JPS6355550A - プリント基板の分割投影露光方法 - Google Patents

プリント基板の分割投影露光方法

Info

Publication number
JPS6355550A
JPS6355550A JP61199852A JP19985286A JPS6355550A JP S6355550 A JPS6355550 A JP S6355550A JP 61199852 A JP61199852 A JP 61199852A JP 19985286 A JP19985286 A JP 19985286A JP S6355550 A JPS6355550 A JP S6355550A
Authority
JP
Japan
Prior art keywords
projection
reticle
wiring pattern
printed circuit
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61199852A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6349218B2 (enrdf_load_html_response
Inventor
Tadashi Kishimoto
岸本　匡
Takahito Yanagi
柳　享仁
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mamiya OP Co Ltd
Original Assignee
Mamiya Camera Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mamiya Camera Co Ltd filed Critical Mamiya Camera Co Ltd
Priority to JP61199852A priority Critical patent/JPS6355550A/ja
Publication of JPS6355550A publication Critical patent/JPS6355550A/ja
Publication of JPS6349218B2 publication Critical patent/JPS6349218B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
JP61199852A 1986-08-26 1986-08-26 プリント基板の分割投影露光方法 Granted JPS6355550A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61199852A JPS6355550A (ja) 1986-08-26 1986-08-26 プリント基板の分割投影露光方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61199852A JPS6355550A (ja) 1986-08-26 1986-08-26 プリント基板の分割投影露光方法

Publications (2)

Publication Number Publication Date
JPS6355550A true JPS6355550A (ja) 1988-03-10
JPS6349218B2 JPS6349218B2 (enrdf_load_html_response) 1988-10-04

Family

ID=16414722

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61199852A Granted JPS6355550A (ja) 1986-08-26 1986-08-26 プリント基板の分割投影露光方法

Country Status (1)

Country Link
JP (1) JPS6355550A (enrdf_load_html_response)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5107324A (en) * 1989-04-27 1992-04-21 Fuji Electric Co., Ltd. Two-terminal semiconductor device of surface installation type
WO2000068738A1 (fr) * 1999-05-07 2000-11-16 Nikon Corporation Table de montage, micro-appareil, masque photographique, procede d'exposition, et procede de fabrication d'appareil
CN109429436A (zh) * 2017-08-29 2019-03-05 同泰电子科技股份有限公司 柔性电路板及其制作方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57112753A (en) * 1980-12-29 1982-07-13 Fujitsu Ltd Exposure method
JPS57183032A (en) * 1981-05-06 1982-11-11 Toshiba Corp Method for wafer exposure and device thereof
JPS6318352A (ja) * 1986-07-11 1988-01-26 Agency Of Ind Science & Technol 分割露光用マスク

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57112753A (en) * 1980-12-29 1982-07-13 Fujitsu Ltd Exposure method
JPS57183032A (en) * 1981-05-06 1982-11-11 Toshiba Corp Method for wafer exposure and device thereof
JPS6318352A (ja) * 1986-07-11 1988-01-26 Agency Of Ind Science & Technol 分割露光用マスク

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5107324A (en) * 1989-04-27 1992-04-21 Fuji Electric Co., Ltd. Two-terminal semiconductor device of surface installation type
WO2000068738A1 (fr) * 1999-05-07 2000-11-16 Nikon Corporation Table de montage, micro-appareil, masque photographique, procede d'exposition, et procede de fabrication d'appareil
US6842225B1 (en) 1999-05-07 2005-01-11 Nikon Corporation Exposure apparatus, microdevice, photomask, method of exposure, and method of production of device
CN109429436A (zh) * 2017-08-29 2019-03-05 同泰电子科技股份有限公司 柔性电路板及其制作方法
JP2019047102A (ja) * 2017-08-29 2019-03-22 同泰電子科技股▲ふん▼有限公司ＵＮＩＦＬＥＸ Ｔｅｃｈｎｏｌｏｇｙ Ｉｎｃ． フレキシブル回路基板及びその製造方法
CN109429436B (zh) * 2017-08-29 2020-08-11 同泰电子科技股份有限公司 柔性电路板及其制作方法

Also Published As

Publication number Publication date
JPS6349218B2 (enrdf_load_html_response) 1988-10-04

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