹脂との
反応抑制効果は不充分であり、また８、０重量％を越え
る多量ではこれ以上の反応抑制効果は認められず、逆：
て特性に対しＣ悪影響を及はすようコてなつで好ましく
ないからである。Next, in this invention, pyrogallol, gallic acid, and gallic ester, which are blended as inhibitors for the reaction that occurs when the resol type phenolic resin and the epoxy resin are heated to about 50 to 60 degrees Celsius during melting, are described below. R is a series of compounds represented by an alkyl group having 1 to 18 carbon atoms, and the blending amount is 0 relative to the resin solid content.
, 5 to 8.0% by weight is because if the amount is less than 0.5% by weight, the effect of suppressing the reaction between the resol type phenol resin and the epoxy resin is insufficient, and if the amount exceeds 8.0% by weight, the reaction suppression effect is insufficient. No further response suppression effect was observed, and the opposite:
This is because it is undesirable because it has a negative effect on the characteristics.
この発明のようにピロガロール、没食子酸または没食子
酸エステルによってレゾール型フニノール樹脂とエポキ
シ樹脂との初期反応は抑制され、シェルライフを著しく
向上させ、しかも、最終硬化反応に影響を与えることな
く初期の安定した高い接着性能を発現させるものと考え
られる。As in this invention, the initial reaction between the resol-type funinol resin and the epoxy resin is suppressed by pyrogallol, gallic acid, or gallic acid ester, which significantly improves the shell life and provides initial stability without affecting the final curing reaction. It is thought that this material exhibits high adhesion performance.
実施例１：
平均重合度２０００、 ブチラール化度８０％以上のポ
リビニルブチラール樹脂（電気化学工業株式会社製：商
品名デンカブチラール５０００Ａ）４８重量％と、メチ
ロール化度ｏ、９９、ゲル化時Ｉ’＋５１５０℃、１２
０秒のレゾール型フェノール樹脂２８重量％と、エポキ
シ当ｆｔ２３０〜２８０のビスフェノールＡグリシジル
エーテル型エポキシ樹脂（シェル化学株式会社ｆＡ 、
商品名エピコート８２８）２４重口％と、さらに反応抑
制剤としで、ピロガロール１重量％（樹脂固形分に対し
）とを、メタノールおよびトルエンの等量混合溶剤によ
って樹脂固形分が２０％になるように溶解させ、銅張積
層板用接着剤を得た。このようにしで得られた接着剤を
密封し、オーブン中で６０℃、２０時間加熱処理し、厚
３５μｍの銅箔に塗布（塗工量３０ ｇ／ｍ ）・乾燥
（１５０℃、２．５分）させ、別途常態基材（フェノー
ル樹脂含浸基材）および吸湿基材（フェノール樹脂含浸
基材を４０℃、湿度９０％の恒温恒湿槽中においで５分
間処理した基材）のそれぞれに対してこの接着剤塗工銅
箔を重ね加熱加圧して銅張積層板を作製し、ＪＩＳ−Ｃ
６４８１に準拠してハンダ耐熱性（秒）および引き剥し
強度（ｋｇ／ｃｍ） を測定した。その結果を表にま
とめた。Example 1: Polyvinyl butyral resin with an average degree of polymerization of 2000 and a degree of butyralization of 80% or more (manufactured by Denki Kagaku Kogyo Co., Ltd., trade name Denka Butyral 5000A), 48% by weight, a degree of methylolization of o, 99, and I' at the time of gelation. +5150℃, 12
0 seconds resol type phenolic resin 28% by weight and epoxy weight 230-280 ft bisphenol A glycidyl ether type epoxy resin (Shell Chemical Co., Ltd. fA,
24% by weight of the product name Epicote 828) and 1% by weight of pyrogallol (based on the resin solid content) as a reaction inhibitor were mixed in a solvent mixture of equal amounts of methanol and toluene so that the resin solid content was 20%. An adhesive for copper-clad laminates was obtained. The adhesive thus obtained was sealed, heat treated in an oven at 60°C for 20 hours, applied to a 35 μm thick copper foil (coating amount: 30 g/m ) and dried (150°C, 2.5 μm). minutes), and then separately applied to a normal base material (phenolic resin-impregnated base material) and a moisture-absorbing base material (phenol resin-impregnated base material treated in a constant temperature and humidity chamber at 40°C and 90% humidity for 5 minutes). This adhesive-coated copper foil was then layered and heated and pressed to produce a copper-clad laminate, and JIS-C
Solder heat resistance (seconds) and peel strength (kg/cm) were measured in accordance with 6481. The results are summarized in a table.
実施例２および３：
反応抑制剤としてピロガロールに代えで没食子酸および
そのｎ−プロピルエステルを用いた以外は全〈実施例１
と同じ操作を行なって接着剤を調製し、同様の特性を調
べた。得られた結果を表に併記した。Examples 2 and 3: Same as Example 1 except that gallic acid and its n-propyl ester were used instead of pyrogallol as a reaction inhibitor.
