CN102870512A - Mounting board heat dissipating laminate - Google Patents
Mounting board heat dissipating laminate Download PDFInfo
- Publication number
- CN102870512A CN102870512A CN2011800151701A CN201180015170A CN102870512A CN 102870512 A CN102870512 A CN 102870512A CN 2011800151701 A CN2011800151701 A CN 2011800151701A CN 201180015170 A CN201180015170 A CN 201180015170A CN 102870512 A CN102870512 A CN 102870512A
- Authority
- CN
- China
- Prior art keywords
- base plate
- installation base
- laminated material
- heat radiation
- resin bed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
Abstract
The invention provides a mounting board heat dissipating laminate that can meet reductions in the weight, size, and thickness of electronic devices, and that can more efficiently dissipate the heat generated by electronic elements, even if electronic elements that generate large amounts of heat are mounted thereto. The mounting board heat dissipating laminate (1) is provided with an aluminum base layer (11), a resin layer (13) that is layered and adhered upon the aluminum base layer (11) via an adhesive layer (12), and a copper layer or an aluminum layer (15) that is layered and adhered upon the resin layer (13) via an adhesive layer (14).
Description
Technical field
The present invention relates in general to installation base plate with the heat radiation laminated material, specific relate to for the installation base plate that the large electronic component of caloric value is installed with the heat radiation laminated material, such as the installation base plate that is used for the light-emitting component such as diode installed (LED) with the laminated material that dispels the heat.
Background technology
The installation base plate that is formed with circuit at the single or double of insulating barrier is used in widely field.Circuit is formed by Copper Foil, aluminium foil or paste composite.Installing electronic elements on formed circuit.As the electronic component of installing, can enumerate: resistive element, capacitor, transistor, various power component (パ ワ one sub-prime); The high density such as MPU, CPU integrated circuit; Light-emitting component and their array elements such as light-emitting diode (LED), laser diode.
In recent years, more and more higher to the desired performance of electronic equipment, the power consumption of power component and high density integrated circuit has the tendency of increase in above-mentioned electronic component.In addition, developed the higher light-emitting component of brightness.But the increase of the caloric value that is caused by the raising of the brightness of the increase of the power consumption of power component and high density integrated circuit or light-emitting component brings harmful effect to electronic component itself and other electronic components of heating.For example can think that the electronic component of heating itself and other electronic components are because heat breaks down, because heat and performance reduces, owing to heat and the lost of life etc.Therefore, various structures for will effectively being removed, be spread by the heat that electronic component produces have been proposed.
For example, proposed to use the structure of radiating component overlay electronic element in the TOHKEMY 2010-3733 communique (patent documentation 1).At this, as radiating component, use the member that in having stable on heating epoxy resin, contains the filler with good thermal conductivity.
In addition, following structure has been proposed: in the component mounting surface side of circuit installation base plate, set the heat-radiating substrate that is consisted of by the mixture of inorganic filler, thermosetting resin and pregelatinated material (プ レ ゲ Le material) with concaveconvex shape in the TOHKEMY 2004-172370 communique (patent documentation 2).
But these structures are not used in the electronic equipment that more and more requires lightweight and miniaturization.Therefore, adopt the material with thermal diffusivity with laminated material at the installation base plate that is used for installing electronic elements.As such material, for example use lamination that widely used glass epoxide class " FR-4 " and the glass composite material class " CEM3 " of electrolytic copper foil are arranged.The formation of the used for printed circuit laminated sheet (insulating barrier) more cheap than above-mentioned material has been proposed in the Japanese kokai publication hei 11-5276 communique (patent documentation 3) in addition.
On the other hand, in recent years, in the portable electronic devices such as mobile phone, digital camera, audio player, recorder, game machine, except lightweight and miniaturization, also require slimming.If the installation base plate that is used for installing electronic elements can be laminated directly to supporter or the casing of portable electronic device, then effective to slimming.But, as the installation base plate laminated material that is used for installing electronic elements, even adopt existing " FR-4 " or " CEM3 " material, because insulating properties is insufficient, therefore, also can't guarantee portable electronic device desired be used to preventing small level electric shock and the fail safe of the possibility of fault.In addition, when adopting above-mentioned material and expectation to guarantee sufficient insulating properties, the thickness of material need to acquire a certain degree, and therefore, as the installation base plate laminated material, not only becomes heavy, and the bendability variation.Therefore, can't be with this installation base plate with laminated material to carry out lamination (applying) along the supporter of portable electronic device or the face of casing and the mode of its driving fit.
In addition, the slim TVs such as LCD TV, the tendency of the in recent years more and more large-scale change of existence.But for slim TV, when picture was maximized, also expectation made the as much as possible lightweight of TV main body and slimming.In addition, in order to tackle such requirement, also liquid crystal back light device is carried out lightweight and slimming, therefore, for example put down in writing in the TOHKEMY 2000-340019 communique (patent documentation 4), adopt the liquid crystal back light device of side edge type.In addition, for example TOHKEMY 2009-272451 communique (patent documentation 5) is put down in writing, and for slimming and reduction power consumption, as the light source of liquid crystal back light device, uses LED.LED directly is installed on the insulated substrate.In order to tackle the trend of such technical elements, the heat by LED produces need to spread to the face with the face opposition side that LED is installed with laminated material by installation base plate.Particularly the liquid crystal back light device of side edge type is equipped with a plurality of LED owing on its structure at per unit area, thereby for installation base plate higher thermal diffusivity of requirement for laminated material.
The prior art document
Patent documentation
Patent documentation 1: TOHKEMY 2010-3733 communique
Patent documentation 2: TOHKEMY 2004-172370 communique
Patent documentation 3: Japanese kokai publication hei 11-5276 communique
Patent documentation 4: TOHKEMY 2000-340019 communique
Patent documentation 5: TOHKEMY 2009-272451 communique
Summary of the invention
Invent problem to be solved
Therefore, the object of the invention is to, a kind of installation base plate heat radiation laminated material is provided, it can tackle lightweight, miniaturization and the slimming of electronic equipment, and even the large electronic component of caloric value is installed, the heat that is produced by this electronic component is more effectively spread.
For the method for dealing with problems
To achieve these goals, the inventor conducts in-depth research with the heat radiation insulating properties that originally requires of laminated material but also the formation that can have the material of thermal diffusivity, bendability, light weight concurrently for not only possessing installation base plate.The present application is that the inventor's that obtains according to above-mentioned result of study opinion is finished.
That is, installation base plate of the present invention possesses with the heat radiation laminated material: the aluminium base layer, on this aluminium base layer across adhesive layer and lamination, fixing resin bed and on this resin bed across adhesive layer and lamination, fixing copper layer or aluminium lamination.
Installation base plate of the present invention is with in the heat radiation laminated material, and the thickness of aluminium base layer is preferably more than the 20 μ m and below the 350 μ m.
In addition, installation base plate of the present invention is with in the heat radiation laminated material, and the glass transition temperature of resin bed is preferably more than 250 ℃.
In addition, installation base plate of the present invention is with in the heat radiation laminated material, and the insulation breakdown voltage of resin bed is preferably more than the 5kV.
In addition, installation base plate of the present invention is with in the heat radiation laminated material, and the thickness of resin bed is preferably more than the 10 μ m and below the 100 μ m.
Need to prove that installation base plate of the present invention is with in the heat radiation laminated material, resin bed preferably comprises polyimides, PEN, PETG, fluoride resin or fluoride resin copolymer.
Installation base plate of the present invention is with in the heat radiation laminated material, and the thickness of adhesive layer is preferably more than the 3 μ m and below the 30 μ m.
