JP2001168493A5 - - Google Patents
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- Publication number
- JP2001168493A5 JP2001168493A5 JP1999347687A JP34768799A JP2001168493A5 JP 2001168493 A5 JP2001168493 A5 JP 2001168493A5 JP 1999347687 A JP1999347687 A JP 1999347687A JP 34768799 A JP34768799 A JP 34768799A JP 2001168493 A5 JP2001168493 A5 JP 2001168493A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- electronic device
- resin
- resin layer
- collective substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 239000000758 substrate Substances 0.000 description 169
- 239000010410 layer Substances 0.000 description 106
- 239000011347 resin Substances 0.000 description 101
- 229920005989 resin Polymers 0.000 description 101
- 239000002184 metal Substances 0.000 description 37
- 238000004519 manufacturing process Methods 0.000 description 31
- 238000000034 method Methods 0.000 description 22
- 239000011159 matrix material Substances 0.000 description 16
- 238000007639 printing Methods 0.000 description 13
- 229910000679 solder Inorganic materials 0.000 description 13
- 239000004020 conductor Substances 0.000 description 12
- 238000005520 cutting process Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 238000000926 separation method Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 238000002844 melting Methods 0.000 description 5
- 239000002699 waste material Substances 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000005755 formation reaction Methods 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 239000002585 base Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 125000003700 epoxy group Chemical group 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 238000007493 shaping process Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000002253 acid Substances 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000000875 corresponding Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000005672 electromagnetic field Effects 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910000529 magnetic ferrite Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 230000002093 peripheral Effects 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 230000001702 transmitter Effects 0.000 description 1
- 238000004642 transportation engineering Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000004078 waterproofing Methods 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34768799A JP2001168493A (ja) | 1999-12-07 | 1999-12-07 | 電子装置の製造方法及び電子装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34768799A JP2001168493A (ja) | 1999-12-07 | 1999-12-07 | 電子装置の製造方法及び電子装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001168493A JP2001168493A (ja) | 2001-06-22 |
| JP2001168493A5 true JP2001168493A5 (zh) | 2004-07-15 |
Family
ID=18391901
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP34768799A Pending JP2001168493A (ja) | 1999-12-07 | 1999-12-07 | 電子装置の製造方法及び電子装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001168493A (zh) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4357817B2 (ja) | 2002-09-12 | 2009-11-04 | パナソニック株式会社 | 回路部品内蔵モジュール |
| US6998532B2 (en) | 2002-12-24 | 2006-02-14 | Matsushita Electric Industrial Co., Ltd. | Electronic component-built-in module |
| JP2004335865A (ja) | 2003-05-09 | 2004-11-25 | Murata Mfg Co Ltd | 電子部品の製造方法および電子部品 |
| JP2010225700A (ja) * | 2009-03-19 | 2010-10-07 | Olympus Corp | 実装構造体および実装構造体の製造方法 |
| US20100254109A1 (en) | 2009-03-19 | 2010-10-07 | Olympus Corporation | Mount assembly and method for manufacturing mount assembly |
| JP2019033173A (ja) * | 2017-08-08 | 2019-02-28 | オムロン株式会社 | 耐蝕性電子基板およびそれに用いるコーティング組成物 |
-
1999
- 1999-12-07 JP JP34768799A patent/JP2001168493A/ja active Pending
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