JPS6325519B2 - - Google Patents
Info
- Publication number
- JPS6325519B2 JPS6325519B2 JP53080494A JP8049478A JPS6325519B2 JP S6325519 B2 JPS6325519 B2 JP S6325519B2 JP 53080494 A JP53080494 A JP 53080494A JP 8049478 A JP8049478 A JP 8049478A JP S6325519 B2 JPS6325519 B2 JP S6325519B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring layer
- forming
- layer
- insulating film
- connection layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 claims description 24
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 8
- 238000001259 photo etching Methods 0.000 claims description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- 238000009835 boiling Methods 0.000 claims description 5
- 230000003647 oxidation Effects 0.000 claims description 5
- 238000007254 oxidation reaction Methods 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 4
- 238000007740 vapor deposition Methods 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 230000001590 oxidative effect Effects 0.000 claims description 2
- 238000007743 anodising Methods 0.000 claims 2
- 229920002120 photoresistant polymer Polymers 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910002065 alloy metal Inorganic materials 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8049478A JPS558054A (en) | 1978-07-04 | 1978-07-04 | Method of manufacturing multiilayer wiring layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8049478A JPS558054A (en) | 1978-07-04 | 1978-07-04 | Method of manufacturing multiilayer wiring layer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS558054A JPS558054A (en) | 1980-01-21 |
| JPS6325519B2 true JPS6325519B2 (US06878557-20050412-C00065.png) | 1988-05-25 |
Family
ID=13719845
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8049478A Granted JPS558054A (en) | 1978-07-04 | 1978-07-04 | Method of manufacturing multiilayer wiring layer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS558054A (US06878557-20050412-C00065.png) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003173929A (ja) * | 2001-09-26 | 2003-06-20 | Mitsui Mining & Smelting Co Ltd | キャパシタ層形成用の積層板及びその製造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4998587A (US06878557-20050412-C00065.png) * | 1973-01-22 | 1974-09-18 |
-
1978
- 1978-07-04 JP JP8049478A patent/JPS558054A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4998587A (US06878557-20050412-C00065.png) * | 1973-01-22 | 1974-09-18 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS558054A (en) | 1980-01-21 |
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