The invention effect
According to the present invention, installation base plate heat radiation laminated material, the resin bed that possesses the good aluminium base layer of light weight, thermal diffusivity (thermal conductivity) and bendability and assurance insulating properties, therefore, can tackle lightweight, miniaturization and the slimming of electronic equipment, and even the large electronic component of caloric value is installed, the heat that is produced by this electronic component is more effectively spread.
Description of drawings
Fig. 1 is the schematic cross-sectional structure of heat radiation laminated material is used in expression as the installation base plate of an embodiment of the invention figure.
Embodiment
Below, based on accompanying drawing, an embodiment of the invention are described.
As shown in Figure 1, installation base plate possesses with heat radiation laminated material 1: aluminium base layer 11, on the aluminium base layer 11 across adhesive layer 12 and lamination, fixing resin bed 13 and on resin bed 13 across adhesive layer 14 and lamination, fixing copper layer 15.
(aluminium base layer)
For the thickness of aluminium base layer 11, for light weight, miniaturization, the slimming that helps electronic equipment, and make the processing transfiguration easy, thereby the thermal diffusivity of playing stably, be preferably more than the 20 μ m and below the 350 μ m, more preferably more than the 80 μ m and below the 300 μ m, more preferably more than the 100 μ m and below the 250 μ m.The thickness of aluminium base layer 11 can't obtain the effect of stable thermal diffusivity during less than 20 μ m.When the thickness of aluminium base layer 11 surpassed 350 μ m, processing became difficulty, and can hinder lightweight, miniaturization and slimming.
(resin bed)
The thickness of resin bed 13 for insulating properties and the thermal diffusivity of playing stably, is preferably more than the 10 μ m and below the 100 μ m, more preferably 10 ~ 50 μ m.The thickness of resin bed 13 can't obtain the effect of stable insulating properties during less than 10 μ m.When the thickness of resin bed 13 surpasses 100 μ m, become the reason that thermal diffusivity reduces.
(copper layer)
About the thickness of copper layer 15, in order easily to form circuit by etching, and with the mode lamination of driving fit on resin bed 13, it is above and below the 100 μ m to be preferably 5 μ m, more preferably 10 ~ 70 μ m.The thickness of copper layer 15 is during less than 5 μ m, becomes to be difficult to ground attractive in appearance (not produce the mode of fold etc.) driving fit on resin bed 13, lamination.When the thickness of copper layer 15 surpassed 100 μ m, becoming was difficult to form accurate circuit by etching.
Need to prove that installation base plate can arrange aluminium lamination and replace copper layer 15 with in the heat radiation laminated material 1.That is to say, also can on resin bed 13, laminated aluminum layers replace copper layer 15.Aluminium lamination can evaporation to resin bed 13, also can be laminated on the resin bed 13 across adhesive layer 14.
(adhesive layer)
About adhesive layer 12,14, in order to guarantee thermal endurance, preferably formed by widely used epoxies adhesive.Although conductive filling can improve thermal diffusivity, insulating properties is reduced, therefore, in adhesive layer 12,14, do not comprise conductive filling.
About adhesive layer 12,14 thickness separately, in order to bring into play good adaptation and not hinder heat radiation, be preferably more than the 3 μ m and below the 30 μ m. Adhesive layer 12,14 thickness separately causes that easily driving fit is insufficient or driving fit is uneven during less than 3 μ m, thereby becomes the reason that thermal diffusivity reduces.When adhesive layer 12,14 thickness separately surpasses 30 μ m, be difficult to lamination aluminium base layer 11 and resin bed 13, resin bed 13 and copper layer 15, therefore, become the reason that thermal diffusivity reduces.
Below, embodiments of the invention are described particularly.Need to prove that the embodiment that below illustrates is an example, the present invention is not limited to following embodiment.
Embodiment
Make the installation base plate shown in Figure 1 sample of the embodiment of heat radiation laminated material 1.For relatively, measure existing installation base plate heat radiation lamination properties of materials.
