ES2002935A6 - Un metodo para hacer un miembro conectivo microelectronico elastico - Google Patents
Un metodo para hacer un miembro conectivo microelectronico elasticoInfo
- Publication number
- ES2002935A6 ES2002935A6 ES8603460A ES8603460A ES2002935A6 ES 2002935 A6 ES2002935 A6 ES 2002935A6 ES 8603460 A ES8603460 A ES 8603460A ES 8603460 A ES8603460 A ES 8603460A ES 2002935 A6 ES2002935 A6 ES 2002935A6
- Authority
- ES
- Spain
- Prior art keywords
- chip
- compressive
- interconnections
- microminiature
- connections
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 title 1
- 238000000034 method Methods 0.000 abstract 1
- 238000004377 microelectronic Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
- H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
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- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/45124—Aluminium (Al) as principal constituent
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- H01L2224/7525—Means for applying energy, e.g. heating means
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- H01L2224/757—Means for aligning
- H01L2224/75754—Guiding structures
- H01L2224/75756—Guiding structures in the upper part of the bonding apparatus, e.g. in the bonding head
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- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
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- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H01L2924/0105—Tin [Sn]
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- H01L2924/01052—Tellurium [Te]
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- H01L2924/01068—Erbium [Er]
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- H01L2924/01079—Gold [Au]
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- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
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- H01L2924/014—Solder alloys
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
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- H01L2924/14—Integrated circuits
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
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- H01L2924/30107—Inductance
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Wire Bonding (AREA)
- Semiconductor Integrated Circuits (AREA)
- Multi-Conductor Connections (AREA)
Abstract
SE REVELA UN APARATO PARA PROPORCIONAR INTERCONEXIONES MICROELECTRONICAS, DENTRO DE PASTILLA (<CHIP>) Y ENTRE PASTILLAS, EN UNA CONFIGURACION ULTRADENSA DE CIRCUITOS INTEGRADOS. SE USAN UNOS PEDESTALES COMPRESIVOS (20) PARA FORMAR INTERCONEXIONES ELECTRICAS Y MECANICAS DE ACCION DE RESORTE CON UNOS TERMINALES CONDUCTIVOS DE UN CONJUNTO (20) DE PASTILLA Y MESA DE INTERFAZ DE PASTILLA, A FIN DE FORMAR UNA GRAN AGRUPACION (23) DE MULTITUD DE PASTILLAS SOBRE UN SUSTRATO DE INTERCONEXION (24). TAMBIEN SE REVELAN METODOS PARA FABRICAR LOS PEDESTALES COMPRESIVOS (20).
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US81156085A | 1985-12-20 | 1985-12-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2002935A6 true ES2002935A6 (es) | 1988-10-01 |
Family
ID=25206887
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES8603460A Expired ES2002935A6 (es) | 1985-12-20 | 1986-12-17 | Un metodo para hacer un miembro conectivo microelectronico elastico |
Country Status (8)
Country | Link |
---|---|
EP (1) | EP0252115B1 (es) |
JP (1) | JPS63501995A (es) |
KR (1) | KR900005147B1 (es) |
DE (1) | DE3680336D1 (es) |
ES (1) | ES2002935A6 (es) |
IL (1) | IL80785A (es) |
TR (1) | TR22767A (es) |
WO (1) | WO1987004009A1 (es) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5047830A (en) * | 1990-05-22 | 1991-09-10 | Amp Incorporated | Field emitter array integrated circuit chip interconnection |
JP3002512B2 (ja) * | 1990-09-10 | 2000-01-24 | 株式会社日立製作所 | 集積回路装置 |
US5345365A (en) * | 1992-05-05 | 1994-09-06 | Massachusetts Institute Of Technology | Interconnection system for high performance electronic hybrids |
DE4417586A1 (de) * | 1993-08-03 | 1995-02-09 | Hewlett Packard Co | Familie von demontierbaren Hybridanordnungen unterschiedlicher Größe mit Mikrowellenbandbreitenverbindern |
US6840777B2 (en) * | 2000-11-30 | 2005-01-11 | Intel Corporation | Solderless electronics packaging |
EP4261872A1 (en) * | 2022-04-11 | 2023-10-18 | Nexperia B.V. | Molded electronic package with an electronic component encapsulated between two substrates with a spring member between the electronic component and one of the substrates and method for manufacturing the same |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA1021066A (en) * | 1974-10-17 | 1977-11-15 | James B. Morris (Sr.) | Semiconductor chip interconnect package |
US4070688A (en) * | 1976-12-27 | 1978-01-24 | International Rectifier Corporation | Flexible lead |
FR2471048A1 (fr) * | 1979-12-07 | 1981-06-12 | Silicium Semiconducteur Ssc | Structure et procede de montage d'un composant semi-conducteur principal et d'un circuit auxiliaire |
JPS58110778A (ja) * | 1981-12-23 | 1983-07-01 | ワイケイケイ株式会社 | 自動開閉扉の制御装置 |
-
1986
- 1986-11-24 EP EP87900397A patent/EP0252115B1/en not_active Expired - Lifetime
- 1986-11-24 DE DE8787900397T patent/DE3680336D1/de not_active Expired - Fee Related
- 1986-11-24 JP JP62500235A patent/JPS63501995A/ja active Granted
- 1986-11-24 KR KR1019870700749A patent/KR900005147B1/ko not_active IP Right Cessation
- 1986-11-24 WO PCT/US1986/002509 patent/WO1987004009A1/en active IP Right Grant
- 1986-11-26 IL IL8078586A patent/IL80785A/en not_active IP Right Cessation
- 1986-12-12 TR TR690/86A patent/TR22767A/xx unknown
- 1986-12-17 ES ES8603460A patent/ES2002935A6/es not_active Expired
Also Published As
Publication number | Publication date |
---|---|
DE3680336D1 (de) | 1991-08-22 |
IL80785A (en) | 1994-05-30 |
KR880701021A (ko) | 1988-04-13 |
EP0252115B1 (en) | 1991-07-17 |
JPH0553301B2 (es) | 1993-08-09 |
KR900005147B1 (ko) | 1990-07-20 |
JPS63501995A (ja) | 1988-08-04 |
TR22767A (tr) | 1988-07-01 |
WO1987004009A1 (en) | 1987-07-02 |
EP0252115A1 (en) | 1988-01-13 |
IL80785A0 (en) | 1987-02-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
SA6 | Expiration date (snapshot 920101) |
Free format text: 2006-12-17 |
|
FD1A | Patent lapsed |
Effective date: 20010402 |