JPS62264942A - Metallic-base laminated board - Google Patents
Metallic-base laminated boardInfo
- Publication number
- JPS62264942A JPS62264942A JP10987586A JP10987586A JPS62264942A JP S62264942 A JPS62264942 A JP S62264942A JP 10987586 A JP10987586 A JP 10987586A JP 10987586 A JP10987586 A JP 10987586A JP S62264942 A JPS62264942 A JP S62264942A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- metal
- insulating layer
- base material
- metal plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052751 metal Inorganic materials 0.000 claims description 46
- 239000002184 metal Substances 0.000 claims description 46
- 229920005989 resin Polymers 0.000 claims description 27
- 239000011347 resin Substances 0.000 claims description 27
- 239000000463 material Substances 0.000 claims description 19
- 239000011256 inorganic filler Substances 0.000 claims description 14
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 14
- 239000011888 foil Substances 0.000 claims description 9
- 238000010521 absorption reaction Methods 0.000 description 6
- 230000007797 corrosion Effects 0.000 description 6
- 238000005260 corrosion Methods 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 6
- 238000007747 plating Methods 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 3
- 239000000395 magnesium oxide Substances 0.000 description 3
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 229910052582 BN Inorganic materials 0.000 description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910000976 Electrical steel Inorganic materials 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- -1 trisulfate chloride ethylene Chemical group 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 229910000737 Duralumin Inorganic materials 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- PYVHTIWHNXTVPF-UHFFFAOYSA-N F.F.F.F.C=C Chemical compound F.F.F.F.C=C PYVHTIWHNXTVPF-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229920000265 Polyparaphenylene Polymers 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 229910000611 Zinc aluminium Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- HXFVOUUOTHJFPX-UHFFFAOYSA-N alumane;zinc Chemical compound [AlH3].[Zn] HXFVOUUOTHJFPX-UHFFFAOYSA-N 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229920006026 co-polymeric resin Polymers 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 150000007529 inorganic bases Chemical class 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000007530 organic bases Chemical class 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
［技術分野１
本発明は耐湿性、耐熱性に優れた金属ベース積層板に関
する。Detailed Description of the Invention [Technical Field 1] The present invention relates to a metal-based laminate having excellent moisture resistance and heat resistance.
［背景技術１
従来より、金属板にエポキシ樹脂のような絶縁層を介し
て金属箔が貼着されて金属ベース積層板が形成されてい
るが、金属板と絶縁層の熱膨張の差により、特に吸湿の
後の耐熱性が悪く、又電蝕試験での絶縁劣化が著しく、
しかも絶縁層にボイドが発生し、絶縁層の厚みのばらつ
鯵も大きくなってしまっていた。絶縁層のボイドの発生
及び厚みのばらつきを防止するために、絶縁層にガラス
基材のような基材が介装されているが、このものにあっ
ては絶縁層と金属板との、特に吸湿後のｆｆｉ着性が悪
く、又吸湿後の耐熱性にも劣っているものである。[Background Art 1 Conventionally, a metal base laminate has been formed by pasting a metal foil to a metal plate through an insulating layer such as an epoxy resin, but due to the difference in thermal expansion between the metal plate and the insulating layer, In particular, the heat resistance after moisture absorption is poor, and the insulation deteriorates significantly in the electrolytic corrosion test.
Moreover, voids were generated in the insulating layer, and the variation in the thickness of the insulating layer also became large. In order to prevent the generation of voids and thickness variations in the insulating layer, a base material such as a glass base material is interposed in the insulating layer. The ffi adhesion after moisture absorption is poor, and the heat resistance after moisture absorption is also poor.
［発明の目的］
本発明は上記事情に鑑みて為されたものであり、その目
的とするところは、耐湿性、耐熱性に優れ、絶縁層と金
属板との密着性も高く、しかも絶縁層にボイドが発生す
ることがなく厚みのばらつきも小さい金属ベース積層板
を提供することにある。[Object of the Invention] The present invention has been made in view of the above circumstances, and its purpose is to provide an insulating layer with excellent moisture resistance and heat resistance, high adhesion between the insulating layer and the metal plate, and An object of the present invention is to provide a metal-based laminate that does not generate voids and has small variations in thickness.
［発明の開示１
本発明の金属ベース積層板は、金属板１に絶縁層２を介
して金属箔３を貼着してなる金属ベース積層板であって
、絶縁層２の金属Ｍ３＠を樹脂含浸基材４で形成すると
共に金属板１ｇＡを無機フィラー含有樹脂層５で形成し
て成るものであり、この構成により上記目的を達成でき
たものである。[Disclosure 1 of the Invention The metal base laminate of the present invention is a metal base laminate in which a metal foil 3 is attached to a metal plate 1 via an insulating layer 2, and the metal M3 of the insulating layer 2 is bonded to a resin. It is formed of an impregnated base material 4 and a metal plate 1gA is formed of an inorganic filler-containing resin layer 5, and with this structure, the above object can be achieved.
即ち、無機フィラー含有樹脂層５の無機フィラーにより
吸湿した水分が絶縁層２へ拡散しにくくなり、耐湿性、
電蝕後の劣化特性が良好となり、又かも無機フィラー含
有樹脂層５の熱膨張係数が金属板１に近付くため熱膨張
の差による接着破壊が緩和され耐熱性が向上し、しかも
、無機フィラー含有樹脂層５により樹脂含浸基材４と金
属板１の熱膨張の差による熱的接着破壊を緩和して、耐
熱性をより向上させることができ、更に絶縁層２の溶融
粘度が高くなって均一な厚みが得られ、又基材６を介装
させているのでボイドの発生もないものである。That is, moisture absorbed by the inorganic filler in the inorganic filler-containing resin layer 5 becomes difficult to diffuse into the insulating layer 2, resulting in improved moisture resistance and
The deterioration characteristics after electrolytic corrosion are improved, and since the thermal expansion coefficient of the inorganic filler-containing resin layer 5 approaches that of the metal plate 1, adhesion failure due to the difference in thermal expansion is alleviated and heat resistance is improved. The resin layer 5 can alleviate thermal adhesion failure due to the difference in thermal expansion between the resin-impregnated base material 4 and the metal plate 1, further improving heat resistance, and furthermore, the melt viscosity of the insulating layer 2 is increased and uniform. It is possible to obtain a sufficient thickness, and since the base material 6 is interposed, no voids are generated.
以下、本発明を添付の図面に基づいて説明する。Hereinafter, the present invention will be explained based on the accompanying drawings.
金属板１としては、銅板、アルミニウム板、鉄板、ニッ
ケル板又はステンレス鋼板、真ちゅう板、ケイ素鋼板、
ジュラルミン等の合金などいずれをも採用でき、通常、
厚み０．１〜２．ＯＩＩＩｍの範囲のものを用いる。こ
れら金属板１には亜鉛めっき、アルミニウムめっ終、亜
鉛−アルミニウムめっきを施しておいてもよい。又、金
属板１には予めガイド孔又はパイロット乱用の打ち抜き
孔、その他スルーホール用の貫通孔を穿孔しておいても
よい。本発明の金属ベース積層板Ａは、このベース金属
板１上に無機フィラー含有樹脂層５、樹脂含浸基材４及
び金属ｒｔｉ３を配置し、このものを−組みとして成形
プレートを介して複数組み熱盤間に配置し、例えば、１
５０−１７０°Ｃ、２０−１５０ｋｇ／ｃｍ２．４０−
１００分で加熱加圧して積層一体化させて得られる。樹
脂含浸基材４は紙、ガラス布、合繊、アスベスト等の有
機、無機基材６にエポキシ樹脂、ポリイミド樹脂、ポリ
イミドアミド樹脂のような熱硬化性樹脂あるいは熱可塑
性樹脂フェスを含浸乾燥させて形成され、厚みが５〜１
００μである。無機フィラー含有樹脂層５は厚みが０．
０５〜１＆１ｗｌで、７エ７−ル樹脂、エポキシ樹脂、
不飽和ポリエステル樹脂、三７ツ化塩化エチレン樹脂、
四７ツ化エチレン樹脂、四フッ化エチレンー六フフ化プ
ロピレン共重ｋ 体ｍ Ｗｊ 、四７フ化エチレンーパ
ーフルオロビニルエーテル共重合体樹脂などのフッ素系
樹脂等の熱硬化性樹脂とかポリイミド樹脂、ポリフェニ
レンボリサルファイド樹脂、ポリアミド樹脂などの樹脂
に無機フィラーを含有させて形成される。無機フィラー
としては、アルミナ、酸化マグネシウム、窒化ホウ素等
の熱伝導性が良好なものが好ましい。この無機フィラー
の配合割合は樹脂固形分に対して７〜６０容量％、好ま
しくは１０〜５５容量％である。７容量％未満であると
効果的でなく、逆に６０容量％を超えると金属板１との
Ｗｊ着性が低下したり、含浸量の均一性が低下してしま
う。金属Ｍ３としては金属板１と同じ材質を用いること
ができ、銅箔、アルミニウム箔、真ちゅう箔、鉄箔、ス
テンレスｗ４箔、ニッケル箔、ケイ素鋼箔などいずれを
も採用でさ、厚み１８〜７０μの範囲で用いる。As the metal plate 1, copper plate, aluminum plate, iron plate, nickel plate or stainless steel plate, brass plate, silicon steel plate,
