JPS61177458U - - Google Patents
Info
- Publication number
- JPS61177458U JPS61177458U JP6150385U JP6150385U JPS61177458U JP S61177458 U JPS61177458 U JP S61177458U JP 6150385 U JP6150385 U JP 6150385U JP 6150385 U JP6150385 U JP 6150385U JP S61177458 U JPS61177458 U JP S61177458U
- Authority
- JP
- Japan
- Prior art keywords
- package
- width
- endmost
- lead terminal
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の半導体装置の一実施例を示す
斜視図。第２図は従来の半導体装置を示す斜視図
。第３図は従来の半導体装置を用いて基板に半田
付された様子を示す要部拡大斜視図。
１……パツケージ、２……リード端子、３……
本考案によるリード端子、３′……３の根元部分
、４……従来の各辺最端に位置するリード端子、
５……基板、６……半田付パターン、７……半田
、８，９……変形したリード端子。
FIG. 1 is a perspective view showing an embodiment of the semiconductor device of the present invention. FIG. 2 is a perspective view showing a conventional semiconductor device. FIG. 3 is an enlarged perspective view of a main part showing how a conventional semiconductor device is soldered to a board. 1...Package cage, 2...Lead terminal, 3...
Lead terminal according to the present invention, 3'...root portion of 3, 4...lead terminal located at the end of each side of the conventional one,
5... Board, 6... Soldering pattern, 7... Solder, 8, 9... Deformed lead terminal.
Claims (1)
いて、パツケージ各辺の最も端のリード端子の幅
が他のリード端子の幅より広いことを特徴とする
半導体装置。 (2) パツケージ各辺の最も端のリード端子のハ
ンダ付け部分のみ、他のリード端子と同幅である
ことを特徴とする、実用新案登録請求の範囲第１
項の半導体装置。[Claims for Utility Model Registration] (1) A semiconductor device in the form of a package, characterized in that the width of the endmost lead terminal on each side of the package is wider than the width of the other lead terminals. (2) Utility model registration claim 1, characterized in that only the soldered part of the endmost lead terminal on each side of the package cage is the same width as the other lead terminals.
Section Semiconductor Devices.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6150385U JPS61177458U (en) | 1985-04-24 | 1985-04-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6150385U JPS61177458U (en) | 1985-04-24 | 1985-04-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61177458U true JPS61177458U (en) | 1986-11-05 |
Family
ID=30589845
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6150385U Pending JPS61177458U (en) | 1985-04-24 | 1985-04-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61177458U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05129501A (en) * | 1991-10-31 | 1993-05-25 | Nec Kyushu Ltd | Package for ic |
-
1985
- 1985-04-24 JP JP6150385U patent/JPS61177458U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05129501A (en) * | 1991-10-31 | 1993-05-25 | Nec Kyushu Ltd | Package for ic |