(embodiment 1)
As resin bed 13, prepare glass transition temperature (Tg) and be 310 ℃, insulation breakdown voltage and be 9.4kV, percent thermal shrinkage and be 0%, thickness is the polyimide film of 25 μ m.Each characteristic value of glass transition temperature, insulation breakdown voltage and percent thermal shrinkage is measured by the aftermentioned method.
Use the epoxies adhesive by the dry lamination method, gluing thickness as copper layer 15 is the electrolytic copper foil of 35 μ m on the single face of resin bed 13.The thickness of formed adhesive layer 14 is 15 μ m.
Use the epoxies adhesive by the dry lamination method, gluing thickness as aluminium base layer 11 is the aluminium foil of 150 μ m on another face of above-mentioned resin bed 13.The thickness of formed adhesive layer 12 is 15 μ m.
Measure insulation breakdown voltage and the thermal conductivity that the installation base plate of as above making is used heat radiation laminated material 1 by the aftermentioned method.With this result with installation base plate with the heat radiation laminated material 1 thickness be shown in table 1.
(conventional example 1)
Similarly be determined at laminate thickness on the glass epoxide resinoid and be commercially available installation base plate that the electrolytic copper foil of 35 μ m forms with the heat radiation laminated material, be FR-4 (Matsushita Electric Industrial Co., Ltd's system, model: R-1700) insulation breakdown voltage and thermal conductivity.With this result with installation base plate with the heat radiation laminated material thickness be shown in table 1.
(conventional example 2)
Similarly be determined at laminate thickness on the glass composite material resinoid and be commercially available installation base plate that the electrolytic copper foil of 35 μ m forms with the heat radiation laminated material, be CEM3 (Matsushita Electric Industrial Co., Ltd's system, model: R-1786) insulation breakdown voltage and thermal conductivity.With this result with installation base plate with the heat radiation laminated material thickness be shown in table 1.
Following mensuration as the installation base plate that is used for making embodiment 1 each characteristic value with the polyimide film of the resin bed 13 of heat radiation laminated material 1.
(glass transition temperature)
Use differential scanning calorimetry (DSC) (DSC), based on JIS K7121 and JIS K7122, measure the glass transition temperature of polyimide film.
(insulation breakdown voltage)
Based on JIS C2110:1994, in the atmosphere of 25 ± 5 ℃ of temperature, relative humidity 65 ± 5%, make the voltage that applies begin to rise from 0V with the speed of per 1 second 1000V, measure the insulation breakdown voltage of polyimide film.
Prepare the polyimide film that 10 chip sizes are 200mm * 200mm, measure 3 points to per 1 after, obtain the mean value of remaining 20 points behind each 5 of the high value cast out in whole measured values and the low values.This mean value is estimated as the insulation breakdown voltage of polyimide film.
(percent thermal shrinkage)
From the polyimide film of view picture (former anti-) vertically and laterally, cut respectively each 5 of the test films of the polyimide film of width 20mm, length 150mm.Two meterings of the range mark punctuate that separates about 100mm at the central portion of each test film.For each test film, measure the spacing (the metering punctuate spacing before the heating) of two metering punctuates.Then, based on JIS C2318:1988, vertically hang each test film of polyimide film in the insulating box under remaining 150 ℃ ± 3 ℃ of temperature, heat after 2 hours, from insulating box, take out test film, then, test film was at room temperature placed 30 minutes, afterwards each test film is measured the spacing (the metering punctuate spacing after the heating) of two metering punctuates.For each test film, obtain the mean value of the metering punctuate spacing of before and after heating, measuring.By the mean value substitution following formula of the metering punctuate spacing before and after will heating, calculate the heat shrink rate of polyimide film.
Heat shrink rate (%)=((L
1-L
2)/L
1) * 100
L
1: the metering punctuate spacing (mm) before the heating
L
2: the metering punctuate spacing (mm) after the heating
The installation base plate of following mensuration embodiment 1 is used insulation breakdown voltage and the thermal conductivity of heat radiation laminated material with the installation base plate of heat radiation laminated material 1 and conventional example 1 ~ 2.
