JPS63216353A - フイルムキヤリア - Google Patents

フイルムキヤリア

Info

Publication number
JPS63216353A
JPS63216353A JP62050693A JP5069387A JPS63216353A JP S63216353 A JPS63216353 A JP S63216353A JP 62050693 A JP62050693 A JP 62050693A JP 5069387 A JP5069387 A JP 5069387A JP S63216353 A JPS63216353 A JP S63216353A
Authority
JP
Japan
Prior art keywords
plating
conductive line
film carrier
wiring lead
film substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62050693A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0466385B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
Yoshio Suzuki
鈴木　美雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shindo Denshi Kogyo KK
Original Assignee
Shindo Denshi Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shindo Denshi Kogyo KK filed Critical Shindo Denshi Kogyo KK
Priority to JP62050693A priority Critical patent/JPS63216353A/ja
Publication of JPS63216353A publication Critical patent/JPS63216353A/ja
Publication of JPH0466385B2 publication Critical patent/JPH0466385B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Wire Bonding (AREA)
JP62050693A 1987-03-05 1987-03-05 フイルムキヤリア Granted JPS63216353A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62050693A JPS63216353A (ja) 1987-03-05 1987-03-05 フイルムキヤリア

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62050693A JPS63216353A (ja) 1987-03-05 1987-03-05 フイルムキヤリア

Publications (2)

Publication Number Publication Date
JPS63216353A true JPS63216353A (ja) 1988-09-08
JPH0466385B2 JPH0466385B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-10-23

Family

ID=12866003

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62050693A Granted JPS63216353A (ja) 1987-03-05 1987-03-05 フイルムキヤリア

Country Status (1)

Country Link
JP (1) JPS63216353A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Also Published As

Publication number Publication date
JPH0466385B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-10-23

Similar Documents

Publication Publication Date Title
JPH06216487A (ja) フレキシブルパターンの接続端子部
JPS63216353A (ja) フイルムキヤリア
JP2700259B2 (ja) プリント配線板における凹所を有する半田層の形成方法
JP3704651B2 (ja) プリント配線板及びその製造方法
JPH01173694A (ja) 両面スルホールフィルムキャリアの製造方法
JPS62296595A (ja) 印刷配線回路板の選択めつき方法
JPS60201692A (ja) 配線回路装置
JPH02229444A (ja) フィルムキャリアのメッキ用導電ライン除去方法
JPH087649Y2 (ja) プリント配線板
JP2942401B2 (ja) メッキ用治具
JPS5879795A (ja) プリント配線板の製造方法
JPH01119034A (ja) 電子部品搭載用フイルムキャリア
JPH0445986B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPS5841798B2 (ja) プリント板接栓部のめっき方法
JPH0231871B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPS614295A (ja) プリント配線板の製造方法
JPH0878824A (ja) 被接続板状体
JPS5827390A (ja) プリント基板のメッキ方法
JPS62141689A (ja) 接続装置
JPH05235200A (ja) 電子部品搭載用基板
JPS6251292A (ja) 配線回路基板の製造方法
JPH04267352A (ja) フィルムキャリアテープ
JPS5931097A (ja) 金属ベ−スプリント配線板の打抜き方法
JPS6014490A (ja) 印刷配線板の製造方法
JP2006156541A (ja) プリント配線板

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees