JPS58115841A - 混成集積回路の製造方法 - Google Patents

混成集積回路の製造方法

Info

Publication number
JPS58115841A
JPS58115841A JP21116181A JP21116181A JPS58115841A JP S58115841 A JPS58115841 A JP S58115841A JP 21116181 A JP21116181 A JP 21116181A JP 21116181 A JP21116181 A JP 21116181A JP S58115841 A JPS58115841 A JP S58115841A
Authority
JP
Japan
Prior art keywords
terminal
lead frame
integrated circuit
hybrid integrated
pitch
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP21116181A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6352780B2 (enrdf_load_stackoverflow
Inventor
Yasumasa Fukushima
福島　康正
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP21116181A priority Critical patent/JPS58115841A/ja
Publication of JPS58115841A publication Critical patent/JPS58115841A/ja
Publication of JPS6352780B2 publication Critical patent/JPS6352780B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP21116181A 1981-12-28 1981-12-28 混成集積回路の製造方法 Granted JPS58115841A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21116181A JPS58115841A (ja) 1981-12-28 1981-12-28 混成集積回路の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21116181A JPS58115841A (ja) 1981-12-28 1981-12-28 混成集積回路の製造方法

Publications (2)

Publication Number Publication Date
JPS58115841A true JPS58115841A (ja) 1983-07-09
JPS6352780B2 JPS6352780B2 (enrdf_load_stackoverflow) 1988-10-20

Family

ID=16601402

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21116181A Granted JPS58115841A (ja) 1981-12-28 1981-12-28 混成集積回路の製造方法

Country Status (1)

Country Link
JP (1) JPS58115841A (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPS6352780B2 (enrdf_load_stackoverflow) 1988-10-20

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