JPS6030118A - 電解コンデンサ - Google Patents
電解コンデンサInfo
- Publication number
- JPS6030118A JPS6030118A JP13904383A JP13904383A JPS6030118A JP S6030118 A JPS6030118 A JP S6030118A JP 13904383 A JP13904383 A JP 13904383A JP 13904383 A JP13904383 A JP 13904383A JP S6030118 A JPS6030118 A JP S6030118A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- region
- lead
- core material
- metal layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052751 metal Inorganic materials 0.000 claims description 20
- 239000002184 metal Substances 0.000 claims description 20
- 239000011162 core material Substances 0.000 claims description 14
- 229910052782 aluminium Inorganic materials 0.000 claims description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 10
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 239000011888 foil Substances 0.000 claims 2
- 239000003990 capacitor Substances 0.000 description 17
- 239000010410 layer Substances 0.000 description 16
- 238000004519 manufacturing process Methods 0.000 description 10
- 238000007747 plating Methods 0.000 description 9
- 239000000463 material Substances 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 239000008151 electrolyte solution Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229920003002 synthetic resin Polymers 0.000 description 4
- 239000000057 synthetic resin Substances 0.000 description 4
- 238000005476 soldering Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13904383A JPS6030118A (ja) | 1983-07-28 | 1983-07-28 | 電解コンデンサ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13904383A JPS6030118A (ja) | 1983-07-28 | 1983-07-28 | 電解コンデンサ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6030118A true JPS6030118A (ja) | 1985-02-15 |
| JPS6350850B2 JPS6350850B2 (en, 2012) | 1988-10-12 |
Family
ID=15236119
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13904383A Granted JPS6030118A (ja) | 1983-07-28 | 1983-07-28 | 電解コンデンサ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6030118A (en, 2012) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH674639A5 (en, 2012) * | 1988-06-10 | 1990-06-29 | Arysearch Arylan Ag | |
| JPH0396333U (en, 2012) * | 1990-01-23 | 1991-10-02 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4910672A (en, 2012) * | 1972-05-24 | 1974-01-30 | ||
| JPS5151281A (en, 2012) * | 1974-10-31 | 1976-05-06 | Tokyo Shibaura Electric Co | |
| JPS56122156A (en) * | 1980-03-03 | 1981-09-25 | Shinko Electric Ind Co Ltd | Lead frame for semiconductor device |
-
1983
- 1983-07-28 JP JP13904383A patent/JPS6030118A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4910672A (en, 2012) * | 1972-05-24 | 1974-01-30 | ||
| JPS5151281A (en, 2012) * | 1974-10-31 | 1976-05-06 | Tokyo Shibaura Electric Co | |
| JPS56122156A (en) * | 1980-03-03 | 1981-09-25 | Shinko Electric Ind Co Ltd | Lead frame for semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6350850B2 (en, 2012) | 1988-10-12 |
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