JPS63265486A - Printed circuit board - Google Patents
Printed circuit boardInfo
- Publication number
- JPS63265486A JPS63265486A JP10035987A JP10035987A JPS63265486A JP S63265486 A JPS63265486 A JP S63265486A JP 10035987 A JP10035987 A JP 10035987A JP 10035987 A JP10035987 A JP 10035987A JP S63265486 A JPS63265486 A JP S63265486A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- printed circuit
- circuit board
- insulating layer
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052751 metal Inorganic materials 0.000 claims abstract description 9
- 239000002184 metal Substances 0.000 claims abstract description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000011889 copper foil Substances 0.000 claims abstract description 6
- 150000007530 organic bases Chemical class 0.000 claims abstract description 4
- 239000004593 Epoxy Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 abstract description 13
- 229920000647 polyepoxide Polymers 0.000 abstract description 13
- 230000005855 radiation Effects 0.000 abstract 2
- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 239000004744 fabric Substances 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 3
- 241000531908 Aramides Species 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229920003235 aromatic polyamide Polymers 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 239000004753 textile Substances 0.000 description 2
- 238000004017 vitrification Methods 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 229910000976 Electrical steel Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 229920005549 butyl rubber Polymers 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、エレクトロニクス機器に用いるプリント配線
板に関するもので、と（に金属板に薄絶縁層を付した放
熱性の良い配線板に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a printed wiring board used in electronic equipment, and more particularly to a wiring board with good heat dissipation, which is a metal plate with a thin insulating layer.
従来の技術
従来金属ベースプリント配線板としてアルミニウム板、
鉄板、珪素鋼板が金属ベースとして、用いられ、これに
銅箔を被着したり、銅の電気めっき、化学めっきなどに
より、導体層を形成していた。そして絶縁層として、エ
ポキシ樹脂にシリカ粉末を混入したもの、ブロム化エポ
キシ樹脂にブチルゴムを混ぜたもの、エポキシ樹脂をガ
ラス布に含浸させたものなどがある。Conventional technology Conventional metal-based printed wiring board as aluminum plate,
An iron plate or a silicon steel plate was used as the metal base, and a conductive layer was formed by coating it with copper foil or by copper electroplating, chemical plating, etc. Examples of the insulating layer include epoxy resin mixed with silica powder, brominated epoxy resin mixed with butyl rubber, and glass cloth impregnated with epoxy resin.
発明が解決しようとする問題点
従来例の場合には、絶縁層中にボイドが発生し、耐電圧
性が良くない。また、塩素、ナトリウムなどの不純物が
１００〜１０００ｐｐ■と多く、ガラス化温度Ｔｇが８
０°前後と低すぎる。さらに、プレッシャクツカーテス
トによるとガラス布のせんい方向に沿って透水性があり
、不良原因になるなどの欠点があった。Problems to be Solved by the Invention In the case of the conventional example, voids occur in the insulating layer and the voltage resistance is poor. In addition, there are many impurities such as chlorine and sodium at 100 to 1000 pp■, and the vitrification temperature Tg is 8.
It's too low, around 0°. Furthermore, according to the pressure test, the glass cloth had water permeability along the weave direction, which caused defects.
問題点を解決するための手段
本発明では絶縁層を５０μ未満と薄くし、かつ、内部は
エポキシ樹脂含浸の有機基材としたものである。Means for Solving the Problems In the present invention, the insulating layer is made thinner than 50 μm, and the inside is made of an organic base material impregnated with epoxy resin.
作用
本発明によれば、硬い下地が得られ、かつ、熱を迅速に
金属板に伝達し放熱 をあげ得る。Effects According to the present invention, a hard base can be obtained, and heat can be quickly transferred to the metal plate to improve heat dissipation.
実施例 第１図〜第３図は本発明の各実施例の断面図である。Example 1 to 3 are cross-sectional views of each embodiment of the present invention.
各実施例は、いずれもアルミニウム板として。Each example is an aluminum plate.
厚さ０．１ｍｍ、銅箔厚さとして３５μを用い、同アル
ミニウム板の片面に絶縁層を、厚さ４０μ以下に構成し
たものである。The thickness is 0.1 mm, the copper foil thickness is 35 μm, and an insulating layer is formed on one side of the same aluminum plate to a thickness of 40 μm or less.
第１図は絶縁層として、芯地に紙、合成紙を用い、これ
に芳香族アミンアダクト型硬化剤を用いたエポキシ樹脂
を含浸させて厚さ４０μｍになしたエポキシ樹脂含浸紙
２を用いたものである。これは、ガラス化温度Ｔｇが１
５５℃であり、紙の吸湿性は前記エポキシ樹脂の含浸に
よって大幅に改善される。Figure 1 shows an epoxy resin-impregnated paper 2 made of paper or synthetic paper as an interlining and impregnated with an epoxy resin containing an aromatic amine adduct type curing agent to a thickness of 40 μm as an insulating layer. It is something. This means that the vitrification temperature Tg is 1
55°C, and the hygroscopicity of the paper is significantly improved by impregnation with the epoxy resin.
第２図はポリイミドフィルムの厚さ２５μを用い、これ
に、前記エポキシ樹脂のコーティングを両面に厚さ７．
５μｍ形成して、これらを介して、アルミニウム基板１
および銅箔３を接着したものである。さらに、第３図は
アーラミド短せんい布に前記エポキシ樹脂含浸させたエ
ポキシ樹脂含浸シート６を用いる。この場合、この含浸
シートが接着剤と電気絶縁層を兼ね、アルミニウム板と
同レベルの温度・伸縮率をもち、また、塩素。In FIG. 2, a polyimide film with a thickness of 25 μm is used, and both sides are coated with the epoxy resin to a thickness of 7 μm.
