JPS6334510B2 - - Google Patents

Info

Publication number
JPS6334510B2
JPS6334510B2 JP57102192A JP10219282A JPS6334510B2 JP S6334510 B2 JPS6334510 B2 JP S6334510B2 JP 57102192 A JP57102192 A JP 57102192A JP 10219282 A JP10219282 A JP 10219282A JP S6334510 B2 JPS6334510 B2 JP S6334510B2
Authority
JP
Japan
Prior art keywords
chip
board
external terminal
back side
card
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57102192A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58221478A (ja
Inventor
Masao Muramatsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyodo Printing Co Ltd
Original Assignee
Kyodo Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyodo Printing Co Ltd filed Critical Kyodo Printing Co Ltd
Priority to JP57102192A priority Critical patent/JPS58221478A/ja
Publication of JPS58221478A publication Critical patent/JPS58221478A/ja
Publication of JPS6334510B2 publication Critical patent/JPS6334510B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
JP57102192A 1982-06-16 1982-06-16 Ｉｃカ−ド Granted JPS58221478A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57102192A JPS58221478A (ja) 1982-06-16 1982-06-16 Ｉｃカ−ド

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57102192A JPS58221478A (ja) 1982-06-16 1982-06-16 Ｉｃカ−ド

Publications (2)

Publication Number Publication Date
JPS58221478A JPS58221478A (ja) 1983-12-23
JPS6334510B2 true JPS6334510B2 (enrdf_load_stackoverflow) 1988-07-11

Family

ID=14320797

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57102192A Granted JPS58221478A (ja) 1982-06-16 1982-06-16 Ｉｃカ−ド

Country Status (1)

Country Link
JP (1) JPS58221478A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6243749A (ja) * 1985-08-20 1987-02-25 Nippon Denshi Zairyo Kk セキユリテイキ−
JPS62152193A (ja) * 1985-12-25 1987-07-07 イビデン株式会社 Ｉｃカ−ド用プリント配線板

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5247419Y2 (enrdf_load_stackoverflow) * 1972-10-09 1977-10-27
US4004133A (en) * 1974-12-30 1977-01-18 Rca Corporation Credit card containing electronic circuit
FR2337381A1 (fr) * 1975-12-31 1977-07-29 Honeywell Bull Soc Ind Carte portative pour systeme de traitement de signaux electriques et procede de fabrication de cette carte
JPS53134112U (enrdf_load_stackoverflow) * 1977-03-30 1978-10-24
JPS5536639A (en) * 1978-09-05 1980-03-14 Arai Pump Mfg Co Ltd Bush or bearing
JPS6121727Y2 (enrdf_load_stackoverflow) * 1978-10-02 1986-06-28
FR2439438A1 (fr) * 1978-10-19 1980-05-16 Cii Honeywell Bull Ruban porteur de dispositifs de traitement de signaux electriques, son procede de fabrication et application de ce ruban a un element de traitement de signaux
FR2486685B1 (fr) * 1980-07-09 1985-10-31 Labo Electronique Physique Carte de paiement electronique et procede de realisation
JPS5875285A (ja) * 1981-10-28 1983-05-06 Tokyo Jiki Insatsu Kk Ｉｃ内蔵磁器カ−ドの製造法
JPS5818785U (ja) * 1982-03-05 1983-02-04 玉崎　三衛 シヤ−プペンシル

Also Published As

Publication number Publication date
JPS58221478A (ja) 1983-12-23

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