JPS58150838U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS58150838U
JPS58150838U JP1982047789U JP4778982U JPS58150838U JP S58150838 U JPS58150838 U JP S58150838U JP 1982047789 U JP1982047789 U JP 1982047789U JP 4778982 U JP4778982 U JP 4778982U JP S58150838 U JPS58150838 U JP S58150838U
Authority
JP
Japan
Prior art keywords
semiconductor equipment
semiconductor pellet
semiconductor
glossy
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1982047789U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6344997Y2 (enExample
Inventor
戸嶋　正征
Original Assignee
日本電気ホームエレクトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気ホームエレクトロニクス株式会社 filed Critical 日本電気ホームエレクトロニクス株式会社
Priority to JP1982047789U priority Critical patent/JPS58150838U/ja
Publication of JPS58150838U publication Critical patent/JPS58150838U/ja
Application granted granted Critical
Publication of JPS6344997Y2 publication Critical patent/JPS6344997Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/117—Shapes of semiconductor bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
JP1982047789U 1982-03-31 1982-03-31 半導体装置 Granted JPS58150838U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982047789U JPS58150838U (ja) 1982-03-31 1982-03-31 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982047789U JPS58150838U (ja) 1982-03-31 1982-03-31 半導体装置

Publications (2)

Publication Number Publication Date
JPS58150838U true JPS58150838U (ja) 1983-10-08
JPS6344997Y2 JPS6344997Y2 (enExample) 1988-11-22

Family

ID=30058738

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982047789U Granted JPS58150838U (ja) 1982-03-31 1982-03-31 半導体装置

Country Status (1)

Country Link
JP (1) JPS58150838U (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3620604B1 (en) 2018-09-05 2021-12-22 Hunter Douglas Industries B.V. Elongate mounting structure and mounting unit comprising the same for mounting an architectural covering between opposing mounting surfaces

Also Published As

Publication number Publication date
JPS6344997Y2 (enExample) 1988-11-22

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