JPS57103319A - Hermetically sealing method for electronic part - Google Patents

Hermetically sealing method for electronic part

Info

Publication number
JPS57103319A
JPS57103319A JP17980780A JP17980780A JPS57103319A JP S57103319 A JPS57103319 A JP S57103319A JP 17980780 A JP17980780 A JP 17980780A JP 17980780 A JP17980780 A JP 17980780A JP S57103319 A JPS57103319 A JP S57103319A
Authority
JP
Japan
Prior art keywords
case
resin
bonded
base
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17980780A
Other languages
Japanese (ja)
Other versions
JPS632147B2 (en
Inventor
Toshio Matsushita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP17980780A priority Critical patent/JPS57103319A/en
Publication of JPS57103319A publication Critical patent/JPS57103319A/en
Publication of JPS632147B2 publication Critical patent/JPS632147B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE:To obtain sufficiently high airtightness of an electronic part by containing a base mounting the part in a case, filling and heating thermosetting resin powder to hermetically seal the part by sealing the bonded part of the base and the case from the interior with molten and hardened resin. CONSTITUTION:A circuit board 2 formed with a film 6 on the surface is contained in a case 5 disposed with its hole upside, and thermosetting epoxy resin 8 is filled in the case 5 until the board 2 is buried. A base 4 is provided at the bonded part A of the case 5 while a lead terminal 3 mounted on the board 2 is externally protruded in this state, and the bonded part A is sealed by ultrasonic wave. Thereafter, the bonded surface A is disposed downside, is heat treated at 150 deg.C for 1hr in a heating furnace to seal to the surface A further from the inside with a resin film 9 when the molten resin 8 is hardened. In this manner its airtightness can be sufficiently provided.
JP17980780A 1980-12-19 1980-12-19 Hermetically sealing method for electronic part Granted JPS57103319A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17980780A JPS57103319A (en) 1980-12-19 1980-12-19 Hermetically sealing method for electronic part

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17980780A JPS57103319A (en) 1980-12-19 1980-12-19 Hermetically sealing method for electronic part

Publications (2)

Publication Number Publication Date
JPS57103319A true JPS57103319A (en) 1982-06-26
JPS632147B2 JPS632147B2 (en) 1988-01-18

Family

ID=16072229

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17980780A Granted JPS57103319A (en) 1980-12-19 1980-12-19 Hermetically sealing method for electronic part

Country Status (1)

Country Link
JP (1) JPS57103319A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5111571A (en) * 1974-07-19 1976-01-29 Nitto Electric Ind Co Denkikairososhino patsukeejihoho

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5111571A (en) * 1974-07-19 1976-01-29 Nitto Electric Ind Co Denkikairososhino patsukeejihoho

Also Published As

Publication number Publication date
JPS632147B2 (en) 1988-01-18

Similar Documents

Publication Publication Date Title
IE792037L (en) Semiconductor package
JPS5825246A (en) Package for electronic device
GB1296629A (en)
US3178506A (en) Sealed functional molecular electronic device
JPS57103319A (en) Hermetically sealing method for electronic part
GB1035219A (en) Electronic device package and method of making same
JPS5543878A (en) Circuit unit
US4190735A (en) Semiconductor device package
JPS642399A (en) Semiconductor device
JPS6468098A (en) Remote control device
JPS55158653A (en) Hybrid integrated circuit device
JPS5623755A (en) Assembly of semiconductor device
JPS55163855A (en) Method of opening sealed electronic part sealed by epoxy resin
JPS57159032A (en) Forming method for package of electronic timepiece
JPS5710253A (en) Semiconductor device
KR910015037A (en) Metal electronic package and manufacturing process
JPS6333463Y2 (en)
JPS572537A (en) Semiconductor device
JPS6489356A (en) Hybrid integrated circuit
JPS5772413A (en) Surface acoustic wave filter
JPS57187955A (en) Sealing structure of semiconductor element
JPS57210645A (en) Hybrid integrated circuit module and manufacture thereof
JPS5768054A (en) Hermetically sealed container
JPS55123151A (en) Integrated circuit device
JPS56104454A (en) Sealing method of semiconductor element