JPS6341710B2 - - Google Patents
Info
- Publication number
- JPS6341710B2 JPS6341710B2 JP24755383A JP24755383A JPS6341710B2 JP S6341710 B2 JPS6341710 B2 JP S6341710B2 JP 24755383 A JP24755383 A JP 24755383A JP 24755383 A JP24755383 A JP 24755383A JP S6341710 B2 JPS6341710 B2 JP S6341710B2
- Authority
- JP
- Japan
- Prior art keywords
- abrasive grains
- grindstone
- base
- metal
- plating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000006061 abrasive grain Substances 0.000 claims description 52
- 238000007747 plating Methods 0.000 claims description 36
- 239000002184 metal Substances 0.000 claims description 30
- 229910052751 metal Inorganic materials 0.000 claims description 30
- 239000010953 base metal Substances 0.000 claims description 27
- 238000002844 melting Methods 0.000 claims description 12
- 230000008018 melting Effects 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 45
- 238000010586 diagram Methods 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000004070 electrodeposition Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 238000005219 brazing Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000014759 maintenance of location Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- 229910002065 alloy metal Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24755383A JPS60146679A (ja) | 1983-12-27 | 1983-12-27 | 電着砥石の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24755383A JPS60146679A (ja) | 1983-12-27 | 1983-12-27 | 電着砥石の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60146679A JPS60146679A (ja) | 1985-08-02 |
| JPS6341710B2 true JPS6341710B2 (de) | 1988-08-18 |
Family
ID=17165202
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24755383A Granted JPS60146679A (ja) | 1983-12-27 | 1983-12-27 | 電着砥石の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60146679A (de) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0735023B2 (ja) * | 1986-04-30 | 1995-04-19 | 日本ミクロコーティング株式会社 | 研摩テープの製造方法 |
-
1983
- 1983-12-27 JP JP24755383A patent/JPS60146679A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60146679A (ja) | 1985-08-02 |
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