DE3680336D1 - Zusammenpressender sockel fuer mikro-verbindungen. - Google Patents

Zusammenpressender sockel fuer mikro-verbindungen.

Info

Publication number
DE3680336D1
DE3680336D1 DE8787900397T DE3680336T DE3680336D1 DE 3680336 D1 DE3680336 D1 DE 3680336D1 DE 8787900397 T DE8787900397 T DE 8787900397T DE 3680336 T DE3680336 T DE 3680336T DE 3680336 D1 DE3680336 D1 DE 3680336D1
Authority
DE
Germany
Prior art keywords
compressive
socket
micro connections
connections
micro
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8787900397T
Other languages
German (de)
English (en)
Inventor
E Patraw
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raytheon Co
Original Assignee
Hughes Aircraft Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hughes Aircraft Co filed Critical Hughes Aircraft Co
Application granted granted Critical
Publication of DE3680336D1 publication Critical patent/DE3680336D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H10W70/05—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
    • H10W72/00—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H10W72/0711—
    • H10W72/07141—
    • H10W72/07178—
    • H10W72/07236—
    • H10W72/5524—

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Multi-Conductor Connections (AREA)
DE8787900397T 1985-12-20 1986-11-24 Zusammenpressender sockel fuer mikro-verbindungen. Expired - Fee Related DE3680336D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US81156085A 1985-12-20 1985-12-20
PCT/US1986/002509 WO1987004009A1 (en) 1985-12-20 1986-11-24 Compressive pedestal for microminiature connections

Publications (1)

Publication Number Publication Date
DE3680336D1 true DE3680336D1 (de) 1991-08-22

Family

ID=25206887

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8787900397T Expired - Fee Related DE3680336D1 (de) 1985-12-20 1986-11-24 Zusammenpressender sockel fuer mikro-verbindungen.

Country Status (8)

Country Link
EP (1) EP0252115B1 (cg-RX-API-DMAC10.html)
JP (1) JPS63501995A (cg-RX-API-DMAC10.html)
KR (1) KR900005147B1 (cg-RX-API-DMAC10.html)
DE (1) DE3680336D1 (cg-RX-API-DMAC10.html)
ES (1) ES2002935A6 (cg-RX-API-DMAC10.html)
IL (1) IL80785A (cg-RX-API-DMAC10.html)
TR (1) TR22767A (cg-RX-API-DMAC10.html)
WO (1) WO1987004009A1 (cg-RX-API-DMAC10.html)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5047830A (en) * 1990-05-22 1991-09-10 Amp Incorporated Field emitter array integrated circuit chip interconnection
JP3002512B2 (ja) * 1990-09-10 2000-01-24 株式会社日立製作所 集積回路装置
US5345365A (en) * 1992-05-05 1994-09-06 Massachusetts Institute Of Technology Interconnection system for high performance electronic hybrids
DE4417586A1 (de) * 1993-08-03 1995-02-09 Hewlett Packard Co Familie von demontierbaren Hybridanordnungen unterschiedlicher Größe mit Mikrowellenbandbreitenverbindern
US6840777B2 (en) * 2000-11-30 2005-01-11 Intel Corporation Solderless electronics packaging
US11152707B1 (en) * 2020-07-02 2021-10-19 International Business Machines Corporation Fast radio frequency package
EP4261872A1 (en) * 2022-04-11 2023-10-18 Nexperia B.V. Molded electronic package with an electronic component encapsulated between two substrates with a spring member between the electronic component and one of the substrates and method for manufacturing the same

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1021066A (en) * 1974-10-17 1977-11-15 James B. Morris (Sr.) Semiconductor chip interconnect package
US4070688A (en) * 1976-12-27 1978-01-24 International Rectifier Corporation Flexible lead
FR2471048A1 (fr) * 1979-12-07 1981-06-12 Silicium Semiconducteur Ssc Structure et procede de montage d'un composant semi-conducteur principal et d'un circuit auxiliaire
JPS58110778A (ja) * 1981-12-23 1983-07-01 ワイケイケイ株式会社 自動開閉扉の制御装置

Also Published As

Publication number Publication date
TR22767A (tr) 1988-07-01
EP0252115A1 (en) 1988-01-13
JPH0553301B2 (cg-RX-API-DMAC10.html) 1993-08-09
KR880701021A (ko) 1988-04-13
WO1987004009A1 (en) 1987-07-02
JPS63501995A (ja) 1988-08-04
IL80785A (en) 1994-05-30
ES2002935A6 (es) 1988-10-01
IL80785A0 (en) 1987-02-27
KR900005147B1 (ko) 1990-07-20
EP0252115B1 (en) 1991-07-17

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee