JPH06116411A - Resin-impregnated base and electrical laminate - Google Patents

Abstract

PURPOSE:To provide an electrical laminate good in insulation resistance after moisture absorption and in smearing resistance and to provide a resin- impregnated base therefor. CONSTITUTION:The resin-impregnated base is one obtained by impregnating a base with an epoxy resin varnish comprising a silicone-modified epoxy resin and a silicone-modified phenolic novolak and optionally containing a curing accelerator, a solvent, etc., and drying the resulting base. The electrical laminate is one obtained by superposing a necessary number of sheets of the resin- impregnated base, disposing a metal foil on at least one side of the pile, and uniting the laminae.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin-impregnated base material used for electronic equipment, electric equipment, calculators, communication equipment and the like, and an electric laminate.

[0002]

2. Description of the Related Art In recent years, attempts have been made to improve the insulation resistance after moisture absorption and the smear resistance as a measure for improving the reliability of electric and electronic equipment.

[0003]

As described in the prior art, it is not easy to improve the insulation resistance after moisture absorption and the smear resistance. The present invention has been made in view of the above problems in the prior art, and its object is to provide insulation resistance after moisture absorption, a resin-impregnated base material in which smear resistance is improved, and an electrical laminate to provide electricity, It is to improve the reliability of electronic devices.

[0004]

According to the present invention, a silicon-modified epoxy resin is added with a silicon-modified novolac type phenolic resin, and if necessary, a curing agent, a curing accelerator, a solvent, etc. are added to the epoxy resin varnish. Means for Solving the Problems The above object is achieved by a resin-impregnated base material that has been impregnated and dried, and a laminate for electrical use, characterized in that a required number of the resin-impregnated base material is provided with a metal foil on the upper surface and / or lower surface thereof. The present invention will be described in detail below.

The silicone-modified epoxy resin used in the present invention is preferably a reaction product of aminosilicon-modified epoxy resin, vinyl group-containing silicone and hydrogen silicone. The aminosilicon-modified epoxy resin has an amino equivalent of 700 to 10,000, preferably 2000 to 4
Epoxy resins having a biphenyl skeleton with 000 aminosilicones added are desirable. The vinyl group-containing silicon has two or more vinyl groups directly bonded to a silicon atom in one molecule. Hydrogen silicon has two or more hydrogen atoms directly bonded to silicon atoms in one molecule. The reaction of amino silicone modified epoxy resin, vinyl group containing silicone and hydrogen silicone is 5
The reaction product can be obtained by heating at 0 to 160 ° C. for 20 to 120 minutes. The silicon-modified novolac-type phenol resin is preferably a reaction product of an epoxy-silicon-modified phenol resin, vinyl group-containing silicon, and hydrogen silicon. The epoxy silicone-modified phenol resin may be a phenol resin to which epoxy silicon is added, but is preferably a phenol resin.
It is desirable to use a novolac type phenol resin as the resin. The vinyl group-containing silicon has two or more vinyl groups directly bonded to a silicon atom in one molecule. Hydrogen silicon has two or more hydrogen atoms directly bonded to silicon atoms in one molecule.
The reaction of epoxy silicone modified phenolic resin, vinyl group containing silicone, and hydrogen silicone is 50 to 16
The reaction product can be obtained by heating and reacting at 0 ° C. for 20 to 120 minutes. As the curing agent, a phenol resin, an isocyanate, an amine type curing agent, an acid anhydride, a Lewis acid complex compound, an imidazole type compound or the like can be used without any particular limitation. If necessary, the curing accelerator may be a phosphorus-based compound,
A tertiary amine curing accelerator is used. The solvent used as needed is not particularly limited as long as it is compatible with the resin, such as a ketone solvent or an alcohol solvent. Further, if necessary, inorganic powder fillers such as talc, clay, silica, calcium carbonate, aluminum hydroxide, antimony trioxide and antimony pentoxide, and fiber materials such as glass fiber, asbestos fiber, pulp fiber, synthetic fiber and ceramic fiber. Fillers, colorants and the like can be added. As the base material, it is possible to use glass, inorganic fibers such as asbestos, organic fibers such as polyester, polyamide, polyacrylic, polyvinyl alcohol, polyimide and fluororesin, woven cloth of natural fibers such as cotton, non-woven fabric, paper and mat. it can. The base material may be impregnated only with the same resin, but primary impregnation with the same resin or a different resin,
It is also possible to make multiple impregnations such as the second impregnation so that the impregnation becomes more uniform. Thus, the resin is impregnated into the base material and dried to obtain a resin-impregnated base material. As the metal foil, a single, alloy, or composite foil of copper, aluminum, brass, nickel, iron or the like can be used. In this manner, a metal foil is provided on the upper surface and / or the lower surface of the required number of the resin-impregnated base materials and integrated to obtain an electrical laminate.
The present invention will be described below based on examples.

[0006]

EXAMPLE To 15 parts by weight of a biphenyl skeleton epoxy resin (hereinafter simply referred to as “part”) to which aminosilicon having an amino equivalent of 3000 is added, 15 parts of vinyl group-containing silicon and 15 parts of hydrogen silicone are added, and the mixture is heated to 90 ° C. at 80 ° C. It was heated and reacted for a minute to obtain a silicone-modified epoxy resin. Next, with respect to 80 parts of epoxy silicone-modified phenolic resin, 10 parts of vinyl group-containing silicon and 1 part of hydrogen silicone.
0 part was added and the mixture was heated and reacted at 90 ° C. for 40 minutes to obtain a silicon-modified novolac type phenol resin. To 70 parts of the above silicone-modified epoxy resin, 30 parts of the above-mentioned silicone-modified novolac-type phenol resin and 4 parts of dicyandiamide
Part, benzyl dimethylamine 0.2 part, and methyl oxytol 100 parts epoxy resin varnish were impregnated with a 0.018 mm-thick plain woven glass cloth so that the resin adhesion amount was 45%, and dried to obtain a resin impregnated group. I got the material. Next, a thickness of 0.035 mm was formed on the upper and lower surfaces of the eight resin-impregnated base materials.
Molding pressure of 40Kg / cm
^2. Heat and pressure molding at 160 ℃ for 90 minutes, thickness 1.6m
A double-sided copper-clad laminate of m was obtained.

[0007]

[Comparative Example] Dicyandiamide 4 to 100 parts of epoxy resin (Epicoat 1001 manufactured by Ciel Chemical Co., Ltd.)
Parts, benzyl dimethylamine 0.2 parts, and methyl oxytol 100 parts were used to obtain a resin-impregnated base material and double-sided copper-clad laminate having a thickness of 1.6 mm by the same procedure as in Example except that an epoxy resin varnish was used. I got a plate.

Table 1 shows the performance of the electrical laminates of Examples and Comparative Examples. Insulation resistance after moisture absorption is 20 ° C, humidity is 65
% For 96 hours, immersed in boiling water at 100 ° C. for 2 hours, and then measured for insulation resistance according to JIS standard C6481. As for smear resistance, the penetration state of the plating solution on the inner wall of the through hole was observed.

[0009]

[Table 1]

[0010]

The present invention is constructed as described above.
It has been confirmed that the electrical laminate using the resin-impregnated base material having the structure described in the claims has good insulation resistance and smear resistance after moisture absorption, and is excellent in the present invention.

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁵ Identification code Internal reference number FI Technical display area C08G 59/30 NHR 8416-4J 59/62 NJS 8416-4J H05K 1/03 D 7011-4E

Claims (2)

[Claims] 1. An epoxy resin varnish obtained by adding a silicon-modified novolac-type phenol resin to a silicon-modified epoxy resin, and further adding a curing agent, a curing accelerator, a solvent, etc., if necessary, and drying the substrate. A resin-impregnated base material. 2. A resin-impregnated group obtained by impregnating a base material into an epoxy resin varnish obtained by adding a silicon-modified novolac type phenol resin to a silicon-modified epoxy resin, and further adding a curing agent, a curing accelerator, a solvent, etc., if necessary. A laminated board for electrical use, characterized in that a metal foil is arranged and formed on a top surface and / or a bottom surface of a required number of materials.