JPS6352796B2 - - Google Patents
Info
- Publication number
- JPS6352796B2 JPS6352796B2 JP55001885A JP188580A JPS6352796B2 JP S6352796 B2 JPS6352796 B2 JP S6352796B2 JP 55001885 A JP55001885 A JP 55001885A JP 188580 A JP188580 A JP 188580A JP S6352796 B2 JPS6352796 B2 JP S6352796B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- plating layer
- copper
- substrate
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP188580A JPS56100497A (en) | 1980-01-11 | 1980-01-11 | Ceramic circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP188580A JPS56100497A (en) | 1980-01-11 | 1980-01-11 | Ceramic circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56100497A JPS56100497A (en) | 1981-08-12 |
| JPS6352796B2 true JPS6352796B2 (cs) | 1988-10-20 |
Family
ID=11514016
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP188580A Granted JPS56100497A (en) | 1980-01-11 | 1980-01-11 | Ceramic circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56100497A (cs) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62200219A (ja) * | 1986-02-27 | 1987-09-03 | Canon Inc | エンコ−ダ− |
| JPS62216295A (ja) * | 1986-03-17 | 1987-09-22 | 株式会社 日本ドウロ−イングコンサルタント | 両面多層プリント基板の製法 |
| JPS63126297A (ja) * | 1986-11-14 | 1988-05-30 | イビデン株式会社 | 多層プリント配線板並びにそれの製造方法と無電解めっき用絶縁剤 |
| KR100906931B1 (ko) | 1998-02-26 | 2009-07-10 | 이비덴 가부시키가이샤 | 필드 바이어 구조를 갖는 다층프린트 배선판 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DK328878A (da) * | 1977-07-26 | 1979-01-27 | Fesch Maschf Ferdinand | Laesseskovl fortrinsvis til land og skovbrug |
| JPS556823A (en) * | 1978-06-30 | 1980-01-18 | Oki Electric Ind Co Ltd | Method of manufacturing ceramic multiilayer wiring board |
-
1980
- 1980-01-11 JP JP188580A patent/JPS56100497A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS56100497A (en) | 1981-08-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4024631A (en) | Printed circuit board plating process | |
| US6563057B2 (en) | Printed circuit board and method for manufacturing same | |
| JPH023317B2 (cs) | ||
| US3143484A (en) | Method of making plated circuit boards | |
| JPS6352796B2 (cs) | ||
| JP3987781B2 (ja) | 配線基板の製造方法 | |
| EP0219122B1 (en) | Metallized ceramic substrate and method of manufacturing the same | |
| JP3066201B2 (ja) | 回路基板及びその製造方法 | |
| JPH1079568A (ja) | プリント配線板の製造方法 | |
| US3554876A (en) | Process for etching and electro plating a printed circuit | |
| JPH09270342A (ja) | 電子部品及びその製造方法 | |
| JPS60245781A (ja) | 透明導電膜パタ−ン上へのめつき方法 | |
| US4898805A (en) | Method for fabricating hybrid integrated circuit | |
| JP4730071B2 (ja) | 回路基板の製造方法 | |
| JPH04357895A (ja) | セラミック配線板の製造法 | |
| JP2614778B2 (ja) | セラミック多層回路基板の製造方法 | |
| JPH0555750A (ja) | 多層プリント配線板とその製造方法 | |
| JPS6285496A (ja) | 回路基板の製造方法 | |
| JPS5856498A (ja) | 厚膜回路基板の製造方法 | |
| JPS6194394A (ja) | 厚膜回路基板の製造方法 | |
| JPH08153954A (ja) | セラミックプリント配線板の製造方法 | |
| JPS63186492A (ja) | 回路基板の製造方法 | |
| JPH0693538B2 (ja) | セラミック配線回路板およびその製造方法 | |
| JPH03109793A (ja) | 抵抗体付配線回路基板の製造方法 | |
| JPS60110192A (ja) | プリント基板の製造方法 |