JPS6351539B2 - - Google Patents
Info
- Publication number
- JPS6351539B2 JPS6351539B2 JP4688083A JP4688083A JPS6351539B2 JP S6351539 B2 JPS6351539 B2 JP S6351539B2 JP 4688083 A JP4688083 A JP 4688083A JP 4688083 A JP4688083 A JP 4688083A JP S6351539 B2 JPS6351539 B2 JP S6351539B2
- Authority
- JP
- Japan
- Prior art keywords
- outer ring
- lead wire
- glass
- section
- metal outer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
- H01L23/055—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads having a passage through the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Common Detailed Techniques For Electron Tubes Or Discharge Tubes (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4688083A JPS59172255A (ja) | 1983-03-19 | 1983-03-19 | ア−スリ−ド線を有する気密端子およびその製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4688083A JPS59172255A (ja) | 1983-03-19 | 1983-03-19 | ア−スリ−ド線を有する気密端子およびその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59172255A JPS59172255A (ja) | 1984-09-28 |
JPS6351539B2 true JPS6351539B2 (enrdf_load_stackoverflow) | 1988-10-14 |
Family
ID=12759666
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4688083A Granted JPS59172255A (ja) | 1983-03-19 | 1983-03-19 | ア−スリ−ド線を有する気密端子およびその製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59172255A (enrdf_load_stackoverflow) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109205246B (zh) * | 2018-06-22 | 2020-03-27 | 安徽长江紧固件有限责任公司 | 一种焊钉生产线 |
-
1983
- 1983-03-19 JP JP4688083A patent/JPS59172255A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS59172255A (ja) | 1984-09-28 |
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