ES2002935A6 - Un metodo para hacer un miembro conectivo microelectronico elastico - Google Patents
Un metodo para hacer un miembro conectivo microelectronico elasticoInfo
- Publication number
- ES2002935A6 ES2002935A6 ES8603460A ES8603460A ES2002935A6 ES 2002935 A6 ES2002935 A6 ES 2002935A6 ES 8603460 A ES8603460 A ES 8603460A ES 8603460 A ES8603460 A ES 8603460A ES 2002935 A6 ES2002935 A6 ES 2002935A6
- Authority
- ES
- Spain
- Prior art keywords
- chip
- microelectronic
- elastic
- make
- connective member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W70/05—
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
-
- H10W72/00—
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
-
- H10W72/0711—
-
- H10W72/07141—
-
- H10W72/07178—
-
- H10W72/07236—
-
- H10W72/5524—
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Wire Bonding (AREA)
- Semiconductor Integrated Circuits (AREA)
- Multi-Conductor Connections (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US81156085A | 1985-12-20 | 1985-12-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ES2002935A6 true ES2002935A6 (es) | 1988-10-01 |
Family
ID=25206887
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES8603460A Expired ES2002935A6 (es) | 1985-12-20 | 1986-12-17 | Un metodo para hacer un miembro conectivo microelectronico elastico |
Country Status (8)
| Country | Link |
|---|---|
| EP (1) | EP0252115B1 (cg-RX-API-DMAC10.html) |
| JP (1) | JPS63501995A (cg-RX-API-DMAC10.html) |
| KR (1) | KR900005147B1 (cg-RX-API-DMAC10.html) |
| DE (1) | DE3680336D1 (cg-RX-API-DMAC10.html) |
| ES (1) | ES2002935A6 (cg-RX-API-DMAC10.html) |
| IL (1) | IL80785A (cg-RX-API-DMAC10.html) |
| TR (1) | TR22767A (cg-RX-API-DMAC10.html) |
| WO (1) | WO1987004009A1 (cg-RX-API-DMAC10.html) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5047830A (en) * | 1990-05-22 | 1991-09-10 | Amp Incorporated | Field emitter array integrated circuit chip interconnection |
| JP3002512B2 (ja) * | 1990-09-10 | 2000-01-24 | 株式会社日立製作所 | 集積回路装置 |
| US5345365A (en) * | 1992-05-05 | 1994-09-06 | Massachusetts Institute Of Technology | Interconnection system for high performance electronic hybrids |
| DE4417586A1 (de) * | 1993-08-03 | 1995-02-09 | Hewlett Packard Co | Familie von demontierbaren Hybridanordnungen unterschiedlicher Größe mit Mikrowellenbandbreitenverbindern |
| US6840777B2 (en) * | 2000-11-30 | 2005-01-11 | Intel Corporation | Solderless electronics packaging |
| US11152707B1 (en) * | 2020-07-02 | 2021-10-19 | International Business Machines Corporation | Fast radio frequency package |
| EP4261872A1 (en) * | 2022-04-11 | 2023-10-18 | Nexperia B.V. | Molded electronic package with an electronic component encapsulated between two substrates with a spring member between the electronic component and one of the substrates and method for manufacturing the same |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA1021066A (en) * | 1974-10-17 | 1977-11-15 | James B. Morris (Sr.) | Semiconductor chip interconnect package |
| US4070688A (en) * | 1976-12-27 | 1978-01-24 | International Rectifier Corporation | Flexible lead |
| FR2471048A1 (fr) * | 1979-12-07 | 1981-06-12 | Silicium Semiconducteur Ssc | Structure et procede de montage d'un composant semi-conducteur principal et d'un circuit auxiliaire |
| JPS58110778A (ja) * | 1981-12-23 | 1983-07-01 | ワイケイケイ株式会社 | 自動開閉扉の制御装置 |
-
1986
- 1986-11-24 EP EP87900397A patent/EP0252115B1/en not_active Expired - Lifetime
- 1986-11-24 JP JP62500235A patent/JPS63501995A/ja active Granted
- 1986-11-24 DE DE8787900397T patent/DE3680336D1/de not_active Expired - Fee Related
- 1986-11-24 KR KR1019870700749A patent/KR900005147B1/ko not_active Expired
- 1986-11-24 WO PCT/US1986/002509 patent/WO1987004009A1/en not_active Ceased
- 1986-11-26 IL IL8078586A patent/IL80785A/en not_active IP Right Cessation
- 1986-12-12 TR TR690/86A patent/TR22767A/xx unknown
- 1986-12-17 ES ES8603460A patent/ES2002935A6/es not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| DE3680336D1 (de) | 1991-08-22 |
| WO1987004009A1 (en) | 1987-07-02 |
| KR880701021A (ko) | 1988-04-13 |
| IL80785A0 (en) | 1987-02-27 |
| JPS63501995A (ja) | 1988-08-04 |
| EP0252115B1 (en) | 1991-07-17 |
| KR900005147B1 (ko) | 1990-07-20 |
| TR22767A (tr) | 1988-07-01 |
| JPH0553301B2 (cg-RX-API-DMAC10.html) | 1993-08-09 |
| EP0252115A1 (en) | 1988-01-13 |
| IL80785A (en) | 1994-05-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| IL80875A (en) | Inverted chip carrier | |
| TW429560B (en) | Heatspreader for a flip chip device, and method for connecting the heatspreader | |
| SE9604690L (sv) | Packningsanordning för integrerade kretsar | |
| JPS5639075B2 (cg-RX-API-DMAC10.html) | ||
| IT1182219B (it) | Perfezionamento nei moduli di circuiti integrati ad alta densita' e procedimento di fabbricazione | |
| MY120988A (en) | Hybrid wiring board, semiconductor apparatus, flexible substrate, and fabrication method of hybrid wiring board | |
| DK1353374T3 (da) | Halvlederchipenhed og fremgangsmåde til fremstilling deraf | |
| EP0218438A3 (en) | Apparatus for mounting a semiconductor chip and making electrical connections thereto | |
| TW428258B (en) | Semiconductor device with connection terminals in the form of a grid array | |
| KR930001365A (ko) | 복합 플립 칩 반도체 소자와 그 제조 및 번-인(burning-in) 방법 | |
| DE3869761D1 (de) | Gleichrichtereinrichtung. | |
| EP0890989A4 (en) | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD | |
| DK0688473T3 (da) | Elektrisk højfrekvenskonnektor | |
| EP0473796A4 (en) | Semiconductor device having a plurality of chips | |
| GB2140205B (en) | Integrated circuit module and method of making same | |
| SE8703944L (sv) | Kompakt elektrisk kopplingsanordning | |
| GB2289985B (en) | Method of connecting the output pads on an integrated circuit chip,and multichip module thus obtained | |
| EP0721209A3 (en) | Method of testing semiconductor devices and conductive adhesive thereby used | |
| MY112126A (en) | Socket | |
| EP0330372A3 (en) | Hybrid ic with heat sink | |
| FI872004A0 (fi) | System foer loestagbar montering av halvledare pao ett ledarunderlag. | |
| ES2002935A6 (es) | Un metodo para hacer un miembro conectivo microelectronico elastico | |
| GB2083285A (en) | Over/under dual in-line chip package | |
| TW360997B (en) | A substrate edge connector | |
| JPS5732661A (en) | Module of semiconductor element having high density |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| SA6 | Expiration date (snapshot 920101) |
Free format text: 2006-12-17 |
|
| FD1A | Patent lapsed |
Effective date: 20010402 |