JPS6350860Y2 - - Google Patents
Info
- Publication number
- JPS6350860Y2 JPS6350860Y2 JP1980086365U JP8636580U JPS6350860Y2 JP S6350860 Y2 JPS6350860 Y2 JP S6350860Y2 JP 1980086365 U JP1980086365 U JP 1980086365U JP 8636580 U JP8636580 U JP 8636580U JP S6350860 Y2 JPS6350860 Y2 JP S6350860Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- lead wire
- hole
- lead wires
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 10
- 238000000034 method Methods 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980086365U JPS6350860Y2 (US06818201-20041116-C00086.png) | 1980-06-20 | 1980-06-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980086365U JPS6350860Y2 (US06818201-20041116-C00086.png) | 1980-06-20 | 1980-06-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5710758U JPS5710758U (US06818201-20041116-C00086.png) | 1982-01-20 |
| JPS6350860Y2 true JPS6350860Y2 (US06818201-20041116-C00086.png) | 1988-12-27 |
Family
ID=29448557
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1980086365U Expired JPS6350860Y2 (US06818201-20041116-C00086.png) | 1980-06-20 | 1980-06-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6350860Y2 (US06818201-20041116-C00086.png) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0724782B2 (ja) * | 1984-10-19 | 1995-03-22 | 惣一 山本 | 籾摺機における自動供給制御装置 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5037863A (US06818201-20041116-C00086.png) * | 1973-08-07 | 1975-04-08 | ||
| JPS53123874A (en) * | 1977-04-05 | 1978-10-28 | Matsushita Electric Ind Co Ltd | Method of soldering printed board |
| JPS5537262B2 (US06818201-20041116-C00086.png) * | 1977-03-28 | 1980-09-26 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5537262U (US06818201-20041116-C00086.png) * | 1978-09-01 | 1980-03-10 | ||
| JPS5558073U (US06818201-20041116-C00086.png) * | 1978-10-16 | 1980-04-19 |
-
1980
- 1980-06-20 JP JP1980086365U patent/JPS6350860Y2/ja not_active Expired
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5037863A (US06818201-20041116-C00086.png) * | 1973-08-07 | 1975-04-08 | ||
| JPS5537262B2 (US06818201-20041116-C00086.png) * | 1977-03-28 | 1980-09-26 | ||
| JPS53123874A (en) * | 1977-04-05 | 1978-10-28 | Matsushita Electric Ind Co Ltd | Method of soldering printed board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5710758U (US06818201-20041116-C00086.png) | 1982-01-20 |
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