JPS6351539B2 - - Google Patents

Info

Publication number
JPS6351539B2
JPS6351539B2 JP4688083A JP4688083A JPS6351539B2 JP S6351539 B2 JPS6351539 B2 JP S6351539B2 JP 4688083 A JP4688083 A JP 4688083A JP 4688083 A JP4688083 A JP 4688083A JP S6351539 B2 JPS6351539 B2 JP S6351539B2
Authority
JP
Japan
Prior art keywords
outer ring
lead wire
glass
section
metal outer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP4688083A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59172255A (ja
Inventor
Masahiko Takahashi
Hiroaki Muraishi
Koji Hirabayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP4688083A priority Critical patent/JPS59172255A/ja
Publication of JPS59172255A publication Critical patent/JPS59172255A/ja
Publication of JPS6351539B2 publication Critical patent/JPS6351539B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/055—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads having a passage through the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Connections Arranged To Contact A Plurality Of Conductors (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Common Detailed Techniques For Electron Tubes Or Discharge Tubes (AREA)
JP4688083A 1983-03-19 1983-03-19 ア−スリ−ド線を有する気密端子およびその製造方法 Granted JPS59172255A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4688083A JPS59172255A (ja) 1983-03-19 1983-03-19 ア−スリ−ド線を有する気密端子およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4688083A JPS59172255A (ja) 1983-03-19 1983-03-19 ア−スリ−ド線を有する気密端子およびその製造方法

Publications (2)

Publication Number Publication Date
JPS59172255A JPS59172255A (ja) 1984-09-28
JPS6351539B2 true JPS6351539B2 (enrdf_load_stackoverflow) 1988-10-14

Family

ID=12759666

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4688083A Granted JPS59172255A (ja) 1983-03-19 1983-03-19 ア−スリ−ド線を有する気密端子およびその製造方法

Country Status (1)

Country Link
JP (1) JPS59172255A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109205246B (zh) * 2018-06-22 2020-03-27 安徽长江紧固件有限责任公司 一种焊钉生产线

Also Published As

Publication number Publication date
JPS59172255A (ja) 1984-09-28

Similar Documents

Publication Publication Date Title
GB881832A (en) Improvements in or relating to the bonding of metals to bodies comprising semiconductive or brittle materials
JPS6351539B2 (enrdf_load_stackoverflow)
JPS5940312B2 (ja) 光半導体用レンズキヤツプの製造方法
JPH01239958A (ja) 気密封止型半導体素子
JPH02270303A (ja) ガラス封止型サーミスタの製造法
JP4144826B2 (ja) 半導体装置用のシールリングとそれを用いた半導体装置の製造方法
JPS588586B2 (ja) 半導体装置の封止方法
JPS6031263Y2 (ja) 金属キヤツプ封止形半導体装置
JPS6011466B2 (ja) 樹脂封止形半導体装置
JPS6032775Y2 (ja) 気密端子
JPS5915080Y2 (ja) 半導体装置
KR960009066Y1 (ko) 탄탈 콘덴서의 리드 프레임의 접착 구조
JPS63122250A (ja) 半導体装置
JPS642447Y2 (enrdf_load_stackoverflow)
JP2649544B2 (ja) 酸化亜鉛型バリスタ
KR830000962B1 (ko) 기밀단자(氣密端子)
KR830002575B1 (ko) 기밀단자(氣密端子)의 제조방법
JPS5842764A (ja) メツキ方法
JPH01110767A (ja) 固体撮像装置
JPH0455336B2 (enrdf_load_stackoverflow)
JPS6317256Y2 (enrdf_load_stackoverflow)
JPS6225899Y2 (enrdf_load_stackoverflow)
JPS60161640A (ja) 半導体装置
JP2001015666A (ja) 半導体装置及びその製造方法
JPS5981878A (ja) 気密端子およびその製造方法