JPS6338369U - - Google Patents
Info
- Publication number
- JPS6338369U JPS6338369U JP13169786U JP13169786U JPS6338369U JP S6338369 U JPS6338369 U JP S6338369U JP 13169786 U JP13169786 U JP 13169786U JP 13169786 U JP13169786 U JP 13169786U JP S6338369 U JPS6338369 U JP S6338369U
- Authority
- JP
- Japan
- Prior art keywords
- view
- reflow
- reflow chip
- chip
- row
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 description 1
Description
第１図は本考案によるリフローチツプの基本原
理を説明する斜視図と中心縦断面図、第２図は本
考案リフローチツプの実施例を示す斜視図と中心
縦断面図、第３図は同実施例リフローチツプの使
用状態を示す側面図、第４図は従来のリフローチ
ツプの使用状態の平面図と側面図、第５図はリフ
ロー半田付けされた状態を示す側面図、第６図は
従来のリフローチツプの斜視図である。
図において、１は配線基板、３はパツド、４は
電子部品、５は端子、６は予備半田、７はリフロ
ーチツプ、ａ，ｂは両端側、ｃは中央側、７１は
発熱部、７２はチツプ先端面、７３はチツプ先端
部、７４は薄肉部、７５は段差部、７６はＬ字状
先端部、８は熱電対をそれぞれ示す。
Fig. 1 is a perspective view and a central vertical cross-sectional view illustrating the basic principle of the reflow chip according to the present invention, Fig. 2 is a perspective view and a central longitudinal cross-sectional view showing an embodiment of the reflow chip according to the present invention, and Fig. 3 is an embodiment of the same. Example: A side view showing how a reflow chip is used. Figure 4 is a plan view and side view of a conventional reflow chip when it is used. Figure 5 is a side view showing a reflow soldered state. Figure 6 is a side view of a conventional reflow chip. FIG. 3 is a perspective view of a reflow chip. In the figure, 1 is a wiring board, 3 is a pad, 4 is an electronic component, 5 is a terminal, 6 is a preliminary solder, 7 is a reflow chip, a and b are both ends, c is a center side, 71 is a heat generating part, and 72 is a reflow chip. The tip end face of the tip, 73 is the tip tip, 74 is the thin wall portion, 75 is the stepped portion, 76 is the L-shaped tip, and 8 is the thermocouple.
Claims (1)
一斉に加熱するリフローチツプにおいて、 発熱部７１のリフローチツプ先端面７２に垂直
方向の寸法Ｗが、端子列方向において、中間側ｃ
より両端側ａ，ｂが小さく形成されていること、 中間部ｃが、端子列に当接するチツプ先端部７
３を除き、厚さｔ２となるように薄く形成されて
いること、を特徴とするリフローチツプ。[Scope of Claim for Utility Model Registration] In a reflow chip that heats a row of component terminals on a terminal mounting pad of a wiring board all at once, middle side c
Both end sides a and b are formed smaller, and the middle part c is the tip end part 7 that comes into contact with the terminal row.
A reflow chip, except for No. 3, is formed thinly to have a thickness of t2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986131697U JPH0410715Y2 (en) | 1986-08-28 | 1986-08-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986131697U JPH0410715Y2 (en) | 1986-08-28 | 1986-08-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6338369U true JPS6338369U (en) | 1988-03-11 |
| JPH0410715Y2 JPH0410715Y2 (en) | 1992-03-17 |
Family
ID=31030395
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986131697U Expired JPH0410715Y2 (en) | 1986-08-28 | 1986-08-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0410715Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6025458A (en) * | 1983-07-21 | 1985-02-08 | Fujitsu Ltd | Inspecting method of connection between package and printed board |
-
1986
- 1986-08-28 JP JP1986131697U patent/JPH0410715Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6025458A (en) * | 1983-07-21 | 1985-02-08 | Fujitsu Ltd | Inspecting method of connection between package and printed board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0410715Y2 (en) | 1992-03-17 |
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