JPS6333310B2 - - Google Patents
Info
- Publication number
- JPS6333310B2 JPS6333310B2 JP54122688A JP12268879A JPS6333310B2 JP S6333310 B2 JPS6333310 B2 JP S6333310B2 JP 54122688 A JP54122688 A JP 54122688A JP 12268879 A JP12268879 A JP 12268879A JP S6333310 B2 JPS6333310 B2 JP S6333310B2
- Authority
- JP
- Japan
- Prior art keywords
- imaging device
- solid
- metal plate
- state imaging
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/6875—Shapes or dispositions thereof being on a metallic substrate, e.g. insulated metal substrates [IMS]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Light Receiving Elements (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12268879A JPS5646566A (en) | 1979-09-26 | 1979-09-26 | Solid image pickup device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12268879A JPS5646566A (en) | 1979-09-26 | 1979-09-26 | Solid image pickup device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5646566A JPS5646566A (en) | 1981-04-27 |
| JPS6333310B2 true JPS6333310B2 (enExample) | 1988-07-05 |
Family
ID=14842155
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12268879A Granted JPS5646566A (en) | 1979-09-26 | 1979-09-26 | Solid image pickup device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5646566A (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60207108A (ja) * | 1984-03-31 | 1985-10-18 | Sony Corp | 固体撮像装置 |
| JP6357784B2 (ja) * | 2014-02-03 | 2018-07-18 | 株式会社ニコン | 撮像ユニット及び撮像装置 |
-
1979
- 1979-09-26 JP JP12268879A patent/JPS5646566A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5646566A (en) | 1981-04-27 |
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