JPS635234Y2 - - Google Patents
Info
- Publication number
- JPS635234Y2 JPS635234Y2 JP1982111254U JP11125482U JPS635234Y2 JP S635234 Y2 JPS635234 Y2 JP S635234Y2 JP 1982111254 U JP1982111254 U JP 1982111254U JP 11125482 U JP11125482 U JP 11125482U JP S635234 Y2 JPS635234 Y2 JP S635234Y2
- Authority
- JP
- Japan
- Prior art keywords
- metal layer
- lead frame
- bonding
- substrate
- supplying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 37
- 239000002184 metal Substances 0.000 claims description 34
- 239000004065 semiconductor Substances 0.000 claims description 24
- 239000000919 ceramic Substances 0.000 claims description 16
- 238000003466 welding Methods 0.000 claims description 7
- 238000005219 brazing Methods 0.000 description 11
- 239000000463 material Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 6
- 239000011521 glass Substances 0.000 description 3
- 230000010355 oscillation Effects 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11125482U JPS5916147U (ja) | 1982-07-22 | 1982-07-22 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11125482U JPS5916147U (ja) | 1982-07-22 | 1982-07-22 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5916147U JPS5916147U (ja) | 1984-01-31 |
| JPS635234Y2 true JPS635234Y2 (ko) | 1988-02-12 |
Family
ID=30258401
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11125482U Granted JPS5916147U (ja) | 1982-07-22 | 1982-07-22 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5916147U (ko) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5582456A (en) * | 1978-12-18 | 1980-06-21 | Mitsubishi Electric Corp | Semiconductor device |
-
1982
- 1982-07-22 JP JP11125482U patent/JPS5916147U/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5582456A (en) * | 1978-12-18 | 1980-06-21 | Mitsubishi Electric Corp | Semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5916147U (ja) | 1984-01-31 |
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