JPS6342852B2 - - Google Patents

Info

Publication number
JPS6342852B2
JPS6342852B2 JP56074255A JP7425581A JPS6342852B2 JP S6342852 B2 JPS6342852 B2 JP S6342852B2 JP 56074255 A JP56074255 A JP 56074255A JP 7425581 A JP7425581 A JP 7425581A JP S6342852 B2 JPS6342852 B2 JP S6342852B2
Authority
JP
Japan
Prior art keywords
plating
gold
circuit board
connection
tin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56074255A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57190341A (en
Inventor
Yoshihiro Shimada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Watch Co Ltd
Original Assignee
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Watch Co Ltd filed Critical Citizen Watch Co Ltd
Priority to JP56074255A priority Critical patent/JPS57190341A/ja
Publication of JPS57190341A publication Critical patent/JPS57190341A/ja
Publication of JPS6342852B2 publication Critical patent/JPS6342852B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP56074255A 1981-05-19 1981-05-19 Circuit borad composition Granted JPS57190341A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56074255A JPS57190341A (en) 1981-05-19 1981-05-19 Circuit borad composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56074255A JPS57190341A (en) 1981-05-19 1981-05-19 Circuit borad composition

Publications (2)

Publication Number Publication Date
JPS57190341A JPS57190341A (en) 1982-11-22
JPS6342852B2 true JPS6342852B2 (enExample) 1988-08-25

Family

ID=13541854

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56074255A Granted JPS57190341A (en) 1981-05-19 1981-05-19 Circuit borad composition

Country Status (1)

Country Link
JP (1) JPS57190341A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016526797A (ja) * 2013-07-03 2016-09-05 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． メタライゼーション層の下に応力緩和層を有するｌｅｄ

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5208186A (en) * 1989-02-09 1993-05-04 National Semiconductor Corporation Process for reflow bonding of bumps in IC devices
JP3420917B2 (ja) 1997-09-08 2003-06-30 富士通株式会社 半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016526797A (ja) * 2013-07-03 2016-09-05 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． メタライゼーション層の下に応力緩和層を有するｌｅｄ

Also Published As

Publication number Publication date
JPS57190341A (en) 1982-11-22

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