JPS6355866B2 - - Google Patents
Info
- Publication number
- JPS6355866B2 JPS6355866B2 JP58005465A JP546583A JPS6355866B2 JP S6355866 B2 JPS6355866 B2 JP S6355866B2 JP 58005465 A JP58005465 A JP 58005465A JP 546583 A JP546583 A JP 546583A JP S6355866 B2 JPS6355866 B2 JP S6355866B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- outer diameter
- welding base
- metal cap
- welding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000003466 welding Methods 0.000 claims description 72
- 239000002184 metal Substances 0.000 claims description 34
- 238000000034 method Methods 0.000 claims description 28
- 238000005245 sintering Methods 0.000 claims description 13
- 230000008569 process Effects 0.000 claims description 11
- 230000002093 peripheral effect Effects 0.000 claims description 8
- 238000007789 sealing Methods 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 7
- 229910000833 kovar Inorganic materials 0.000 claims description 6
- 238000004806 packaging method and process Methods 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 239000000956 alloy Substances 0.000 claims description 5
- 229910045601 alloy Inorganic materials 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 4
- 238000005219 brazing Methods 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 3
- 238000007639 printing Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims 1
- 238000003825 pressing Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 8
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 6
- 230000008859 change Effects 0.000 description 3
- 230000008602 contraction Effects 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 238000007723 die pressing method Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 238000012536 packaging technology Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Optical Couplings Of Light Guides (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58005465A JPS59130447A (ja) | 1983-01-17 | 1983-01-17 | 電子部品のパツケ−ジ方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58005465A JPS59130447A (ja) | 1983-01-17 | 1983-01-17 | 電子部品のパツケ−ジ方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59130447A JPS59130447A (ja) | 1984-07-27 |
| JPS6355866B2 true JPS6355866B2 (en:Method) | 1988-11-04 |
Family
ID=11611981
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58005465A Granted JPS59130447A (ja) | 1983-01-17 | 1983-01-17 | 電子部品のパツケ−ジ方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59130447A (en:Method) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0537057U (ja) * | 1991-10-22 | 1993-05-21 | フラツト合成株式会社 | さけます孵化槽用下網 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6435938A (en) * | 1987-07-30 | 1989-02-07 | Toshiba Corp | Method of hermetically sealing image sensing element module |
| US8335050B2 (en) | 2007-04-03 | 2012-12-18 | Hitachi Global Storage Technologies, Netherlands B.V. | Disk drive with a solder preform hermetic seal |
-
1983
- 1983-01-17 JP JP58005465A patent/JPS59130447A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0537057U (ja) * | 1991-10-22 | 1993-05-21 | フラツト合成株式会社 | さけます孵化槽用下網 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59130447A (ja) | 1984-07-27 |
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