JPH10289923A5 - - Google Patents

Info

Publication number
JPH10289923A5
JPH10289923A5 JP1998051537A JP5153798A JPH10289923A5 JP H10289923 A5 JPH10289923 A5 JP H10289923A5 JP 1998051537 A JP1998051537 A JP 1998051537A JP 5153798 A JP5153798 A JP 5153798A JP H10289923 A5 JPH10289923 A5 JP H10289923A5
Authority
JP
Japan
Prior art keywords
conductive
resin
semiconductor package
manufacturing
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1998051537A
Other languages
English (en)
Japanese (ja)
Other versions
JPH10289923A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP10051537A priority Critical patent/JPH10289923A/ja
Priority claimed from JP10051537A external-priority patent/JPH10289923A/ja
Publication of JPH10289923A publication Critical patent/JPH10289923A/ja
Publication of JPH10289923A5 publication Critical patent/JPH10289923A5/ja
Pending legal-status Critical Current

Links

JP10051537A 1997-02-17 1998-02-17 半導体パッケージの製造方法 Pending JPH10289923A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10051537A JPH10289923A (ja) 1997-02-17 1998-02-17 半導体パッケージの製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP9-46919 1997-02-17
JP4691997 1997-02-17
JP10051537A JPH10289923A (ja) 1997-02-17 1998-02-17 半導体パッケージの製造方法

Publications (2)

Publication Number Publication Date
JPH10289923A JPH10289923A (ja) 1998-10-27
JPH10289923A5 true JPH10289923A5 (enExample) 2005-08-25

Family

ID=26387070

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10051537A Pending JPH10289923A (ja) 1997-02-17 1998-02-17 半導体パッケージの製造方法

Country Status (1)

Country Link
JP (1) JPH10289923A (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001011677A1 (en) * 1999-08-09 2001-02-15 Rohm Co., Ltd. Method for manufacturing semiconductor device
KR100328834B1 (ko) * 1999-09-11 2002-03-14 박종섭 웨이퍼 레벨 칩사이즈 패키지의 제조방법
KR20020057358A (ko) * 2001-01-04 2002-07-11 마이클 디. 오브라이언 멀티칩 모듈 패키지 및 제조방법
JP4322844B2 (ja) 2005-06-10 2009-09-02 シャープ株式会社 半導体装置および積層型半導体装置
CN119786357B (zh) * 2024-12-12 2025-09-30 中山大学 一种功率模块及其制造方法

Similar Documents

Publication Publication Date Title
US6569755B2 (en) Semiconductor device having an improved structure for preventing cracks, improved small sized semiconductor and method of manufacturing the same
US5519936A (en) Method of making an electronic package with a thermally conductive support member having a thin circuitized substrate and semiconductor device bonded thereto
US7443022B2 (en) Board-on-chip packages
US5633533A (en) Electronic package with thermally conductive support member having a thin circuitized substrate and semiconductor device bonded thereto
US20060145319A1 (en) Flip chip contact (FCC) power package
JP2738568B2 (ja) 半導体チップモジュール
JP2000223622A (ja) 半導体装置およびその製造方法並びにそれを使用した実装構造体
JPH10289923A5 (enExample)
US20050098861A1 (en) Bumped chip carrier package using lead frame and method for manufacturing the same
TWI281734B (en) Wafer level chip-scale package and manufacturing method thereof
JP2727435B2 (ja) 外部露出型ヒートシンクが付着された薄型ボールグリッドアレイ半導体パッケージ
EP0859411B1 (en) Semiconductor device of surface-mount type
US20030071353A1 (en) Semiconductor device
JP2004140079A (ja) エリアアレイ型半導体装置とそれを用いた電子回路基板
JP2756791B2 (ja) 樹脂封止型半導体装置
JPH08222655A (ja) 電子部品の電極構造とその製造方法
KR200179419Y1 (ko) 반도체패키지
JP2715974B2 (ja) 半導体装置及びその製造方法
JP2743157B2 (ja) 樹脂封止型半導体装置
JPS6217382B2 (enExample)
KR20010004041A (ko) 칩 사이즈 패키지의 제조 방법
JPH1084055A (ja) 半導体装置及びその製造方法
JPS61237454A (ja) 電子部品
JP3145892B2 (ja) 樹脂封止型半導体装置
JPS635253Y2 (enExample)