JPS634955B2 - - Google Patents

Info

Publication number
JPS634955B2
JPS634955B2 JP57001072A JP107282A JPS634955B2 JP S634955 B2 JPS634955 B2 JP S634955B2 JP 57001072 A JP57001072 A JP 57001072A JP 107282 A JP107282 A JP 107282A JP S634955 B2 JPS634955 B2 JP S634955B2
Authority
JP
Japan
Prior art keywords
source
drain
layer
gate
diffusion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57001072A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57178377A (en
Inventor
Bitsukusuraa Horaa Aran
Roozenbaagu Robaato
Suchiibun Ratsupurehito Hansu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPS57178377A publication Critical patent/JPS57178377A/ja
Publication of JPS634955B2 publication Critical patent/JPS634955B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/80—FETs having rectifying junction gate electrodes
    • H10D30/87—FETs having Schottky gate electrodes, e.g. metal-semiconductor FETs [MESFET]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P32/00—Diffusion of dopants within, into or out of wafers, substrates or parts of devices
    • H10P32/10—Diffusion of dopants within, into or out of semiconductor bodies or layers
    • H10P32/14—Diffusion of dopants within, into or out of semiconductor bodies or layers within a single semiconductor body or layer in a solid phase; between different semiconductor bodies or layers, both in a solid phase
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P32/00—Diffusion of dopants within, into or out of wafers, substrates or parts of devices
    • H10P32/10—Diffusion of dopants within, into or out of semiconductor bodies or layers
    • H10P32/17—Diffusion of dopants within, into or out of semiconductor bodies or layers characterised by the semiconductor material
    • H10P32/174—Diffusion of dopants within, into or out of semiconductor bodies or layers characterised by the semiconductor material being Group III-V material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/40—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials
    • H10P76/408—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials characterised by their sizes, orientations, dispositions, behaviours or shapes
    • H10P76/4085—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials characterised by their sizes, orientations, dispositions, behaviours or shapes characterised by the processes involved to create the masks

Landscapes

  • Junction Field-Effect Transistors (AREA)
  • Electrodes Of Semiconductors (AREA)
JP57001072A 1981-04-17 1982-01-08 Method of producing field effect transistor Granted JPS57178377A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/255,187 US4389768A (en) 1981-04-17 1981-04-17 Self-aligned process for fabricating gallium arsenide metal-semiconductor field effect transistors

Publications (2)

Publication Number Publication Date
JPS57178377A JPS57178377A (en) 1982-11-02
JPS634955B2 true JPS634955B2 (enExample) 1988-02-01

Family

ID=22967222

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57001072A Granted JPS57178377A (en) 1981-04-17 1982-01-08 Method of producing field effect transistor

Country Status (4)

Country Link
US (1) US4389768A (enExample)
EP (1) EP0063221B1 (enExample)
JP (1) JPS57178377A (enExample)
DE (1) DE3264480D1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02295855A (ja) * 1989-05-11 1990-12-06 Isamu Miura 紙揃え装置
JPH0661840U (ja) * 1993-02-02 1994-09-02 新王子製紙株式会社 平判紙の積替装置

