JPS63501995A - マイクロミニチュア装置の圧接接続端子の製造方法 - Google Patents

マイクロミニチュア装置の圧接接続端子の製造方法

Info

Publication number
JPS63501995A
JPS63501995A JP62500235A JP50023587A JPS63501995A JP S63501995 A JPS63501995 A JP S63501995A JP 62500235 A JP62500235 A JP 62500235A JP 50023587 A JP50023587 A JP 50023587A JP S63501995 A JPS63501995 A JP S63501995A
Authority
JP
Japan
Prior art keywords
chip
mesa
substrate
connections
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62500235A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0553301B2 (cg-RX-API-DMAC10.html
Inventor
パトラウ，ニルス・イー
Original Assignee
ヒユ−ズ・エアクラフト・カンパニ−
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ヒユ−ズ・エアクラフト・カンパニ− filed Critical ヒユ−ズ・エアクラフト・カンパニ−
Publication of JPS63501995A publication Critical patent/JPS63501995A/ja
Publication of JPH0553301B2 publication Critical patent/JPH0553301B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/05—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
    • H10W72/00—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H10W72/0711—
    • H10W72/07141—
    • H10W72/07178—
    • H10W72/07236—
    • H10W72/5524—

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Multi-Conductor Connections (AREA)
JP62500235A 1985-12-20 1986-11-24 マイクロミニチュア装置の圧接接続端子の製造方法 Granted JPS63501995A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US81156085A 1985-12-20 1985-12-20
US811,560 1985-12-20

Publications (2)

Publication Number Publication Date
JPS63501995A true JPS63501995A (ja) 1988-08-04
JPH0553301B2 JPH0553301B2 (cg-RX-API-DMAC10.html) 1993-08-09

Family

ID=25206887

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62500235A Granted JPS63501995A (ja) 1985-12-20 1986-11-24 マイクロミニチュア装置の圧接接続端子の製造方法

Country Status (8)

Country Link
EP (1) EP0252115B1 (cg-RX-API-DMAC10.html)
JP (1) JPS63501995A (cg-RX-API-DMAC10.html)
KR (1) KR900005147B1 (cg-RX-API-DMAC10.html)
DE (1) DE3680336D1 (cg-RX-API-DMAC10.html)
ES (1) ES2002935A6 (cg-RX-API-DMAC10.html)
IL (1) IL80785A (cg-RX-API-DMAC10.html)
TR (1) TR22767A (cg-RX-API-DMAC10.html)
WO (1) WO1987004009A1 (cg-RX-API-DMAC10.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023530946A (ja) * 2020-07-02 2023-07-20 インターナショナル・ビジネス・マシーンズ・コーポレーション 高速高周波パッケージ

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5047830A (en) * 1990-05-22 1991-09-10 Amp Incorporated Field emitter array integrated circuit chip interconnection
JP3002512B2 (ja) * 1990-09-10 2000-01-24 株式会社日立製作所 集積回路装置
US5345365A (en) * 1992-05-05 1994-09-06 Massachusetts Institute Of Technology Interconnection system for high performance electronic hybrids
DE4417586A1 (de) * 1993-08-03 1995-02-09 Hewlett Packard Co Familie von demontierbaren Hybridanordnungen unterschiedlicher Größe mit Mikrowellenbandbreitenverbindern
US6840777B2 (en) * 2000-11-30 2005-01-11 Intel Corporation Solderless electronics packaging
EP4261872A1 (en) * 2022-04-11 2023-10-18 Nexperia B.V. Molded electronic package with an electronic component encapsulated between two substrates with a spring member between the electronic component and one of the substrates and method for manufacturing the same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58110778A (ja) * 1981-12-23 1983-07-01 ワイケイケイ株式会社 自動開閉扉の制御装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1021066A (en) * 1974-10-17 1977-11-15 James B. Morris (Sr.) Semiconductor chip interconnect package
US4070688A (en) * 1976-12-27 1978-01-24 International Rectifier Corporation Flexible lead
FR2471048A1 (fr) * 1979-12-07 1981-06-12 Silicium Semiconducteur Ssc Structure et procede de montage d'un composant semi-conducteur principal et d'un circuit auxiliaire

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58110778A (ja) * 1981-12-23 1983-07-01 ワイケイケイ株式会社 自動開閉扉の制御装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023530946A (ja) * 2020-07-02 2023-07-20 インターナショナル・ビジネス・マシーンズ・コーポレーション 高速高周波パッケージ

Also Published As

Publication number Publication date
DE3680336D1 (de) 1991-08-22
WO1987004009A1 (en) 1987-07-02
KR880701021A (ko) 1988-04-13
IL80785A0 (en) 1987-02-27
ES2002935A6 (es) 1988-10-01
EP0252115B1 (en) 1991-07-17
KR900005147B1 (ko) 1990-07-20
TR22767A (tr) 1988-07-01
JPH0553301B2 (cg-RX-API-DMAC10.html) 1993-08-09
EP0252115A1 (en) 1988-01-13
IL80785A (en) 1994-05-30

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