JPS6355796B2 - - Google Patents
Info
- Publication number
- JPS6355796B2 JPS6355796B2 JP56107425A JP10742581A JPS6355796B2 JP S6355796 B2 JPS6355796 B2 JP S6355796B2 JP 56107425 A JP56107425 A JP 56107425A JP 10742581 A JP10742581 A JP 10742581A JP S6355796 B2 JPS6355796 B2 JP S6355796B2
- Authority
- JP
- Japan
- Prior art keywords
- polyimide
- resistor
- wiring
- adhesive layer
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920001721 polyimide Polymers 0.000 claims description 25
- 239000004642 Polyimide Substances 0.000 claims description 20
- 239000012790 adhesive layer Substances 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 14
- 238000004519 manufacturing process Methods 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 13
- 238000007639 printing Methods 0.000 claims description 9
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 239000012212 insulator Substances 0.000 description 7
- 239000010410 layer Substances 0.000 description 6
- 229920000642 polymer Polymers 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000002952 polymeric resin Substances 0.000 description 3
- 229920003002 synthetic resin Polymers 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56107425A JPS589394A (ja) | 1981-07-09 | 1981-07-09 | 薄型回路基板の製法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56107425A JPS589394A (ja) | 1981-07-09 | 1981-07-09 | 薄型回路基板の製法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS589394A JPS589394A (ja) | 1983-01-19 |
| JPS6355796B2 true JPS6355796B2 (US06521211-20030218-C00004.png) | 1988-11-04 |
Family
ID=14458814
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56107425A Granted JPS589394A (ja) | 1981-07-09 | 1981-07-09 | 薄型回路基板の製法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS589394A (US06521211-20030218-C00004.png) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61136285A (ja) * | 1984-12-07 | 1986-06-24 | 松下電器産業株式会社 | 高周波用プリント配線回路 |
| JPH04171902A (ja) * | 1990-11-06 | 1992-06-19 | Matsushita Electric Ind Co Ltd | 角形チップ抵抗器の製造方法 |
| JP6022963B2 (ja) * | 2013-02-13 | 2016-11-09 | 株式会社フジクラ | 伸縮性配線板及びその製造方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51107458A (ja) * | 1975-03-17 | 1976-09-24 | Matsushita Electric Ind Co Ltd | Insatsuteikotai |
| JPS5439873A (en) * | 1977-09-06 | 1979-03-27 | Nippon Denso Co | Incombustible ypet flexible printed wiring board |
-
1981
- 1981-07-09 JP JP56107425A patent/JPS589394A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51107458A (ja) * | 1975-03-17 | 1976-09-24 | Matsushita Electric Ind Co Ltd | Insatsuteikotai |
| JPS5439873A (en) * | 1977-09-06 | 1979-03-27 | Nippon Denso Co | Incombustible ypet flexible printed wiring board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS589394A (ja) | 1983-01-19 |
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