(insulation breakdown voltage)
Based on ASTM D149, in the atmosphere of 25 ± 5 ℃ of temperature, relative humidity 65 ± 5%, make the voltage that applies begin to rise from 0V with the speed of per 1 second 500V, measure installation base plate with the insulation breakdown voltage of heat radiation laminated material.
The installation base plate of preparing 10 chip sizes and be 100mm * 100mm is with the heat radiation laminated material, measure 3 points to per 1 after, obtain the mean value of remaining 20 points behind each 5 of the high value cast out in whole measured values and the low values.This mean value is estimated with the insulation breakdown voltage of heat radiation laminated material as installation base plate.
(thermal conductivity)
Use thermal constant determinator (Ai Fake science and engineering Co., Ltd. system, article number: TC-7000), by laser flash method, measure the thermal conductivity that installation base plate is used the heat radiation laminated material.
Table 1
As shown in Table 1, the installation base plate of embodiment 1 heat radiation laminated material 1, compare with the heat radiation laminated material with the installation base plate of conventional example 1 ~ 2, layer thickness is thinner, therefore, bendability is good, and thermal conductivity is high, and demonstrates the insulation breakdown voltage of using heat radiation laminated material peer-level with the installation base plate of conventional example 1 ~ 2.
(embodiment 2)
Among the embodiment 2, use the copper of aluminium substitution embodiment 1.Among the embodiment 2, aluminium lamination 15 (japan Aluminum Co., Ltd's system, aluminium foil 1N30 material hard 50 μ m paper tinsels) is glued on the single face of resin bed 13.
Installation base plate insulation breakdown voltage and the thermal conductivity of heat radiation laminated material 1 of measuring similarly to Example 1 embodiment 2.The results are shown in table 2.
Table 2
As shown in Table 2, the installation base plate of embodiment 2 heat radiation laminated material 1, compare with heat radiation laminated material (with reference to table 1) with the installation base plate of conventional example 1 ~ 2, layer thickness is thinner, therefore, bendability is good, and thermal conductivity is high, and demonstrates the insulation breakdown voltage of using heat radiation laminated material peer-level with the installation base plate of conventional example 1 ~ 2.
Should think that execution mode disclosed herein and embodiment are illustration in all respects, do not limit the present invention.Scope of the present invention is not above execution mode and embodiment, but illustrates by claims, is included in implication and all modifications in the scope and distortion with claims equalization.
The possibility of utilizing on the industry
Installation base plate of the present invention heat radiation laminated material, the resin bed that possesses the good aluminium base layer of light weight, thermal diffusivity (thermal conductivity) and bendability and assurance insulating properties, therefore, can tackle lightweight, miniaturization and the slimming of electronic equipment, and even the large electronic component of caloric value is installed, the heat that is produced by this electronic component is more effectively spread.
Label declaration
1: installation base plate heat radiation laminated material, 11: aluminium base layer, 12,14: adhesive layer, 13: resin bed, 15: copper layer, 15: aluminium lamination.
Claims (7)
1. an installation base plate is with heat radiation laminated material (1), and it possesses:
Aluminium base layer (11),
Described aluminium base layer (11) upper across adhesive layer (12) and lamination, fixing resin bed (13) and
Upper across adhesive layer (14) and lamination, fixing copper layer or aluminium lamination (15) at described resin bed (13).
2. installation base plate as claimed in claim 1 is with heat radiation laminated material (1), and wherein, the thickness of described aluminium base layer (11) is that 20 μ m are above and below the 350 μ m.
3. installation base plate as claimed in claim 1 is with heat radiation laminated material (1), and wherein, the glass transition temperature of described resin bed (13) is more than 250 ℃.
4. installation base plate as claimed in claim 1 is with heat radiation laminated material (1), and wherein, the insulation breakdown voltage of described resin bed (13) is more than the 5kV.
