JPS634348B2 - - Google Patents
Info
- Publication number
- JPS634348B2 JPS634348B2 JP55001322A JP132280A JPS634348B2 JP S634348 B2 JPS634348 B2 JP S634348B2 JP 55001322 A JP55001322 A JP 55001322A JP 132280 A JP132280 A JP 132280A JP S634348 B2 JPS634348 B2 JP S634348B2
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- pellets
- wafer
- defective
- shape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000008188 pellet Substances 0.000 claims description 94
- 230000002950 deficient Effects 0.000 claims description 32
- 238000000034 method Methods 0.000 claims description 15
- 239000004065 semiconductor Substances 0.000 claims description 7
- 230000015572 biosynthetic process Effects 0.000 claims description 5
- 235000012431 wafers Nutrition 0.000 description 32
- 238000001514 detection method Methods 0.000 description 7
- 238000012360 testing method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54453—Marks applied to semiconductor devices or parts for use prior to dicing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP132280A JPS5698835A (en) | 1980-01-11 | 1980-01-11 | Method of recognition of semiconductor pellet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP132280A JPS5698835A (en) | 1980-01-11 | 1980-01-11 | Method of recognition of semiconductor pellet |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5698835A JPS5698835A (en) | 1981-08-08 |
| JPS634348B2 true JPS634348B2 (enrdf_load_stackoverflow) | 1988-01-28 |
Family
ID=11498250
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP132280A Granted JPS5698835A (en) | 1980-01-11 | 1980-01-11 | Method of recognition of semiconductor pellet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5698835A (enrdf_load_stackoverflow) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59211239A (ja) * | 1983-05-17 | 1984-11-30 | Nec Corp | 半導体ペレツト配列機 |
| JPS6085520A (ja) * | 1983-10-17 | 1985-05-15 | Hitachi Ltd | パタ−ン検査方法 |
| JP3079504B2 (ja) * | 1995-10-23 | 2000-08-21 | 株式会社新川 | ウェーハのダイピックアップ方法 |
| JP3488127B2 (ja) * | 1999-03-31 | 2004-01-19 | エヌイーシーマシナリー株式会社 | 微小ワーク片の認識方法及びそれを用いたピックアップ装置 |
-
1980
- 1980-01-11 JP JP132280A patent/JPS5698835A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5698835A (en) | 1981-08-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS60263807A (ja) | プリント配線板のパタ−ン欠陥検査装置 | |
| CN112635346B (zh) | 晶圆检测方法、半导体检测设备及存储介质 | |
| JPH0456972B2 (enrdf_load_stackoverflow) | ||
| JP2018004272A (ja) | パターン検査装置およびパターン検査方法 | |
| JPS634348B2 (enrdf_load_stackoverflow) | ||
| JPH0682377A (ja) | 半導体の外観検査装置 | |
| JP3808320B2 (ja) | パターン検査装置およびパターン検査方法 | |
| JP2990134B2 (ja) | 半導体チップ、半導体試験装置及び半導体装置試験方法 | |
| KR100819796B1 (ko) | 반도체패키지의 분류방법 | |
| JPH06275686A (ja) | 半導体装置の製造方法及び製造装置 | |
| JPS60120519A (ja) | ホトマスクおよび自動欠陥検査装置 | |
| JPS61148828A (ja) | ワイヤボンデイングの検査方法 | |
| US20020090129A1 (en) | Chip inspecting apparatus and method | |
| JPH05281151A (ja) | ウエハパターン検査装置 | |
| JP2668566B2 (ja) | ペレットの形状認識方法 | |
| JPS6329887A (ja) | パタ−ン検査装置 | |
| JPH0133939B2 (enrdf_load_stackoverflow) | ||
| JPS61194305A (ja) | 形状検査装置 | |
| JPH079379Y2 (ja) | Ｉｃウエハ試験用自動プローバ | |
| KR20240104872A (ko) | 기판 처리 방법 및 기판 처리 시스템 | |
| JPH0989797A (ja) | 実装基板検査装置 | |
| JP3866966B2 (ja) | 繰り返し構造を有する物体の位置測定方法 | |
| JPH0766224A (ja) | ダイボンディング方法 | |
| KR960011251B1 (ko) | 제품 시각 검사방법 | |
| JPH04174311A (ja) | プリント配線基板の検査装置 |