JPH10289923A5 - - Google Patents

Info

Publication number
JPH10289923A5
JPH10289923A5 JP1998051537A JP5153798A JPH10289923A5 JP H10289923 A5 JPH10289923 A5 JP H10289923A5 JP 1998051537 A JP1998051537 A JP 1998051537A JP 5153798 A JP5153798 A JP 5153798A JP H10289923 A5 JPH10289923 A5 JP H10289923A5
Authority
JP
Japan
Prior art keywords
conductive
resin
semiconductor package
manufacturing
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1998051537A
Other languages
English (en)
Japanese (ja)
Other versions
JPH10289923A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP10051537A priority Critical patent/JPH10289923A/ja
Priority claimed from JP10051537A external-priority patent/JPH10289923A/ja
Publication of JPH10289923A publication Critical patent/JPH10289923A/ja
Publication of JPH10289923A5 publication Critical patent/JPH10289923A5/ja
Pending legal-status Critical Current

Links

JP10051537A 1997-02-17 1998-02-17 半導体パッケージの製造方法 Pending JPH10289923A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10051537A JPH10289923A (ja) 1997-02-17 1998-02-17 半導体パッケージの製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP4691997 1997-02-17
JP9-46919 1997-02-17
JP10051537A JPH10289923A (ja) 1997-02-17 1998-02-17 半導体パッケージの製造方法

Publications (2)

Publication Number Publication Date
JPH10289923A JPH10289923A (ja) 1998-10-27
JPH10289923A5 true JPH10289923A5 (enExample) 2005-08-25

Family

ID=26387070

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10051537A Pending JPH10289923A (ja) 1997-02-17 1998-02-17 半導体パッケージの製造方法

Country Status (1)

Country Link
JP (1) JPH10289923A (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6537858B1 (en) 1999-08-09 2003-03-25 Rohm Co., Ltd. Method for manufacturing semiconductor device
KR100328834B1 (ko) * 1999-09-11 2002-03-14 박종섭 웨이퍼 레벨 칩사이즈 패키지의 제조방법
KR20020057358A (ko) * 2001-01-04 2002-07-11 마이클 디. 오브라이언 멀티칩 모듈 패키지 및 제조방법
JP4322844B2 (ja) 2005-06-10 2009-09-02 シャープ株式会社 半導体装置および積層型半導体装置
CN119786357B (zh) * 2024-12-12 2025-09-30 中山大学 一种功率模块及其制造方法

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