JPH0680803A - Resin-impregnated base material and electrical laminate - Google Patents

Abstract

PURPOSE:To provide a base material, excellent in electrical insulation, heat resistance and heat cycling and useful for electronic and electrical equipments, etc., by impregnating a base material with a specified epoxy resin varnish and drying it. CONSTITUTION:A curing agent such as a phenol resin is added to an epoxy resin composed of (A) 25 to 45 pts.wt. alicyclic epoxy resin, (B) 35 to 55 pts.wt. bisphenol A type epoxy resin, (C) 10 to 30 pts.wt. long chain type epoxy resin and, as necessary, e.g. a curing promotor such as a phosphorus-based promotor and a solvent such as a ketone-based solvent are further added thereto to prepare an epoxy resin varnish. A base material made of glass fiber, etc., is impregnated with the resultant epoxy resin varnish and dried, thus producing the objective base material. In addition, an electrical laminate is obtained by monolithically laminating required leaves of the base materials while placing a metal foil of copper, etc., on the upside and/or underside of each base material leaf.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin-impregnated base material used for electronic equipment, electric equipment, calculators, communication equipment and the like, and an electric laminate.

[0002]

2. Description of the Related Art In recent years, epoxy resin laminates have been widely used as a measure for improving reliability and performance of electric and electronic devices. However, laminates using a bisphenol A type epoxy resin are heat resistant and electrically insulating. However, there was a problem that the heat cycle property was lacking.

[0003]

As described in the prior art, the conventional epoxy resin laminated plate has a problem that it lacks in heat cycle property. The present invention has been made in view of the above problems in the prior art, and an object thereof is to provide a resin-impregnated base material excellent in heat resistance, electric insulation, and heat cycle properties, and an electrical laminate. Especially.

[0004]

The present invention is directed to 25 to 45 parts by weight of alicyclic epoxy resin (hereinafter simply referred to as "part"), 35 to 55 parts of bisphenol A type epoxy resin, and 10 to 30 long chain type epoxy resin. Of epoxy resin varnish in which a curing agent is added to an epoxy resin consisting of parts and, if necessary, a curing accelerator, a solvent, etc., is impregnated into a base material, a resin-impregnated base material is dried, and a required number of the resin-impregnated base material is included. The above-described object can be achieved because the electric laminated plate is characterized in that the metal foil is disposed and formed on the upper surface and / or the lower surface of the above, and the present invention will be described in detail below.

The epoxy resin used in the present invention includes alicyclic epoxy resin, bisphenol A type epoxy resin,
It is necessary to use three kinds of long-chain type epoxy resins in combination, and alicyclic epoxy resin, bisphenol A type epoxy resin, and long-chain type epoxy resin can be used in general. The amount of cycloaliphatic epoxy resin is 25 to 45 parts of the total epoxy resin. That is, if it is less than 25 parts, the electrical insulating property is not improved, and if it exceeds 45 parts, the heat resistance is lowered. The amount of bisphenol A type epoxy resin is 35.
~ 55 parts. That is, if it is less than 35 parts, the heat resistance is not improved, and if it exceeds 55 parts, the heat cycle property is deteriorated. The amount of long chain type epoxy resin is 10 to 30 parts. That is, if it is less than 10 parts, the heat cycle property is not improved,
This is because if it exceeds 30 parts, the heat resistance will decrease. As the curing agent, a phenol resin, an isocyanate, an amine type curing agent, an acid anhydride, a Lewis acid complex compound, an imidazole type compound or the like can be used without any particular limitation. If necessary, a phosphorus-based or tertiary amine-based curing accelerator is used as the curing accelerator. If necessary, the solvent is not particularly limited as long as it is compatible with the resin, such as a ketone solvent or an alcohol solvent. Further, if necessary, inorganic powder fillers such as talc, clay, silica, calcium carbonate, aluminum hydroxide, antimony trioxide and antimony pentoxide, glass fibers, asbestos fibers, pulp fibers, synthetic fibers, fibrous materials such as ceramic fibers. Fillers, colorants and the like can be added. As the base material, inorganic fibers such as glass and asbestos, organic fibers such as polyester, polyamide, polyacryl, polyvinyl alcohol, polyimide and fluororesin, and natural fibers such as cotton can be used. The base material may be impregnated only with the same resin, but a plurality of impregnations such as primary impregnation with the same resin or different type resin and secondary impregnation may be performed to make the impregnation more uniform. Thus, the resin is impregnated into the base material and dried to obtain a resin-impregnated base material. As the metal foil, a single, alloy, or composite foil of copper, aluminum, brass, nickel, iron or the like can be used. In this manner, a metal foil is provided on the upper surface and / or the lower surface of the required number of the resin-impregnated base materials and integrated to obtain an electrical laminate. The present invention will be described below based on examples.

[0006]

[Example] Alicyclic epoxy resin (manufactured by Ajinomoto Co., Inc.) 4
5 parts, bisphenol A type epoxy resin (Ciel Chemical Co., Ltd., Epicoat 1001) 35 parts, long chain type epoxy resin (Ciel Chemical Co., Ltd., Epicoat 872) 2
An epoxy resin varnish containing 0 part, 4 parts of dicyandiamide, 0.2 part of benzyldimethylamine, and 100 parts of methyl oxytol was impregnated with a plain woven glass cloth having a thickness of 0.018 mm so that the resin adhesion amount was 45% and dried. Thus, a resin-impregnated base material was obtained. Next, a laminated body in which copper foil having a thickness of 0.035 mm is arranged on the upper and lower surfaces of the eight resin-impregnated base materials stacked on each other is heated and pressure-molded at 160 ° C. for 90 minutes at a molding pressure of 40 Kg / cm ² , and a thickness of 1 is obtained. A 0.6 mm double-sided copper-clad laminate board was obtained.

[0007]

[Comparative Example] Dicyandiamide 4 to 100 parts of epoxy resin (Epicoat 1001 manufactured by Ciel Chemical Co., Ltd.)
Part, benzyl dimethylamine 0.2 part, and methyloxytol 100 parts were used to obtain a resin-impregnated base material and double-sided copper-clad wiring having a thickness of 1.6 mm by the same treatment as in Example except that an epoxy resin varnish was used. A substrate was obtained.

Table 1 shows the performance of the electrical laminates of Examples and Comparative Examples. Weight loss after heating at 150 ° C for 200 hours, heat cycle property at -20 ° C for 30 minutes, 1
Holding for 30 minutes at 20 ° C for one cycle is shown as the number of times until occurrence of abnormality.

[0009]

[Table 1]

[0010]

The present invention is constructed as described above.
It has been confirmed that the electrical laminate using the resin-impregnated base material having the structure described in the claims has good electrical insulation properties, heat resistance, and heat cycle properties, and is excellent in the present invention.

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Claims (2)

[Claims] 1. A curing agent is added to an epoxy resin comprising 25 to 45 parts by weight of an alicyclic epoxy resin, 35 to 55 parts by weight of a bisphenol A type epoxy resin, and 10 to 30 parts by weight of a long chain type epoxy resin, and a curing agent is further added. A resin-impregnated base material, which is obtained by impregnating a base material with an epoxy resin varnish to which a curing accelerator, a solvent and the like are added as necessary and drying. 2. A curing agent is added to an epoxy resin comprising 25 to 45 parts by weight of an alicyclic epoxy resin, 35 to 55 parts by weight of a bisphenol A type epoxy resin, and 10 to 30 parts by weight of a long chain type epoxy resin, and a curing agent is further added. Characterized by disposing a metal foil on the upper surface and / or lower surface of the required number of dried resin-impregnated base materials by impregnating the base material with an epoxy resin varnish to which a curing accelerator, solvent, etc. are added as required. And electrical laminate.