5. installation base plate as claimed in claim 1 is with heat radiation laminated material (1), and wherein, the thickness of described resin bed (13) is that 10 μ m are above and below the 100 μ m.
6. installation base plate as claimed in claim 1 is with heat radiation laminated material (1), wherein, described resin bed (13) comprises and is selected from a kind of in the group that is comprised of polyimides, PEN, PETG, fluoride resin or fluoride resin copolymer.
7. installation base plate as claimed in claim 1 is with heat radiation laminated material (1), and wherein, the thickness of described adhesive layer (12,14) is that 3 μ m are above and below the 30 μ m.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010065599 | 2010-03-23 | ||
| JP2010-065599 | 2010-03-23 | ||
| PCT/JP2011/054842 WO2011118352A1 (en) | 2010-03-23 | 2011-03-03 | Mounting board heat dissipating laminate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102870512A true CN102870512A (en) | 2013-01-09 |
Family
ID=44672920
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011800151701A Pending CN102870512A (en) | 2010-03-23 | 2011-03-03 | Mounting board heat dissipating laminate |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2011118352A1 (en) |
| KR (1) | KR20120082947A (en) |
| CN (1) | CN102870512A (en) |
| TW (1) | TW201204195A (en) |
| WO (1) | WO2011118352A1 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9232634B2 (en) | 2011-01-17 | 2016-01-05 | Canon Components, Inc. | Flexible circuit board for mounting light emitting element, illumination apparatus, and vehicle lighting apparatus |
| CN103025127A (en) * | 2012-12-05 | 2013-04-03 | 吴江朗恩电子科技有限公司 | Radiating film |
| JP6437293B2 (en) * | 2014-12-10 | 2018-12-12 | ユニチカ株式会社 | Metal base board |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63265486A (en) * | 1987-04-23 | 1988-11-01 | Matsushita Electric Ind Co Ltd | Printed circuit board |
| JPH07302978A (en) * | 1994-05-09 | 1995-11-14 | Denki Kagaku Kogyo Kk | Metal-based multilayer circuit board |
| JPH08125294A (en) * | 1994-10-27 | 1996-05-17 | Matsushita Electric Ind Co Ltd | Metal base board and manufacture thereof |
| CN200980202Y (en) * | 2006-12-05 | 2007-11-21 | 邵建良 | A copper foil board with metal matrix |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03153092A (en) * | 1989-11-10 | 1991-07-01 | Mitsubishi Heavy Ind Ltd | Electronic substrate |
-
2011
- 2011-03-03 KR KR1020127015173A patent/KR20120082947A/en not_active Application Discontinuation
- 2011-03-03 CN CN2011800151701A patent/CN102870512A/en active Pending
- 2011-03-03 WO PCT/JP2011/054842 patent/WO2011118352A1/en active Application Filing
- 2011-03-03 JP JP2012506905A patent/JPWO2011118352A1/en active Pending
- 2011-03-22 TW TW100109677A patent/TW201204195A/en unknown
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63265486A (en) * | 1987-04-23 | 1988-11-01 | Matsushita Electric Ind Co Ltd | Printed circuit board |
| JPH07302978A (en) * | 1994-05-09 | 1995-11-14 | Denki Kagaku Kogyo Kk | Metal-based multilayer circuit board |
| JPH08125294A (en) * | 1994-10-27 | 1996-05-17 | Matsushita Electric Ind Co Ltd | Metal base board and manufacture thereof |
| CN200980202Y (en) * | 2006-12-05 | 2007-11-21 | 邵建良 | A copper foil board with metal matrix |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2011118352A1 (en) | 2013-07-04 |
| WO2011118352A1 (en) | 2011-09-29 |
| TW201204195A (en) | 2012-01-16 |
| KR20120082947A (en) | 2012-07-24 |
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| PB01 | Publication | ||
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130109 |