JPS6346595B2 - - Google Patents
Info
- Publication number
- JPS6346595B2 JPS6346595B2 JP58044276A JP4427683A JPS6346595B2 JP S6346595 B2 JPS6346595 B2 JP S6346595B2 JP 58044276 A JP58044276 A JP 58044276A JP 4427683 A JP4427683 A JP 4427683A JP S6346595 B2 JPS6346595 B2 JP S6346595B2
- Authority
- JP
- Japan
- Prior art keywords
- conductor layer
- layer
- weight
- noble metal
- firing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 claims description 54
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 38
- 239000000919 ceramic Substances 0.000 claims description 35
- 229910052759 nickel Inorganic materials 0.000 claims description 19
- 229910000510 noble metal Inorganic materials 0.000 claims description 19
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 18
- 238000010304 firing Methods 0.000 claims description 18
- 238000007747 plating Methods 0.000 claims description 16
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 14
- 229910052737 gold Inorganic materials 0.000 claims description 14
- 239000010931 gold Substances 0.000 claims description 14
- 238000002844 melting Methods 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 13
- 230000001590 oxidative effect Effects 0.000 claims description 13
- 229910052709 silver Inorganic materials 0.000 claims description 13
- 239000004332 silver Substances 0.000 claims description 13
- 230000008018 melting Effects 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 229910052763 palladium Inorganic materials 0.000 claims description 9
- 238000007639 printing Methods 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 11
- 239000010970 precious metal Substances 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 3
- LTPBRCUWZOMYOC-UHFFFAOYSA-N Beryllium oxide Chemical compound O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000007606 doctor blade method Methods 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 238000010023 transfer printing Methods 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- IHWJXGQYRBHUIF-UHFFFAOYSA-N [Ag].[Pt] Chemical compound [Ag].[Pt] IHWJXGQYRBHUIF-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Laminated Bodies (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4427683A JPS59171195A (ja) | 1983-03-18 | 1983-03-18 | セラミツク多層配線基板の製造法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4427683A JPS59171195A (ja) | 1983-03-18 | 1983-03-18 | セラミツク多層配線基板の製造法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59171195A JPS59171195A (ja) | 1984-09-27 |
| JPS6346595B2 true JPS6346595B2 (th) | 1988-09-16 |
Family
ID=12686981
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4427683A Granted JPS59171195A (ja) | 1983-03-18 | 1983-03-18 | セラミツク多層配線基板の製造法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59171195A (th) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0693545B2 (ja) * | 1988-12-23 | 1994-11-16 | 株式会社住友金属セラミックス | セラミック多層配線基板およびその製造方法 |
| JPH02252290A (ja) * | 1989-03-27 | 1990-10-11 | Ngk Insulators Ltd | 多層配線基板の製造方法 |
| JPH0691318B2 (ja) * | 1989-05-01 | 1994-11-14 | 日本碍子株式会社 | セラミック多層配線基板 |
| JPH0327590A (ja) * | 1989-06-23 | 1991-02-05 | Ngk Insulators Ltd | セラミック回路基板 |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4954859A (th) * | 1972-09-27 | 1974-05-28 | ||
| JPS5053863A (th) * | 1973-09-12 | 1975-05-13 | ||
| JPS51133766A (en) * | 1975-05-14 | 1976-11-19 | Ngk Spark Plug Co | Method of forming thick film circuit components on ceramic substrate |
| JPS5651899A (en) * | 1979-10-05 | 1981-05-09 | Nippon Electric Co | Method of manufacturing high density multilayer circuit board |
| JPS56130992A (en) * | 1980-03-18 | 1981-10-14 | Hitachi Ltd | Method of producing thick film board |
| JPS5712600A (en) * | 1980-06-27 | 1982-01-22 | Hitachi Ltd | Method of producing thick film multilayer circuit board |
| JPS5830194A (ja) * | 1981-08-14 | 1983-02-22 | 日本碍子株式会社 | セラミック多層配線基板の製造法 |
-
1983
- 1983-03-18 JP JP4427683A patent/JPS59171195A/ja active Granted
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4954859A (th) * | 1972-09-27 | 1974-05-28 | ||
| JPS5053863A (th) * | 1973-09-12 | 1975-05-13 | ||
| JPS51133766A (en) * | 1975-05-14 | 1976-11-19 | Ngk Spark Plug Co | Method of forming thick film circuit components on ceramic substrate |
| JPS5651899A (en) * | 1979-10-05 | 1981-05-09 | Nippon Electric Co | Method of manufacturing high density multilayer circuit board |
| JPS56130992A (en) * | 1980-03-18 | 1981-10-14 | Hitachi Ltd | Method of producing thick film board |
| JPS5712600A (en) * | 1980-06-27 | 1982-01-22 | Hitachi Ltd | Method of producing thick film multilayer circuit board |
| JPS5830194A (ja) * | 1981-08-14 | 1983-02-22 | 日本碍子株式会社 | セラミック多層配線基板の製造法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59171195A (ja) | 1984-09-27 |
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