JPS63255368A - 成膜装置 - Google Patents

成膜装置

Info

Publication number
JPS63255368A
JPS63255368A JP8881387A JP8881387A JPS63255368A JP S63255368 A JPS63255368 A JP S63255368A JP 8881387 A JP8881387 A JP 8881387A JP 8881387 A JP8881387 A JP 8881387A JP S63255368 A JPS63255368 A JP S63255368A
Authority
JP
Japan
Prior art keywords
substrate
film thickness
partition plate
film
evaporation source
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8881387A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0419302B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
Yoshifumi Ogawa
芳文 小川
Toru Yukimasa
行正　亨
Saburo Kanai
三郎 金井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP8881387A priority Critical patent/JPS63255368A/ja
Publication of JPS63255368A publication Critical patent/JPS63255368A/ja
Publication of JPH0419302B2 publication Critical patent/JPH0419302B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Physical Vapour Deposition (AREA)
JP8881387A 1987-04-13 1987-04-13 成膜装置 Granted JPS63255368A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8881387A JPS63255368A (ja) 1987-04-13 1987-04-13 成膜装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8881387A JPS63255368A (ja) 1987-04-13 1987-04-13 成膜装置

Publications (2)

Publication Number Publication Date
JPS63255368A true JPS63255368A (ja) 1988-10-21
JPH0419302B2 JPH0419302B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-03-30

Family

ID=13953339

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8881387A Granted JPS63255368A (ja) 1987-04-13 1987-04-13 成膜装置

Country Status (1)

Country Link
JP (1) JPS63255368A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63310965A (ja) * 1987-06-11 1988-12-19 Anelva Corp スパッタリング装置
US5527438A (en) * 1994-12-16 1996-06-18 Applied Materials, Inc. Cylindrical sputtering shield
EP0837491A2 (en) * 1996-10-21 1998-04-22 Nihon Shinku Gijutsu Kabushiki Kaisha Composite sputtering cathode assembly and sputtering apparatus with such composite sputtering cathode assembly
JP2000133453A (ja) * 1998-10-22 2000-05-12 Idemitsu Kosan Co Ltd 有機エレクトロルミネッセンス素子およびその製造方法
US6413392B1 (en) * 1999-06-24 2002-07-02 Nihon Shinku Gijutsu Kabushiki Kaisha Sputtering device
WO2013001714A1 (ja) * 2011-06-30 2013-01-03 キヤノンアネルバ株式会社 成膜装置
WO2013035225A1 (ja) * 2011-09-09 2013-03-14 キヤノンアネルバ株式会社 成膜装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6182347A (ja) * 1984-09-29 1986-04-25 Nec Home Electronics Ltd 光記録媒体製造装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6182347A (ja) * 1984-09-29 1986-04-25 Nec Home Electronics Ltd 光記録媒体製造装置

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63310965A (ja) * 1987-06-11 1988-12-19 Anelva Corp スパッタリング装置
US5527438A (en) * 1994-12-16 1996-06-18 Applied Materials, Inc. Cylindrical sputtering shield
EP0837491A2 (en) * 1996-10-21 1998-04-22 Nihon Shinku Gijutsu Kabushiki Kaisha Composite sputtering cathode assembly and sputtering apparatus with such composite sputtering cathode assembly
JP2000133453A (ja) * 1998-10-22 2000-05-12 Idemitsu Kosan Co Ltd 有機エレクトロルミネッセンス素子およびその製造方法
US6413392B1 (en) * 1999-06-24 2002-07-02 Nihon Shinku Gijutsu Kabushiki Kaisha Sputtering device
WO2013001714A1 (ja) * 2011-06-30 2013-01-03 キヤノンアネルバ株式会社 成膜装置
JP5662575B2 (ja) * 2011-06-30 2015-02-04 キヤノンアネルバ株式会社 成膜装置
US9322094B2 (en) 2011-06-30 2016-04-26 Canon Anelva Corporation Film-forming apparatus
WO2013035225A1 (ja) * 2011-09-09 2013-03-14 キヤノンアネルバ株式会社 成膜装置
JP5662583B2 (ja) * 2011-09-09 2015-02-04 キヤノンアネルバ株式会社 成膜装置
US9109285B2 (en) 2011-09-09 2015-08-18 Canon Anelva Corporation Film-forming apparatus

Also Published As

Publication number Publication date
JPH0419302B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-03-30

Similar Documents

Publication Publication Date Title
JP2962912B2 (ja) 陰極スパッタリング装置で基板を被覆するためのスパッタカソード
JPH04268075A (ja) 真空蒸着装置用の定置のマグネトロン−スパッタリング陰極
JPS63255368A (ja) 成膜装置
JP2001064770A (ja) スパッタリング装置
US3523517A (en) Rotating workpiece holder
CN100540726C (zh) 用于镀覆表面的模块化装置
JPH02251143A (ja) イオンビーム式スパッタリング装置
EP0023573B1 (en) Sputtering system to process a batch of wafers
JPH0768614B2 (ja) カルーセル形スパツタリング装置およびそのスパツタリング方法
JPS6473075A (en) Film forming device by ion beam sputtering
JPH1150239A (ja) Ｐｖｄ装置
JPH05320892A (ja) 真空薄膜形成装置
JPS60197869A (ja) スパツタ装置
JPH02250963A (ja) スパッタリング装置
JPH0526755Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP3038288B2 (ja) 厚膜作成装置
JPH06116725A (ja) マグネトロンスパッタ装置
JPH04202773A (ja) 成膜方法及びこの方法に使用する補正体
JPH0589448U (ja) スパッタリング装置
JPH0241586B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPS63317661A (ja) イオン蒸着薄膜形成装置
JPH0347571B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPS58199863A (ja) 薄膜形成装置
JPS62222059A (ja) スパツタリング方法
JPS639013B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)