JPS63260047A - ウエハ−保持体 - Google Patents
ウエハ−保持体Info
- Publication number
- JPS63260047A JPS63260047A JP62125192A JP12519287A JPS63260047A JP S63260047 A JPS63260047 A JP S63260047A JP 62125192 A JP62125192 A JP 62125192A JP 12519287 A JP12519287 A JP 12519287A JP S63260047 A JPS63260047 A JP S63260047A
- Authority
- JP
- Japan
- Prior art keywords
- rods
- wafer
- trapezoid
- wafers
- wafer holder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 235000012431 wafers Nutrition 0.000 claims abstract description 89
- 239000000284 extract Substances 0.000 claims 1
- 238000009434 installation Methods 0.000 abstract description 3
- 230000003028 elevating effect Effects 0.000 description 10
- 238000003860 storage Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 5
- 238000005530 etching Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 238000009832 plasma treatment Methods 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000004380 ashing Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
- Drying Of Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62125192A JPS63260047A (ja) | 1987-05-22 | 1987-05-22 | ウエハ−保持体 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62125192A JPS63260047A (ja) | 1987-05-22 | 1987-05-22 | ウエハ−保持体 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15928181A Division JPS5860552A (ja) | 1981-10-05 | 1981-10-05 | 縦型自動プラズマ処理装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63260047A true JPS63260047A (ja) | 1988-10-27 |
| JPH0359581B2 JPH0359581B2 (enrdf_load_stackoverflow) | 1991-09-11 |
Family
ID=14904194
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62125192A Granted JPS63260047A (ja) | 1987-05-22 | 1987-05-22 | ウエハ−保持体 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63260047A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06177073A (ja) * | 1992-12-07 | 1994-06-24 | Nippon Ee S M Kk | エッチング装置 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5860552A (ja) * | 1981-10-05 | 1983-04-11 | Tokyo Denshi Kagaku Kabushiki | 縦型自動プラズマ処理装置 |
| JPS6279646A (ja) * | 1985-10-02 | 1987-04-13 | Oki Electric Ind Co Ltd | ウエハ移載装置 |
-
1987
- 1987-05-22 JP JP62125192A patent/JPS63260047A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5860552A (ja) * | 1981-10-05 | 1983-04-11 | Tokyo Denshi Kagaku Kabushiki | 縦型自動プラズマ処理装置 |
| JPS6279646A (ja) * | 1985-10-02 | 1987-04-13 | Oki Electric Ind Co Ltd | ウエハ移載装置 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06177073A (ja) * | 1992-12-07 | 1994-06-24 | Nippon Ee S M Kk | エッチング装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0359581B2 (enrdf_load_stackoverflow) | 1991-09-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6637446B2 (en) | Integrated substrate processing system | |
| KR100639765B1 (ko) | 기판 처리 장치, 기판 처리 방법 및 반도체 장치의 제조방법 | |
| JP3076179B2 (ja) | ダイシング装置 | |
| US6511895B2 (en) | Semiconductor wafer turning process | |
| JPH11307614A (ja) | 半導体素子製造用エッチング設備のマルチチャンバーシステム | |
| JPH10139159A (ja) | カセットチャンバ及びカセット搬入搬出機構 | |
| JPH0666295B2 (ja) | 多段プラズマ処理装置 | |
| JPH10284577A (ja) | 被処理基板の移載方法 | |
| JPS6325500B2 (enrdf_load_stackoverflow) | ||
| JPS63260047A (ja) | ウエハ−保持体 | |
| JP2739413B2 (ja) | 基板搬送用スカラ型ロボット | |
| JPS5860553A (ja) | 縦型自動プラズマ処理装置 | |
| JP2003173987A (ja) | 半導体チップの製造方法 | |
| JPH0735393Y2 (ja) | 縦型プラズマ処理機のウエハー搬送装置 | |
| JP4564695B2 (ja) | ウェーハカセット並びに半導体ウェーハの搬入方法及び搬出方法 | |
| JP2011066423A (ja) | 基板処理装置および半導体装置の製造方法 | |
| CN107393853B (zh) | 一种后置型设备前端装载模块 | |
| JP3205525B2 (ja) | 基板の取出装置，搬入装置及び取出搬入装置 | |
| JPH07201951A (ja) | 処理装置及びその使用方法 | |
| JPH0219969B2 (enrdf_load_stackoverflow) | ||
| JPH07297154A (ja) | 基板搬送装置 | |
| JP2005223359A (ja) | 半導体ウェハの加工方法 | |
| JP3336225B2 (ja) | 基板の処理システム及び処理方法 | |
| JP2001257186A (ja) | 半導体ウェハの加工方法 | |
| JPH06252251A (ja) | 受渡し装置 |