Adhesives were prepared using the same procedure as described above, and similar properties were investigated. The obtained results are also listed in the table.
比較例：
反応抑制剤を使用しなかったこと以外は実施例１と同じ
操作を行なって接着剤を調製し、同様の特性を調べた。Comparative Example: An adhesive was prepared in the same manner as in Example 1, except that no reaction inhibitor was used, and the same properties were investigated.
得られた結果を表：て併記した。The obtained results are also listed in the table.
表
表から明らかなよう）で、この発明の反応抑制剤を使用
した実施例１〜３はいずれも６０’Ｃｌ２Ｏ時間の加熱
処理後Ｏておいでもハンダ耐熱性、引き剥し強度の低下
は認められず、比較例よりも遥かに安定しで優れた性能
を有する接着剤であることがわかった。As is clear from the table), in all Examples 1 to 3 using the reaction inhibitor of the present invention, no decrease in solder heat resistance or peel strength was observed even after being exposed to O after heat treatment for 60' Cl2O hours. First, it was found that the adhesive was far more stable and had superior performance than the comparative example.
以上述べたように、この発明の銅張積層板用接着剤は加
熱処理後においでも優れた／Ｓレンダ熱性および絶縁基
材（乾燥または吸湿のいずれを問わず）と銅箔との安定
した接着性を示し、銅張積層板に対する最近の過酷な使
用条件にも充分対応し得るものであるから、この発明の
意義はきわめて大きいと言うことができる。As described above, the adhesive for copper-clad laminates of the present invention has excellent /S render thermal properties even after heat treatment and stable adhesion between an insulating substrate (whether dry or moisture-absorbed) and copper foil. It can be said that the significance of this invention is extremely great because it can sufficiently cope with the recent severe usage conditions for copper-clad laminates.
Claims (1)
樹脂およびエポキシ樹脂からなる接着剤において、反応
抑制剤としてピロガロール、没食子酸または没食子酸エ
ステルが樹脂固形分対比で０．５〜８．０重量％の割合
で配合されていることを特徴とする銅張積層板用接着剤
。 ２、没食子酸エステルが ▲数式、化学式、表等があります▼ 〔ここでＲは炭素数１〜１８のアルキル基〕である特許
請求の範囲第１項記載の銅張積層板用接着剤。[Claims] 1. In an adhesive made of polyvinyl butyral resin, resol type phenolic resin, and epoxy resin, pyrogallol, gallic acid, or gallic acid ester is used as a reaction inhibitor in an amount of 0.5 to 8.0 relative to the solid content of the resin. An adhesive for copper-clad laminates characterized by being blended in a proportion of % by weight. 2. The adhesive for copper-clad laminates according to claim 1, wherein the gallic acid ester is ▲a numerical formula, a chemical formula, a table, etc.▼ [where R is an alkyl group having 1 to 18 carbon atoms].
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20835886A JPS6363770A (en) | 1986-09-03 | 1986-09-03 | Adhesive for copper-clad laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20835886A JPS6363770A (en) | 1986-09-03 | 1986-09-03 | Adhesive for copper-clad laminate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6363770A true JPS6363770A (en) | 1988-03-22 |
| JPH0340072B2 JPH0340072B2 (en) | 1991-06-17 |
Family
ID=16554968
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20835886A Granted JPS6363770A (en) | 1986-09-03 | 1986-09-03 | Adhesive for copper-clad laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6363770A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6872762B2 (en) * | 2000-07-13 | 2005-03-29 | Loctite (R&D) Limited | Epoxy resin composition with solid organic acid |
| JP2008516064A (en) * | 2004-10-11 | 2008-05-15 | ヘンケル コマンディットゲゼルシャフト アウフ アクチエン | Aging resistant coatings and adhesive composites |
| JP2011190351A (en) * | 2010-03-15 | 2011-09-29 | Cemedine Co Ltd | Phenol resin and polyvinyl acetal resin adhesive |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4999637A (en) * | 1973-01-29 | 1974-09-20 | ||
| JPS6032875A (en) * | 1983-08-01 | 1985-02-20 | Matsushita Electric Works Ltd | Adhesive for metal-clad laminate |
-
1986
- 1986-09-03 JP JP20835886A patent/JPS6363770A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4999637A (en) * | 1973-01-29 | 1974-09-20 | ||
| JPS6032875A (en) * | 1983-08-01 | 1985-02-20 | Matsushita Electric Works Ltd | Adhesive for metal-clad laminate |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6872762B2 (en) * | 2000-07-13 | 2005-03-29 | Loctite (R&D) Limited | Epoxy resin composition with solid organic acid |
| JP2008516064A (en) * | 2004-10-11 | 2008-05-15 | ヘンケル コマンディットゲゼルシャフト アウフ アクチエン | Aging resistant coatings and adhesive composites |
| JP2011190351A (en) * | 2010-03-15 | 2011-09-29 | Cemedine Co Ltd | Phenol resin and polyvinyl acetal resin adhesive |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0340072B2 (en) | 1991-06-17 |
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