JPS63254031A - 回路基板の製造方法 - Google Patents

回路基板の製造方法

Info

Publication number
JPS63254031A
JPS63254031A JP62088538A JP8853887A JPS63254031A JP S63254031 A JPS63254031 A JP S63254031A JP 62088538 A JP62088538 A JP 62088538A JP 8853887 A JP8853887 A JP 8853887A JP S63254031 A JPS63254031 A JP S63254031A
Authority
JP
Japan
Prior art keywords
adhesive
powder
ceramic substrate
bonding
metal plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62088538A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0468138B2 (enrdf_load_stackoverflow
Inventor
孝志 荘司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Holdings Corp
Original Assignee
Showa Denko KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko KK filed Critical Showa Denko KK
Priority to JP62088538A priority Critical patent/JPS63254031A/ja
Publication of JPS63254031A publication Critical patent/JPS63254031A/ja
Publication of JPH0468138B2 publication Critical patent/JPH0468138B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP62088538A 1987-04-10 1987-04-10 回路基板の製造方法 Granted JPS63254031A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62088538A JPS63254031A (ja) 1987-04-10 1987-04-10 回路基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62088538A JPS63254031A (ja) 1987-04-10 1987-04-10 回路基板の製造方法

Publications (2)

Publication Number Publication Date
JPS63254031A true JPS63254031A (ja) 1988-10-20
JPH0468138B2 JPH0468138B2 (enrdf_load_stackoverflow) 1992-10-30

Family

ID=13945619

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62088538A Granted JPS63254031A (ja) 1987-04-10 1987-04-10 回路基板の製造方法

Country Status (1)

Country Link
JP (1) JPS63254031A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016162919A (ja) * 2015-03-03 2016-09-05 国立大学法人大阪大学 接合構造体および接合構造体の製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58189307A (ja) * 1982-03-04 1983-11-05 ハンチントン・アロイス・インコ−ポレ−テツド 機械的合金化粉末の製造方法
JPS6063337A (ja) * 1983-09-14 1985-04-11 Sumitomo Electric Ind Ltd 耐熱性導電材料
JPS60208402A (ja) * 1984-04-02 1985-10-21 Fukuda Kinzoku Hakufun Kogyo Kk 分散強化型銅合金粉末の製造方法
JPS6132752A (ja) * 1984-07-25 1986-02-15 松下電工株式会社 セラミツクス回路板の製法
JPS61125195A (ja) * 1984-11-22 1986-06-12 松下電工株式会社 セラミツクス回路板の製法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58189307A (ja) * 1982-03-04 1983-11-05 ハンチントン・アロイス・インコ−ポレ−テツド 機械的合金化粉末の製造方法
JPS6063337A (ja) * 1983-09-14 1985-04-11 Sumitomo Electric Ind Ltd 耐熱性導電材料
JPS60208402A (ja) * 1984-04-02 1985-10-21 Fukuda Kinzoku Hakufun Kogyo Kk 分散強化型銅合金粉末の製造方法
JPS6132752A (ja) * 1984-07-25 1986-02-15 松下電工株式会社 セラミツクス回路板の製法
JPS61125195A (ja) * 1984-11-22 1986-06-12 松下電工株式会社 セラミツクス回路板の製法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016162919A (ja) * 2015-03-03 2016-09-05 国立大学法人大阪大学 接合構造体および接合構造体の製造方法

Also Published As

Publication number Publication date
JPH0468138B2 (enrdf_load_stackoverflow) 1992-10-30

Similar Documents

Publication Publication Date Title
US6309737B1 (en) Circuit substrate
EP2811513A1 (en) Substrate for power modules, substrate with heat sink for power modules, power module, method for producing substrate for power modules, and paste for bonding copper member
US20090283309A1 (en) Ceramic-metal bonded body, method for manufacturing the bonded body and semi-conductor device using the bonded body
JPS6232695A (ja) セラミツクス回路基板
WO2021200242A1 (ja) ろう材およびその製造方法並びに金属－セラミックス接合基板の製造方法
JP4293406B2 (ja) 回路基板
JP3495051B2 (ja) セラミックス−金属接合体
JP2501835B2 (ja) 金属質接着材料
JPH05148053A (ja) セラミツクス−金属接合体
JP2571233B2 (ja) 回路基板の製造方法
JPS63254031A (ja) 回路基板の製造方法
JPS63256291A (ja) 接着用材料
US5613181A (en) Co-sintered surface metallization for pin-join, wire-bond and chip attach
JPH0347901A (ja) 接着用材料
JP3302714B2 (ja) セラミックス−金属接合体
JP3482580B2 (ja) 高放熱性金属複合板材及びそれを用いた高放熱性金属基板
JPH0597533A (ja) セラミツクス−金属接合用組成物およびセラミツクス−金属接合体
JPH0378191B2 (enrdf_load_stackoverflow)
JPS6387790A (ja) 高放熱性回路基板の製造方法
JPH05246769A (ja) セラミックス−金属接合用組成物およびそれを用いたセラミックス−金属接合体
JPS6387791A (ja) 高放熱性回路基板の製造方法
JPS6342153A (ja) 混成集積回路基板及びその製造方法
JP3408598B2 (ja) メタライズ用金属粉末組成物、メタライズ基板およびその製造方法
JPH0570260A (ja) セラミツクと金属の接合用ロウペースト
KR20240115870A (ko) 구리-세라믹스 접합 기판 및 그 제조 방법