JPS6352780B2 - - Google Patents

Info

Publication number
JPS6352780B2
JPS6352780B2 JP21116181A JP21116181A JPS6352780B2 JP S6352780 B2 JPS6352780 B2 JP S6352780B2 JP 21116181 A JP21116181 A JP 21116181A JP 21116181 A JP21116181 A JP 21116181A JP S6352780 B2 JPS6352780 B2 JP S6352780B2
Authority
JP
Japan
Prior art keywords
lead frame
terminal
terminal pin
jig
pitch
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP21116181A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58115841A (ja
Inventor
Yasumasa Fukushima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP21116181A priority Critical patent/JPS58115841A/ja
Publication of JPS58115841A publication Critical patent/JPS58115841A/ja
Publication of JPS6352780B2 publication Critical patent/JPS6352780B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP21116181A 1981-12-28 1981-12-28 混成集積回路の製造方法 Granted JPS58115841A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21116181A JPS58115841A (ja) 1981-12-28 1981-12-28 混成集積回路の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21116181A JPS58115841A (ja) 1981-12-28 1981-12-28 混成集積回路の製造方法

Publications (2)

Publication Number Publication Date
JPS58115841A JPS58115841A (ja) 1983-07-09
JPS6352780B2 true JPS6352780B2 (enrdf_load_stackoverflow) 1988-10-20

Family

ID=16601402

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21116181A Granted JPS58115841A (ja) 1981-12-28 1981-12-28 混成集積回路の製造方法

Country Status (1)

Country Link
JP (1) JPS58115841A (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPS58115841A (ja) 1983-07-09

Similar Documents

Publication Publication Date Title
US4214120A (en) Electronic device package having solder leads and methods of assembling the package
US6225573B1 (en) Method for mounting terminal on circuit board and circuit board
JP2745933B2 (ja) Ｔａｂ−集積回路
FI91204B (fi) Menetelmä sähkölaitteen piirilevyjen kytkemiseksi toisiinsa sekä menetelmällä aikaansaatu kytkentä
US20120164856A1 (en) Connector and solder sheet
JPS6352780B2 (enrdf_load_stackoverflow)
JP2875443B2 (ja) 面実装型電子部品におけるリード端子の曲げ加工方法
JPH1092601A (ja) 表面実装型電子部品の端子電極とその製造方法
JPH08273798A (ja) Ｓｍｔコネクタ用コンタクトの製造方法
JPH0221114B2 (enrdf_load_stackoverflow)
JP2581811B2 (ja) クリップ式リードフレーム
JPH0983132A (ja) 回路基板用リード端子
US20240057261A1 (en) Micro solder joint and stencil aperture design
JP3001320B2 (ja) 表面実装型コネクタの実装方法
JPH07106798A (ja) 部品端子の曲がり矯正方法
JPH0125423Y2 (enrdf_load_stackoverflow)
JP2616571B2 (ja) 半導体装置の製造方法
JPH0745774A (ja) 混成集積回路装置
JPH01236592A (ja) コネクタの実装方法
JP3348596B2 (ja) 集積回路装置の製造方法
JPH08213752A (ja) 基板の接続構造
JPH081564Y2 (ja) セラミック基板回路のリード線構造
JPH0574510A (ja) 表面実装型コネクタ
JPH0440283Y2 (enrdf_load_stackoverflow)
JPS5837943A (ja) 混成集積回路の製造方法