JPS632147B2 - - Google Patents
Info
- Publication number
- JPS632147B2 JPS632147B2 JP55179807A JP17980780A JPS632147B2 JP S632147 B2 JPS632147 B2 JP S632147B2 JP 55179807 A JP55179807 A JP 55179807A JP 17980780 A JP17980780 A JP 17980780A JP S632147 B2 JPS632147 B2 JP S632147B2
- Authority
- JP
- Japan
- Prior art keywords
- case
- sealing
- base
- resin powder
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 claims description 23
- 239000011347 resin Substances 0.000 claims description 23
- 238000007789 sealing Methods 0.000 claims description 21
- 239000000843 powder Substances 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 13
- 229920001187 thermosetting polymer Polymers 0.000 claims description 4
- 238000003466 welding Methods 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 239000002966 varnish Substances 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
【発明の詳細な説明】
本発明は封着されたケースと基台との空間内に
回路素子が収容されている電子部品の気密封止方
法に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for hermetically sealing an electronic component in which a circuit element is housed in a space between a sealed case and a base.
この種電子部品の一例としてDIP（デユアル・
インライン・パツケージ）形の混成集積回路があ
る。 An example of this type of electronic component is DIP (Dual
There are hybrid integrated circuits in the form of in-line packages.
これは従来第１図に示す如く、抵抗、コンデン
サ等の回路素子１を実装した混成集積回路基板２
と、リード端子３をインサートモールド成形した
樹脂体からなる基台４と、モールド成形した樹脂
体からなるケース５を備え、回路基板２をリード
端子３に半田接続して基台４上へ実装した後ケー
ス５をかぶせ、両者の接合面Ａを超音波溶着によ
り封止して製作されている。 Conventionally, as shown in FIG. 1, this is a hybrid integrated circuit board 2 on which circuit elements 1 such as resistors and capacitors are mounted.
, a base 4 made of a resin body with lead terminals 3 molded by insert molding, and a case 5 made of a molded resin body, and a circuit board 2 is soldered to the lead terminals 3 and mounted on the base 4. It is manufactured by covering the rear case 5 and sealing the joint surface A between the two by ultrasonic welding.
このような電子部品においては回路基板２の良
好な電気特性を得るため耐湿性が要求されてお
り、基台４とケース５の気密封止は極めて重要な
問題である。 In such electronic components, moisture resistance is required in order to obtain good electrical characteristics of the circuit board 2, and hermetically sealing the base 4 and the case 5 is an extremely important issue.
ところで、従来ではこの気密封止手段として回
路基板２上にシリコンレジンによる塗膜６を形成
すると共にケース空間内に絶縁性のシリコンワニ
ス７を充填する方法を行なつているが、これでは
まだ気密が十分とは言えず更に気密性を高める必
要があり、且つ特に樹脂体同士の超音波溶着の場
合には特にこれを行なわなければならない。 By the way, conventionally, as this airtight sealing method, a coating film 6 of silicone resin is formed on the circuit board 2 and an insulating silicone varnish 7 is filled in the case space, but this method still does not provide airtight sealing. is not sufficient and it is necessary to further improve the airtightness, and this must be done particularly in the case of ultrasonic welding between resin bodies.
本発明はこのような問題点を解決させるもの
で、この目的は封着されたケースと基台との空間
内に回路素子が収容されている電子部品におい
て、前記封着前に前記空間内に熱硬化性樹脂粉末
を前記回路素子が埋まるように充填し、該樹脂粉
末を封着後に加熱して溶解させることにより、少
なくともこれの硬化した樹脂膜が前記ケースと前
記基台との接合部を内部から封止することを特徴
とした電子部品の気密封止方法により達成でき
る。 The present invention is intended to solve such problems, and the purpose is to provide an electronic component in which a circuit element is housed in a space between a sealed case and a base. By filling thermosetting resin powder so as to fill the circuit element and heating and melting the resin powder after sealing, at least the hardened resin film covers the joint between the case and the base. This can be achieved by a method for hermetically sealing electronic components, which is characterized by sealing from the inside.
以下、本発明の一実施例を第２図と第３図を参
照しながら詳述する。 Hereinafter, one embodiment of the present invention will be described in detail with reference to FIGS. 2 and 3.
第２，３図は本発明に係る気密封止方法を説明
するためのもので、第２図は基台４とケース５と
を超音波溶着した状態を示す部分断面図、第３図
は気密封止完成状態を示す部分断面図である。 Figures 2 and 3 are for explaining the airtight sealing method according to the present invention. Figure 2 is a partial sectional view showing the state in which the base 4 and the case 5 are ultrasonically welded, and Figure 3 is an airtight sealing method according to the present invention. FIG. 3 is a partial cross-sectional view showing a completed state of sealing.
本方法では基台４とケース５の空間内へのに充
填材が熱硬化性樹脂粉末であるエポキシ樹脂粉末
８〔例えば「Ｆ―240」（商品名）〕からなる点で
従来のシリコンワニス７と大きく異なる。尚、樹
脂粉末８の充填はケース５を第２図状態とは逆に
し開口側が上になるようにして入れ、該粉末８に
塗膜６を有する回路基板２が埋まるようケース５
に基台４をあてがい従来と同様に超音波溶着によ
り封着して行なう。 In this method, the filling material in the space between the base 4 and the case 5 is made of an epoxy resin powder 8 (for example, "F-240" (trade name)), which is a thermosetting resin powder, unlike the conventional silicone varnish 7. It is very different. When filling the resin powder 8, turn the case 5 in the opposite direction from the state shown in FIG.
The base 4 is attached to the base 4 and sealed by ultrasonic welding as in the conventional method.
次に、このように樹脂粉末８を充填し封着した
電子部品を第２図の如く接合面Ａが下に位置する
ようにして、加熱炉中に入れ150℃で１時間程度
加熱させる。この工程により樹脂粉末８は溶解
し、これが硬化することによりケース内には第３
図の如く樹脂膜９が形成される。この樹脂膜９は
接合面Ａを内部から封止し極めて良好な気密を実
現する。 Next, the electronic component filled with resin powder 8 and sealed is placed in a heating furnace with the bonding surface A facing downward as shown in FIG. 2, and heated at 150° C. for about one hour. Through this step, the resin powder 8 is melted, and as it hardens, a third layer is formed inside the case.
A resin film 9 is formed as shown in the figure. This resin film 9 seals the joint surface A from the inside and achieves extremely good airtightness.
尚、樹脂粉末８は回路基板２が埋まるようにケ
ース５内に充填されているため、第３図には図示
されないが、該樹脂粉末８の加熱溶解による樹脂
膜が回路基板２の表面も同時に被うようになり、
回路基板２の気密性が一層向上する効果も発揮さ
れる。 Note that since the resin powder 8 is filled in the case 5 so as to cover the circuit board 2, although not shown in FIG. 3, a resin film formed by heating and melting the resin powder 8 also forms on the surface of the circuit board 2. began to cover
The effect of further improving the airtightness of the circuit board 2 is also exhibited.
以上の本発明による気密封止方法は簡易で且つ
従来に比べ気密性が高い封止を達成でき、その効
果は著しいものである。 The hermetic sealing method according to the present invention described above is simple and can achieve sealing with higher airtightness than conventional methods, and its effects are remarkable.
第１図は従来の気密封止方法を説明するための
図、第２，３図は本発明の気密封止方法を説明す
るための部分断面図である
符号の説明、１…回路素子、４…基台、５…ケ
ース、８…熱硬化性樹脂粉末、９…樹脂膜。
Fig. 1 is a diagram for explaining the conventional hermetic sealing method, and Figs. 2 and 3 are partial sectional views for explaining the hermetic sealing method of the present invention. Explanation of symbols: 1...Circuit element; 4 ...Base, 5...Case, 8...Thermosetting resin powder, 9...Resin film.
Claims (1)
子が収容されている電子部品において、前記封着
前に前記空間内に熱硬化性樹脂粉末を前記回路素
子が埋まるように充填し、該樹脂粉末を封着後に
加熱して溶解させることにより、少なくともこれ
の硬化した樹脂膜が前記ケースと前記基台との接
合部を内部から封止することを特徴とした電子部
品の気密封止方法。 ２ 前記硬化性樹脂粉末がエポキシ樹脂からなる
ことを特徴とした特許請求の範囲第１項記載の電
子部品の気密封止方法。 ３ 前記ケースと前記基台が樹脂成形体からな
り、且つ前記封着が超音波溶着であることを特徴
とした特許請求の範囲第１項記載の電子部品の気
密封止方法。[Scope of Claims] 1. In an electronic component in which a circuit element is housed in a space between a sealed case and a base, a thermosetting resin powder is placed in the space before the sealing. The resin powder is filled so as to be buried in the case, and the resin powder is heated and melted after sealing, so that at least the hardened resin film seals the joint between the case and the base from the inside. Method for hermetically sealing electronic components. 2. The method for hermetically sealing an electronic component according to claim 1, wherein the curable resin powder is made of an epoxy resin. 3. The method for hermetically sealing an electronic component according to claim 1, wherein the case and the base are made of a resin molded body, and the sealing is performed by ultrasonic welding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17980780A JPS57103319A (en) | 1980-12-19 | 1980-12-19 | Hermetically sealing method for electronic part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17980780A JPS57103319A (en) | 1980-12-19 | 1980-12-19 | Hermetically sealing method for electronic part |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57103319A JPS57103319A (en) | 1982-06-26 |
| JPS632147B2 true JPS632147B2 (en) | 1988-01-18 |
Family
ID=16072229
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17980780A Granted JPS57103319A (en) | 1980-12-19 | 1980-12-19 | Hermetically sealing method for electronic part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57103319A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5111571A (en) * | 1974-07-19 | 1976-01-29 | Nitto Electric Ind Co | Denkikairososhino patsukeejihoho |
-
1980
- 1980-12-19 JP JP17980780A patent/JPS57103319A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5111571A (en) * | 1974-07-19 | 1976-01-29 | Nitto Electric Ind Co | Denkikairososhino patsukeejihoho |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57103319A (en) | 1982-06-26 |
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