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57178373A (en) * 1981-04-27 1982-11-02 Sumitomo Electric Ind Ltd Schottky gate field-effect transistor
FR2525028A1 (fr) * 1982-04-09 1983-10-14 Chauffage Nouvelles Tech Procede de fabrication de transistors a effet de champ, en gaas, par implantations ioniques et transistors ainsi obtenus
JPS5950567A (ja) * 1982-09-16 1984-03-23 Hitachi Ltd 電界効果トランジスタの製造方法
JPS59114871A (ja) * 1982-12-21 1984-07-03 Toshiba Corp シヨツトキ−ゲ−ト型ＧａＡｓ電界効果トランジスタの製造方法
USH390H (en) 1983-06-17 1987-12-01 The United States Of America As Represented By The Secretary Of The Air Force Self-aligned gate MESFET and the method of fabricating same
JPS6046074A (ja) * 1983-08-24 1985-03-12 Toshiba Corp 電界効果トランジスタの製造方法
JPH0693509B2 (ja) * 1983-08-26 1994-11-16 シャープ株式会社 薄膜トランジスタ
US4636822A (en) * 1984-08-27 1987-01-13 International Business Machines Corporation GaAs short channel lightly doped drain MESFET structure and fabrication
US4855246A (en) * 1984-08-27 1989-08-08 International Business Machines Corporation Fabrication of a gaas short channel lightly doped drain mesfet
US4759822A (en) * 1984-10-12 1988-07-26 Triquint Semiconductor Inc. Methods for producing an aperture in a surface
US4592793A (en) * 1985-03-15 1986-06-03 International Business Machines Corporation Process for diffusing impurities into a semiconductor body vapor phase diffusion of III-V semiconductor substrates
JPS61256675A (ja) * 1985-05-09 1986-11-14 Sumitomo Electric Ind Ltd シヨツトキゲ−ト電界効果トランジスタの製造方法
US4710478A (en) * 1985-05-20 1987-12-01 United States Of America As Represented By The Secretary Of The Navy Method for making germanium/gallium arsenide high mobility complementary logic transistors
US4632713A (en) * 1985-07-31 1986-12-30 Texas Instruments Incorporated Process of making Schottky barrier devices formed by diffusion before contacting
US4927773A (en) * 1989-06-05 1990-05-22 Santa Barbara Research Center Method of minimizing implant-related damage to a group II-VI semiconductor material
US5278430A (en) * 1989-11-18 1994-01-11 Kabushiki Kaisha Toshiba Complementary semiconductor device using diamond thin film and the method of manufacturing this device
US5122075A (en) * 1991-05-17 1992-06-16 Amp Incorporated Electrical connector with improved retention feature
US5759880A (en) * 1997-01-02 1998-06-02 Motorola, Inc. Resistless methods of fabricating FETs
US6861758B2 (en) * 2002-08-30 2005-03-01 Intel Corporation Structure and manufacturing process of localized shunt to reduce electromigration failure of copper dual damascene process

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3479234A (en) * 1967-05-01 1969-11-18 Gen Electric Method of producing field effect transistors
US3574010A (en) * 1968-12-30 1971-04-06 Texas Instruments Inc Fabrication of metal insulator semiconductor field effect transistors
US3749614A (en) * 1970-09-14 1973-07-31 Rca Corp Fabrication of semiconductor devices
US3713912A (en) * 1971-02-11 1973-01-30 Bell Telephone Labor Inc Gallium arsenide field effect structure
US3856588A (en) * 1972-10-11 1974-12-24 Matsushita Electric Industrial Co Ltd Stabilizing insulation for diffused group iii-v devices
US3855690A (en) * 1972-12-26 1974-12-24 Westinghouse Electric Corp Application of facet-growth to self-aligned schottky barrier gate field effect transistors
US3943622A (en) * 1972-12-26 1976-03-16 Westinghouse Electric Corporation Application of facet-growth to self-aligned Shottky barrier gate field effect transistors
JPS5644582B2 (enExample) * 1973-08-13 1981-10-20
JPS5274285A (en) * 1975-12-17 1977-06-22 Hitachi Ltd Production of semiconductor device
US4111725A (en) * 1977-05-06 1978-09-05 Bell Telephone Laboratories, Incorporated Selective lift-off technique for fabricating gaas fets
US4222164A (en) * 1978-12-29 1980-09-16 International Business Machines Corporation Method of fabrication of self-aligned metal-semiconductor field effect transistors
US4287661A (en) * 1980-03-26 1981-09-08 International Business Machines Corporation Method for making an improved polysilicon conductor structure utilizing reactive-ion etching and thermal oxidation

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02295855A (ja) * 1989-05-11 1990-12-06 Isamu Miura 紙揃え装置
JPH0661840U (ja) * 1993-02-02 1994-09-02 新王子製紙株式会社 平判紙の積替装置

Also Published As

Publication number Publication date
EP0063221A3 (en) 1983-07-20
US4389768A (en) 1983-06-28
EP0063221B1 (en) 1985-07-03
JPS57178377A (en) 1982-11-02
DE3264480D1 (en) 1985-08-08
EP0063221A2 (en) 1982-10-27

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