JPS6362099B2 - - Google Patents
Info
- Publication number
- JPS6362099B2 JPS6362099B2 JP11726181A JP11726181A JPS6362099B2 JP S6362099 B2 JPS6362099 B2 JP S6362099B2 JP 11726181 A JP11726181 A JP 11726181A JP 11726181 A JP11726181 A JP 11726181A JP S6362099 B2 JPS6362099 B2 JP S6362099B2
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- die
- lead
- magnification
- detection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000001514 detection method Methods 0.000 claims description 32
- 238000012544 monitoring process Methods 0.000 claims description 12
- 238000012806 monitoring device Methods 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 4
- 239000000758 substrate Substances 0.000 description 6
- 238000005286 illumination Methods 0.000 description 2
- 238000010009 beating Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11726181A JPS5818934A (ja) | 1981-07-27 | 1981-07-27 | インナ−リ−ドボンデイング装置における試料監視装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11726181A JPS5818934A (ja) | 1981-07-27 | 1981-07-27 | インナ−リ−ドボンデイング装置における試料監視装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5818934A JPS5818934A (ja) | 1983-02-03 |
| JPS6362099B2 true JPS6362099B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1988-12-01 |
Family
ID=14707377
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11726181A Granted JPS5818934A (ja) | 1981-07-27 | 1981-07-27 | インナ−リ−ドボンデイング装置における試料監視装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5818934A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2592337B2 (ja) * | 1989-11-20 | 1997-03-19 | 株式会社カイジョー | テープボンディング方法 |
-
1981
- 1981-07-27 JP JP11726181A patent/JPS5818934A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5818934A (ja) | 1983-02-03 |