JPS6350850B2 - - Google Patents

Info

Publication number
JPS6350850B2
JPS6350850B2 JP58139043A JP13904383A JPS6350850B2 JP S6350850 B2 JPS6350850 B2 JP S6350850B2 JP 58139043 A JP58139043 A JP 58139043A JP 13904383 A JP13904383 A JP 13904383A JP S6350850 B2 JPS6350850 B2 JP S6350850B2
Authority
JP
Japan
Prior art keywords
region
lead frame
electrolytic capacitor
lead
core material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58139043A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6030118A (ja
Inventor
Tooru Imaharu
Tatsuo Tsutsui
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Chemi Con Corp
Original Assignee
Nippon Chemi Con Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Chemi Con Corp filed Critical Nippon Chemi Con Corp
Priority to JP13904383A priority Critical patent/JPS6030118A/ja
Publication of JPS6030118A publication Critical patent/JPS6030118A/ja
Publication of JPS6350850B2 publication Critical patent/JPS6350850B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP13904383A 1983-07-28 1983-07-28 電解コンデンサ Granted JPS6030118A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13904383A JPS6030118A (ja) 1983-07-28 1983-07-28 電解コンデンサ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13904383A JPS6030118A (ja) 1983-07-28 1983-07-28 電解コンデンサ

Publications (2)

Publication Number Publication Date
JPS6030118A JPS6030118A (ja) 1985-02-15
JPS6350850B2 true JPS6350850B2 (en, 2012) 1988-10-12

Family

ID=15236119

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13904383A Granted JPS6030118A (ja) 1983-07-28 1983-07-28 電解コンデンサ

Country Status (1)

Country Link
JP (1) JPS6030118A (en, 2012)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0229775A (ja) * 1988-06-10 1990-01-31 Arysearch Arylan Ag 硬貨、メダル等の安全ケース
JPH0396333U (en, 2012) * 1990-01-23 1991-10-02

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5724655B2 (en, 2012) * 1972-05-24 1982-05-25
JPS5151281A (en, 2012) * 1974-10-31 1976-05-06 Tokyo Shibaura Electric Co
JPS6050343B2 (ja) * 1980-03-03 1985-11-08 新光電気工業株式会社 半導体装置製造用リ−ドフレ−ム

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0229775A (ja) * 1988-06-10 1990-01-31 Arysearch Arylan Ag 硬貨、メダル等の安全ケース
JPH0396333U (en, 2012) * 1990-01-23 1991-10-02

Also Published As

Publication number Publication date
JPS6030118A (ja) 1985-02-15

Similar Documents

Publication Publication Date Title
JP2552822B2 (ja) 半導体パッケージおよびその製造方法
US8081421B2 (en) Solid electrolytic capacitor
US6294826B1 (en) Molded electronic component having pre-plated lead terminals and manufacturing process thereof
US20090147447A1 (en) Solid electrolytic capacitor
JPS6350850B2 (en, 2012)
JPS6160570B2 (en, 2012)
JPH0528752Y2 (en, 2012)
JP2583353B2 (ja) 半導体装置用リードフレーム
JP2596542B2 (ja) リードフレームおよびそれを用いた半導体装置
JPS6097654A (ja) 封止型半導体装置
JPS60241241A (ja) 半導体装置
JP2927196B2 (ja) チップ型電子部品及びその製造方法
JPS624860B2 (en, 2012)
JPS6057692B2 (ja) チツプ型固体電解コンデンサおよびその製造方法
JP2620243B2 (ja) 樹脂封止半導体装置
JPS6030117A (ja) 電解コンデンサ
JPH04162466A (ja) 半導体装置用リードフレーム
JPH1092998A (ja) 電子デバイス製造用リードフレーム
JPS5863126A (ja) チップ形電解コンデンサの製造方法
JPH04208510A (ja) チップ型電子部品
JPH0115165Y2 (en, 2012)
JP2906468B2 (ja) ヒューズを内蔵したチップ型固体電解コンデンサの製造方法
JP2001015666A (ja) 半導体装置及びその製造方法
JPH03225944A (ja) 半導体装置
KR980012328A (ko) 패키지 제조 방법