JPS6353697B2 - - Google Patents

Info

Publication number
JPS6353697B2
JPS6353697B2 JP6220683A JP6220683A JPS6353697B2 JP S6353697 B2 JPS6353697 B2 JP S6353697B2 JP 6220683 A JP6220683 A JP 6220683A JP 6220683 A JP6220683 A JP 6220683A JP S6353697 B2 JPS6353697 B2 JP S6353697B2
Authority
JP
Japan
Prior art keywords
chip carrier
cap
semiconductor component
leads
pads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP6220683A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59188944A (ja
Inventor
Hiroyuki Hamaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP6220683A priority Critical patent/JPS59188944A/ja
Publication of JPS59188944A publication Critical patent/JPS59188944A/ja
Publication of JPS6353697B2 publication Critical patent/JPS6353697B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/055—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads having a passage through the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP6220683A 1983-04-11 1983-04-11 チツプキヤリア Granted JPS59188944A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6220683A JPS59188944A (ja) 1983-04-11 1983-04-11 チツプキヤリア

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6220683A JPS59188944A (ja) 1983-04-11 1983-04-11 チツプキヤリア

Publications (2)

Publication Number Publication Date
JPS59188944A JPS59188944A (ja) 1984-10-26
JPS6353697B2 true JPS6353697B2 (enrdf_load_html_response) 1988-10-25

Family

ID=13193435

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6220683A Granted JPS59188944A (ja) 1983-04-11 1983-04-11 チツプキヤリア

Country Status (1)

Country Link
JP (1) JPS59188944A (enrdf_load_html_response)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6756669B2 (en) 2002-04-05 2004-06-29 Intel Corporation Heat spreader with down set leg attachment feature

Also Published As

Publication number Publication date
JPS59188944A (ja) 1984-10-26

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