JPS6344997Y2 - - Google Patents

Info

Publication number
JPS6344997Y2
JPS6344997Y2 JP1982047789U JP4778982U JPS6344997Y2 JP S6344997 Y2 JPS6344997 Y2 JP S6344997Y2 JP 1982047789 U JP1982047789 U JP 1982047789U JP 4778982 U JP4778982 U JP 4778982U JP S6344997 Y2 JPS6344997 Y2 JP S6344997Y2
Authority
JP
Japan
Prior art keywords
electrode
semiconductor
semiconductor pellet
pellet
glossy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1982047789U
Other languages
English (en)
Japanese (ja)
Other versions
JPS58150838U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1982047789U priority Critical patent/JPS58150838U/ja
Publication of JPS58150838U publication Critical patent/JPS58150838U/ja
Application granted granted Critical
Publication of JPS6344997Y2 publication Critical patent/JPS6344997Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/117—Shapes of semiconductor bodies
    • H10W90/756—

Landscapes

  • Wire Bonding (AREA)
JP1982047789U 1982-03-31 1982-03-31 半導体装置 Granted JPS58150838U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982047789U JPS58150838U (ja) 1982-03-31 1982-03-31 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982047789U JPS58150838U (ja) 1982-03-31 1982-03-31 半導体装置

Publications (2)

Publication Number Publication Date
JPS58150838U JPS58150838U (ja) 1983-10-08
JPS6344997Y2 true JPS6344997Y2 (enExample) 1988-11-22

Family

ID=30058738

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982047789U Granted JPS58150838U (ja) 1982-03-31 1982-03-31 半導体装置

Country Status (1)

Country Link
JP (1) JPS58150838U (enExample)

Also Published As

Publication number Publication date
JPS58150838U (ja) 1983-10-08

Similar Documents

Publication Publication Date Title
CA2265916C (en) Process for manufacturing semiconductor wafer, process for manufacturing semiconductor chip, and ic card
US5637913A (en) Leadframe semiconductor integrated circuit device using the same and method of and process for fabricating the two
US6445060B1 (en) Coated semiconductor die/leadframe assembly and method for coating the assembly
US20050205973A1 (en) Board-on-chip packages
US10707154B2 (en) Semiconductor device and method for manufacturing the same
US6474532B2 (en) Apparatus for forming wire bonds from circuitry on a substrate to a semiconductor chip, and methods of forming semiconductor chip assemblies
JPS6344997Y2 (enExample)
JPH08236665A (ja) 樹脂封止型半導体装置及びその製造方法
JPH03104148A (ja) 半導体集積回路用パッケージ
JPH10289923A5 (enExample)
JPS6050346B2 (ja) 半導体装置の製造方法
JPS6164132A (ja) 半導体装置
JP4829468B2 (ja) 半導体装置
JPS5816555A (ja) リ−ドフレ−ム
JPH0421105Y2 (enExample)
JPS60133736A (ja) 半導体装置
JPS6394640A (ja) 半導体素子の製造方法
KR100190923B1 (ko) 내부리드의 안정화를 위한 히트블록
JPH0332048A (ja) 半導体装置
JPS6228780Y2 (enExample)
JPH08186217A (ja) 半導体装置
KR200198274Y1 (ko) 반도체장치의범프
JPS60219741A (ja) 半導体装置の製造方法
JPS58140A (ja) ハイブリツドｉｃ
JPS5749258A (en) Semiconductor device