JPS63278356A - 半導体集積回路 - Google Patents

半導体集積回路

Info

Publication number
JPS63278356A
JPS63278356A JP62115212A JP11521287A JPS63278356A JP S63278356 A JPS63278356 A JP S63278356A JP 62115212 A JP62115212 A JP 62115212A JP 11521287 A JP11521287 A JP 11521287A JP S63278356 A JPS63278356 A JP S63278356A
Authority
JP
Japan
Prior art keywords
semiconductor chip
chip
leads
resin
external leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62115212A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0570305B2 (enExample
Inventor
Takashi Kusakari
草刈　隆
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP62115212A priority Critical patent/JPS63278356A/ja
Publication of JPS63278356A publication Critical patent/JPS63278356A/ja
Publication of JPH0570305B2 publication Critical patent/JPH0570305B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W90/756—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
JP62115212A 1987-05-11 1987-05-11 半導体集積回路 Granted JPS63278356A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62115212A JPS63278356A (ja) 1987-05-11 1987-05-11 半導体集積回路

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62115212A JPS63278356A (ja) 1987-05-11 1987-05-11 半導体集積回路

Publications (2)

Publication Number Publication Date
JPS63278356A true JPS63278356A (ja) 1988-11-16
JPH0570305B2 JPH0570305B2 (enExample) 1993-10-04

Family

ID=14657140

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62115212A Granted JPS63278356A (ja) 1987-05-11 1987-05-11 半導体集積回路

Country Status (1)

Country Link
JP (1) JPS63278356A (enExample)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60109256A (ja) * 1983-11-18 1985-06-14 Oki Electric Ind Co Ltd プラスチツク型半導体装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60109256A (ja) * 1983-11-18 1985-06-14 Oki Electric Ind Co Ltd プラスチツク型半導体装置

Also Published As

Publication number Publication date
JPH0570305B2 (enExample) 1993-10-04

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