Any alloy such as duralumin can be used, and usually,
Thickness 0.1-2. A substance in the OIIIm range is used. These metal plates 1 may be subjected to zinc plating, aluminum plating, or zinc-aluminum plating. Further, the metal plate 1 may be pre-drilled with a guide hole, a punched hole for pilot use, or a through hole for a through hole. The metal base laminate A of the present invention is produced by arranging an inorganic filler-containing resin layer 5, a resin-impregnated base material 4, and a metal RTI 3 on the base metal plate 1. For example, 1
50-170°C, 20-150kg/cm2.40-
It is obtained by heating and pressing for 100 minutes to integrate the layers. The resin-impregnated base material 4 is formed by impregnating and drying a thermosetting resin or thermoplastic resin face such as epoxy resin, polyimide resin, or polyimide amide resin into an organic or inorganic base material 6 such as paper, glass cloth, synthetic fiber, or asbestos. and the thickness is 5-1
It is 00μ. The inorganic filler-containing resin layer 5 has a thickness of 0.
05-1&1wl, 7-el resin, epoxy resin,
Unsaturated polyester resin, trisulfate chloride ethylene resin,
Thermosetting resins such as fluorine-based resins such as ethylene tetrafluoride resin, ethylene tetrafluoride-propylene hexafluoride copolymer (mWj), ethylene tetrafluoride-perfluorovinyl ether copolymer resin, polyimide resins, It is formed by incorporating an inorganic filler into a resin such as polyphenylene borisulfide resin or polyamide resin. As the inorganic filler, those having good thermal conductivity such as alumina, magnesium oxide, and boron nitride are preferable. The blending ratio of this inorganic filler is 7 to 60% by volume, preferably 10 to 55% by volume based on the resin solid content. If it is less than 7% by volume, it will not be effective, and if it exceeds 60% by volume, the WJ adhesion to the metal plate 1 will decrease and the uniformity of the amount of impregnation will decrease. As the metal M3, the same material as the metal plate 1 can be used, such as copper foil, aluminum foil, brass foil, iron foil, stainless steel W4 foil, nickel foil, silicon steel foil, etc., and the thickness is 18 to 70 μm. Used within the range of.
金属ベース積層板Ａから金属ベースプリント配線板の製
造は周知の工程が採用される。たとえば、金属ベース銅
張積層板に順次、孔明け、無電解めっ外、パターン形成
、パターンめっ外、レジストめっき、レジスト除去、エ
ツチング、外形仕上げ、シンボルマーク印刷といった工
程でスルーホールめっ軽金属ベースプリント配線板は製
造される。A well-known process is employed to manufacture a metal-based printed wiring board from the metal-based laminate A. For example, through-hole plating is applied to metal-based copper-clad laminates through the following processes: hole-drilling, electroless plating, pattern formation, pattern plating, resist plating, resist removal, etching, external finishing, and symbol mark printing. A base printed wiring board is manufactured.
次に、本発明の詳細な説明する。Next, the present invention will be explained in detail.
（実施例１〜７）
厚み１．Ｏｍｍのアルミニウム板と、ガラス基材にエポ
キシ樹脂を含浸させた厚み１００μの樹脂含浸基材と、
第１表に示すようにエポキシ樹脂に種々の無Ｐ！１フィ
ラーを種々の割合で配合した無１ｆｌｉフィラー含有樹
脂層とからなる絶縁層とで、金属ベース積層板を構成し
、絶縁層と金属板との吸湿後の密着性（Ｃ−１０／８５
／８５）、吸湿後の半田耐熱性（Ｃ−１０／８５／８５
）、及びこの金属ベース積層板から金属ベースプリント
配線板を形成し、その回路と金属板間の電蝕試験絶縁性
（Ｃ−５００／８５／８５ ）を測定した。結果を第２
表に示す。尚、絶縁層の厚みむらも±１０以下と小さく
、ボイドは発生しなかった。(Examples 1 to 7) Thickness 1. Omm aluminum plate, 100μ thick resin-impregnated base material made by impregnating a glass base material with epoxy resin,
As shown in Table 1, there are various P-free epoxy resins. An insulating layer consisting of a filler-free resin layer containing 1 filler in various proportions constitutes a metal base laminate, and the adhesion between the insulating layer and the metal plate after moisture absorption (C-10/85
/85), soldering heat resistance after moisture absorption (C-10/85/85
), and a metal base printed wiring board was formed from this metal base laminate, and the electrical corrosion test insulation properties (C-500/85/85) between the circuit and the metal plate were measured. Second result
Shown in the table. Incidentally, the thickness unevenness of the insulating layer was as small as ±10 or less, and no voids were generated.
（比較例）
比較のため絶縁層をガラス基材にエポキシ樹脂を含浸さ
せた厚み１００μの樹脂含浸基材で形成した金属ベース
積層板を形成し、実施例と同様の測定を行った。結果を
第２表に示す。尚、絶縁層の厚みむらは±２０以上と天
外く、しかもボイドの発生が見られた。(Comparative Example) For comparison, a metal base laminate was formed in which the insulating layer was made of a resin-impregnated base material having a thickness of 100 μm, which was a glass base material impregnated with an epoxy resin, and the same measurements as in the example were performed. The results are shown in Table 2. Incidentally, the thickness unevenness of the insulating layer was extraordinary, being more than ±20, and the occurrence of voids was observed.
第１表
無機フィラー含有樹脂層
、 フィラー ０
実施例１ アルミナ １゜２ アルミナ
６゜
３ 酸化マグネシウム １゜
４ 酸化マグネシウム ６０
５ 窒化ホウ素 １゜
６ ホウ ６゜
第２表
密着性 半田耐熱性 電蝕試験絶縁性
００Ｖ
実施例１ 剥離無し２６０’０６０分以上 ｌＸ１０９
以上２ 同上 同上 同上３ 同上
同上 同上
４ 同上 同上 同上
５ 同上 同上 同上
６ 上 目上 ｑ上
比較例 剥離 ２６０℃ １分以下 ５Ｘ１０”１
．５ｋｃ舶
本発明の実施例にあっては、金属板と絶縁層との吸湿後
の密着性も良好で、半田耐熱性及び電蝕試験絶縁性も良
好であることが判る。これらは絶縁層に無機フィラー含
浸樹脂層を介装したことによるものと考えられる。Table 1 Inorganic filler-containing resin layer, Filler 0 Example 1 Alumina 1゜2 Alumina
6゜3 Magnesium oxide 1゜4 Magnesium oxide 60 5 Boron nitride 1゜6 Boron 6゜Second surface adhesion Solder heat resistance Electrolytic corrosion test insulation 00V Example 1 No peeling 260'060 minutes or more lX109
Above 2 Same as above Same above Same as above 3 Same as above
Same as above Same as above 4 Same as above Same as above Same as above 5 Same as above Same as above Same as above 6 Upper Upper q Upper comparative example Peeling 260℃ 1 minute or less 5X10”1
．． It can be seen that in the example of the 5kc vessel of the present invention, the adhesion between the metal plate and the insulating layer after moisture absorption was good, and the soldering heat resistance and the insulation properties in the electrolytic corrosion test were also good. This is thought to be due to the fact that the inorganic filler-impregnated resin layer was interposed in the insulating layer.