Aluminum substrate 1 is formed with a thickness of 5 μm and
and copper foil 3 are bonded. Further, FIG. 3 uses an epoxy resin-impregnated sheet 6 in which Aramide short textile cloth is impregnated with the epoxy resin. In this case, this impregnated sheet serves as both an adhesive and an electrical insulating layer, has the same temperature and expansion and contraction rate as an aluminum plate, and is also chlorine-impregnated.
ナトリウム等の不純物を５ｐｐ−以内におさえ、３００
℃２分以上の耐熱性を得ることができる。Keeping impurities such as sodium within 5pp-, 300%
Heat resistance of 2 minutes or more at ℃ can be obtained.
以上３例において、接着条件は、３０ ｋｇ ／ ｃｍ
加圧１６０℃２時間である。In the above three examples, the bonding conditions were 30 kg/cm
Pressure was applied at 160° C. for 2 hours.
発明の効果
本発明によれば、絶縁性、耐湿性ならびに耐熱性のいず
れの性能でも、従来例をしのぐ高性能を示し、高い放熱
特性の金属ベース印刷配線板を得ることができる。Effects of the Invention According to the present invention, it is possible to obtain a metal-based printed wiring board that exhibits higher performance than conventional examples in all performances of insulation, moisture resistance, and heat resistance, and has high heat dissipation characteristics.
第１図〜第３図は本発明の各実施例構成の断面図である
。
１・・・・・・アルミニウム板、２・・・・・・エポキ
シ樹脂含浸紙、３・・・・・・銅箔、４・・・・・・ポ
リイミドフィルム、５・・・・・・エポキシ樹脂、６・
・・・・・エポキシ樹脂含浸アーラミド短せんい布。1 to 3 are cross-sectional views of each embodiment of the present invention. 1... Aluminum plate, 2... Epoxy resin impregnated paper, 3... Copper foil, 4... Polyimide film, 5... Epoxy Resin, 6.
...Epoxy resin impregnated Aramide short textile cloth.
Claims (1)
を介して、銅箔を被着した構成の印刷配線板。A printed wiring board comprising a metal plate covered with copper foil via an epoxy resin-impregnated organic base material having a thickness of less than 50 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62100359A JPH0828559B2 (en) | 1987-04-23 | 1987-04-23 | Printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62100359A JPH0828559B2 (en) | 1987-04-23 | 1987-04-23 | Printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63265486A true JPS63265486A (en) | 1988-11-01 |
| JPH0828559B2 JPH0828559B2 (en) | 1996-03-21 |
Family
ID=14271885
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62100359A Expired - Fee Related JPH0828559B2 (en) | 1987-04-23 | 1987-04-23 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0828559B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011118352A1 (en) * | 2010-03-23 | 2011-09-29 | 東洋アルミニウム株式会社 | Mounting board heat dissipating laminate |
| JP2013026284A (en) * | 2011-07-15 | 2013-02-04 | Toyo Aluminium Kk | Manufacturing method of heat radiation laminated material for mounting substrate |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58178905A (en) * | 1982-04-13 | 1983-10-20 | 帝人株式会社 | Aromatic polyamide film insulating electric member |
| JPS59175184A (en) * | 1983-03-23 | 1984-10-03 | 松下電器産業株式会社 | Metallic substrate for printed circuit |
| JPS59149653U (en) * | 1983-03-24 | 1984-10-06 | ニツカン工業株式会社 | printed circuit board |
| JPS6088492A (en) * | 1983-10-20 | 1985-05-18 | 松下電器産業株式会社 | Printed circuit board |
| JPS6235593A (en) * | 1985-08-09 | 1987-02-16 | 東芝ケミカル株式会社 | Metal substrate for circuit |
-
1987
- 1987-04-23 JP JP62100359A patent/JPH0828559B2/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58178905A (en) * | 1982-04-13 | 1983-10-20 | 帝人株式会社 | Aromatic polyamide film insulating electric member |
| JPS59175184A (en) * | 1983-03-23 | 1984-10-03 | 松下電器産業株式会社 | Metallic substrate for printed circuit |
| JPS59149653U (en) * | 1983-03-24 | 1984-10-06 | ニツカン工業株式会社 | printed circuit board |
| JPS6088492A (en) * | 1983-10-20 | 1985-05-18 | 松下電器産業株式会社 | Printed circuit board |
| JPS6235593A (en) * | 1985-08-09 | 1987-02-16 | 東芝ケミカル株式会社 | Metal substrate for circuit |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011118352A1 (en) * | 2010-03-23 | 2011-09-29 | 東洋アルミニウム株式会社 | Mounting board heat dissipating laminate |
| CN102870512A (en) * | 2010-03-23 | 2013-01-09 | 东洋铝株式会社 | Mounting board heat dissipating laminate |
| JPWO2011118352A1 (en) * | 2010-03-23 | 2013-07-04 | 東洋アルミニウム株式会社 | Heat dissipating laminated material for mounting board |
| JP2013026284A (en) * | 2011-07-15 | 2013-02-04 | Toyo Aluminium Kk | Manufacturing method of heat radiation laminated material for mounting substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0828559B2 (en) | 1996-03-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |