JPS63295491A - メタライズ組成物 - Google Patents
メタライズ組成物Info
- Publication number
- JPS63295491A JPS63295491A JP12944187A JP12944187A JPS63295491A JP S63295491 A JPS63295491 A JP S63295491A JP 12944187 A JP12944187 A JP 12944187A JP 12944187 A JP12944187 A JP 12944187A JP S63295491 A JPS63295491 A JP S63295491A
- Authority
- JP
- Japan
- Prior art keywords
- parts
- cuo
- conductor
- metallizing
- airtightness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 title claims description 9
- 229910052802 copper Inorganic materials 0.000 claims abstract description 8
- 229910052763 palladium Inorganic materials 0.000 claims abstract description 6
- 229910052697 platinum Inorganic materials 0.000 claims abstract description 4
- 239000004020 conductor Substances 0.000 abstract description 14
- 239000000758 substrate Substances 0.000 abstract description 8
- 239000000919 ceramic Substances 0.000 abstract description 7
- 230000015572 biosynthetic process Effects 0.000 abstract description 2
- 239000011148 porous material Substances 0.000 abstract description 2
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 abstract 2
- 229910000108 silver(I,III) oxide Inorganic materials 0.000 abstract 2
- QPLDLSVMHZLSFG-UHFFFAOYSA-N CuO Inorganic materials [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 abstract 1
- VASIZKWUTCETSD-UHFFFAOYSA-N manganese(II) oxide Inorganic materials [Mn]=O VASIZKWUTCETSD-UHFFFAOYSA-N 0.000 abstract 1
- 239000010949 copper Substances 0.000 description 14
- 239000002245 particle Substances 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 238000005238 degreasing Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000007935 neutral effect Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 229910018626 Al(OH) Inorganic materials 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- GEYXPJBPASPPLI-UHFFFAOYSA-N manganese(III) oxide Inorganic materials O=[Mn]O[Mn]=O GEYXPJBPASPPLI-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000011946 reduction process Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- 238000004017 vitrification Methods 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- 230000002747 voluntary effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12944187A JPS63295491A (ja) | 1987-05-26 | 1987-05-26 | メタライズ組成物 |
| US07/133,817 US4871608A (en) | 1986-12-10 | 1987-12-10 | High-density wiring multilayered substrate |
| US07/196,408 US4837408A (en) | 1987-05-21 | 1988-05-20 | High density multilayer wiring board and the manufacturing thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12944187A JPS63295491A (ja) | 1987-05-26 | 1987-05-26 | メタライズ組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63295491A true JPS63295491A (ja) | 1988-12-01 |
| JPH0534311B2 JPH0534311B2 (enrdf_load_stackoverflow) | 1993-05-21 |
Family
ID=15009543
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12944187A Granted JPS63295491A (ja) | 1986-12-10 | 1987-05-26 | メタライズ組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63295491A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5120473A (en) * | 1987-10-12 | 1992-06-09 | Ngk Spark Plug Co., Ltd. | Metallizing composition for use with ceramics |
| US7083745B2 (en) * | 2000-12-28 | 2006-08-01 | Denso Corporation | Production method for laminate type dielectric device and electrode paste material |
-
1987
- 1987-05-26 JP JP12944187A patent/JPS63295491A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5120473A (en) * | 1987-10-12 | 1992-06-09 | Ngk Spark Plug Co., Ltd. | Metallizing composition for use with ceramics |
| US7083745B2 (en) * | 2000-12-28 | 2006-08-01 | Denso Corporation | Production method for laminate type dielectric device and electrode paste material |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0534311B2 (enrdf_load_stackoverflow) | 1993-05-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |