JPS635233Y2 - - Google Patents

Info

Publication number
JPS635233Y2
JPS635233Y2 JP1982150039U JP15003982U JPS635233Y2 JP S635233 Y2 JPS635233 Y2 JP S635233Y2 JP 1982150039 U JP1982150039 U JP 1982150039U JP 15003982 U JP15003982 U JP 15003982U JP S635233 Y2 JPS635233 Y2 JP S635233Y2
Authority
JP
Japan
Prior art keywords
semiconductor
cavity
package
semiconductor chip
conductive pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1982150039U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5954938U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1982150039U priority Critical patent/JPS5954938U/ja
Publication of JPS5954938U publication Critical patent/JPS5954938U/ja
Application granted granted Critical
Publication of JPS635233Y2 publication Critical patent/JPS635233Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16135—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/16145—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP1982150039U 1982-10-01 1982-10-01 リ−ドレスパッケ−ジの多段構造 Granted JPS5954938U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982150039U JPS5954938U (ja) 1982-10-01 1982-10-01 リ−ドレスパッケ−ジの多段構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982150039U JPS5954938U (ja) 1982-10-01 1982-10-01 リ−ドレスパッケ−ジの多段構造

Publications (2)

Publication Number Publication Date
JPS5954938U JPS5954938U (ja) 1984-04-10
JPS635233Y2 true JPS635233Y2 (enrdf_load_stackoverflow) 1988-02-12

Family

ID=30332882

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982150039U Granted JPS5954938U (ja) 1982-10-01 1982-10-01 リ−ドレスパッケ−ジの多段構造

Country Status (1)

Country Link
JP (1) JPS5954938U (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5024317B2 (ja) * 2002-03-25 2012-09-12 セイコーエプソン株式会社 電子部品および電子部品の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59133B2 (ja) * 1979-12-21 1984-01-05 富士通株式会社 マルチチップ式半導体パッケ−ジ
JPS592146U (ja) * 1982-06-28 1984-01-09 富士通株式会社 電子部品パツケ−ジ

Also Published As

Publication number Publication date
JPS5954938U (ja) 1984-04-10

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