JPS6346979B2 - - Google Patents
Info
- Publication number
- JPS6346979B2 JPS6346979B2 JP6411980A JP6411980A JPS6346979B2 JP S6346979 B2 JPS6346979 B2 JP S6346979B2 JP 6411980 A JP6411980 A JP 6411980A JP 6411980 A JP6411980 A JP 6411980A JP S6346979 B2 JPS6346979 B2 JP S6346979B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- sio
- wiring
- layer
- polyimide resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 20
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 17
- 239000011521 glass Substances 0.000 claims description 15
- 229910052698 phosphorus Inorganic materials 0.000 claims description 15
- 239000011574 phosphorus Substances 0.000 claims description 15
- 229920001721 polyimide Polymers 0.000 claims description 15
- 239000009719 polyimide resin Substances 0.000 claims description 14
- 239000004065 semiconductor Substances 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 7
- 239000010410 layer Substances 0.000 description 21
- 238000009792 diffusion process Methods 0.000 description 7
- 238000011109 contamination Methods 0.000 description 3
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 3
- 238000002955 isolation Methods 0.000 description 3
- 238000002161 passivation Methods 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005234 chemical deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/083—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/097—Glass compositions containing silica with 40% to 90% silica, by weight containing phosphorus, niobium or tantalum
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6411980A JPS56161655A (en) | 1980-05-16 | 1980-05-16 | Multilayer aluminum wiring for semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6411980A JPS56161655A (en) | 1980-05-16 | 1980-05-16 | Multilayer aluminum wiring for semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56161655A JPS56161655A (en) | 1981-12-12 |
| JPS6346979B2 true JPS6346979B2 (enrdf_load_stackoverflow) | 1988-09-20 |
Family
ID=13248851
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6411980A Granted JPS56161655A (en) | 1980-05-16 | 1980-05-16 | Multilayer aluminum wiring for semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56161655A (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58197846A (ja) * | 1982-05-14 | 1983-11-17 | Oki Electric Ind Co Ltd | 多層配線構造体の製造方法 |
| JPS59117236A (ja) * | 1982-12-24 | 1984-07-06 | Hitachi Ltd | 半導体装置 |
-
1980
- 1980-05-16 JP JP6411980A patent/JPS56161655A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS56161655A (en) | 1981-12-12 |
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