［発明の効果］
本発明にあっては、絶縁層の金属ｔｔｉ側を樹脂金浸基
材で形成すると共に金属板側を無１ｓ！フィラー含有樹
脂層で形成しているので、無機フィラー含有樹脂層中の
無Ｉａフィラーにより吸湿した水分が絶縁層へ拡散しに
くくなり、耐湿性、電蝕後の劣化特性が良好となり、又
無機フィラー含有樹脂層の熱膨張係数が金属板に近付く
ため熱膨張の差による接着破壊が緩和され耐熱性が向上
し、しかも、無機フィラー含有樹脂層により樹脂含浸基
材と金属板の熱膨張の差による熱的接着破壊をその弾性
により緩和して、耐熱性をより向上させることかで終、
更に絶縁層の樹脂含浸基材により溶融粘度が高くなって
均一な厚みが得られ、又樹脂含浸基材の基材によりボイ
ドの発生を抑えることができるものである。[Effects of the Invention] In the present invention, the metal tti side of the insulating layer is formed of a resin gold-immersed base material, and the metal plate side is formed without 1s! Since it is formed of a filler-containing resin layer, the Ia-free filler in the inorganic filler-containing resin layer makes it difficult for absorbed moisture to diffuse into the insulating layer, resulting in good moisture resistance and deterioration characteristics after electrolytic corrosion. The thermal expansion coefficient of the resin layer approaches that of the metal plate, which alleviates adhesion failure due to differences in thermal expansion and improves heat resistance.Moreover, the resin layer containing inorganic fillers reduces the thermal expansion coefficient caused by differences in thermal expansion between the resin-impregnated base material and the metal plate. By alleviating thermal adhesion failure through its elasticity and further improving heat resistance,
Furthermore, the resin-impregnated base material of the insulating layer increases the melt viscosity and provides a uniform thickness, and the resin-impregnated base material can suppress the generation of voids.
第１図は本発明の一実施例を示す側断面図であって、Ａ
は金属ベース積層板、１は金属板、２は絶縁層、３は金
属箔、４は樹脂含浸基材、５は無機フィラー含有樹脂層
である。
代理人 弁理士 石 １）艮 七
第１図FIG. 1 is a side sectional view showing one embodiment of the present invention, and FIG.
1 is a metal base laminate, 1 is a metal plate, 2 is an insulating layer, 3 is a metal foil, 4 is a resin-impregnated base material, and 5 is an inorganic filler-containing resin layer. Agent Patent Attorney Ishi 1) Ai Figure 7 1
Claims (1)
属ベース積層板であって、絶縁層の金属箔側を樹脂含浸
基材で形成すると共に金属板側を無機フィラー含有樹脂
層で形成して成ることを特徴とする金属ベース積層板。(1) A metal-based laminate consisting of a metal foil attached to a metal plate through an insulating layer, in which the metal foil side of the insulating layer is formed with a resin-impregnated base material, and the metal plate side is formed with an inorganic filler-containing resin. A metal-based laminate characterized by being formed of layers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61109875A JPH06390B2 (en) | 1986-05-14 | 1986-05-14 | Metal base laminated board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61109875A JPH06390B2 (en) | 1986-05-14 | 1986-05-14 | Metal base laminated board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62264942A true JPS62264942A (en) | 1987-11-17 |
| JPH06390B2 JPH06390B2 (en) | 1994-01-05 |
Family
ID=14521392
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61109875A Expired - Fee Related JPH06390B2 (en) | 1986-05-14 | 1986-05-14 | Metal base laminated board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06390B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0239930A (en) * | 1988-07-29 | 1990-02-08 | Shin Kobe Electric Mach Co Ltd | Metal foil-plated laminate with metal core and its manufacture |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58165391A (en) * | 1982-03-26 | 1983-09-30 | 昭和電工株式会社 | Substrate for printed circuit board |
| JPS60107332A (en) * | 1983-11-15 | 1985-06-12 | 松下電工株式会社 | Metallic-base metal lined laminated plate |
| JPS6133466U (en) * | 1984-07-30 | 1986-02-28 | 三菱電線工業株式会社 | Electroplated insulated metal substrate |
| JPS6169450A (en) * | 1984-09-14 | 1986-04-10 | 住友ベークライト株式会社 | Laminated board for metallic-base printed circuit |
-
1986
- 1986-05-14 JP JP61109875A patent/JPH06390B2/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58165391A (en) * | 1982-03-26 | 1983-09-30 | 昭和電工株式会社 | Substrate for printed circuit board |
| JPS60107332A (en) * | 1983-11-15 | 1985-06-12 | 松下電工株式会社 | Metallic-base metal lined laminated plate |
| JPS6133466U (en) * | 1984-07-30 | 1986-02-28 | 三菱電線工業株式会社 | Electroplated insulated metal substrate |
| JPS6169450A (en) * | 1984-09-14 | 1986-04-10 | 住友ベークライト株式会社 | Laminated board for metallic-base printed circuit |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0239930A (en) * | 1988-07-29 | 1990-02-08 | Shin Kobe Electric Mach Co Ltd | Metal foil-plated laminate with metal core and its manufacture |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH06390B2 (en) | 1994-01-05 |
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| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |