JPS632147B2 - - Google Patents

Info

Publication number
JPS632147B2
JPS632147B2 JP55179807A JP17980780A JPS632147B2 JP S632147 B2 JPS632147 B2 JP S632147B2 JP 55179807 A JP55179807 A JP 55179807A JP 17980780 A JP17980780 A JP 17980780A JP S632147 B2 JPS632147 B2 JP S632147B2
Authority
JP
Japan
Prior art keywords
case
sealing
base
resin powder
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55179807A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57103319A (en
Inventor
Toshio Matsushita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP17980780A priority Critical patent/JPS57103319A/ja
Publication of JPS57103319A publication Critical patent/JPS57103319A/ja
Publication of JPS632147B2 publication Critical patent/JPS632147B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP17980780A 1980-12-19 1980-12-19 Hermetically sealing method for electronic part Granted JPS57103319A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17980780A JPS57103319A (en) 1980-12-19 1980-12-19 Hermetically sealing method for electronic part

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17980780A JPS57103319A (en) 1980-12-19 1980-12-19 Hermetically sealing method for electronic part

Publications (2)

Publication Number Publication Date
JPS57103319A JPS57103319A (en) 1982-06-26
JPS632147B2 true JPS632147B2 (zh) 1988-01-18

Family

ID=16072229

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17980780A Granted JPS57103319A (en) 1980-12-19 1980-12-19 Hermetically sealing method for electronic part

Country Status (1)

Country Link
JP (1) JPS57103319A (zh)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5111571A (en) * 1974-07-19 1976-01-29 Nitto Electric Ind Co Denkikairososhino patsukeejihoho

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5111571A (en) * 1974-07-19 1976-01-29 Nitto Electric Ind Co Denkikairososhino patsukeejihoho

Also Published As

Publication number Publication date
JPS57103319A (en) 1982-06-26

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