JPS63204697A - 混成集積回路の製造方法 - Google Patents

混成集積回路の製造方法

Info

Publication number
JPS63204697A
JPS63204697A JP3616687A JP3616687A JPS63204697A JP S63204697 A JPS63204697 A JP S63204697A JP 3616687 A JP3616687 A JP 3616687A JP 3616687 A JP3616687 A JP 3616687A JP S63204697 A JPS63204697 A JP S63204697A
Authority
JP
Japan
Prior art keywords
insulating film
metal substrate
recess
integrated circuit
hybrid integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3616687A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0556878B2 (enrdf_load_stackoverflow
Inventor
三浦　敬男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP3616687A priority Critical patent/JPS63204697A/ja
Publication of JPS63204697A publication Critical patent/JPS63204697A/ja
Publication of JPH0556878B2 publication Critical patent/JPH0556878B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Insulated Metal Substrates For Printed Circuits (AREA)
JP3616687A 1987-02-19 1987-02-19 混成集積回路の製造方法 Granted JPS63204697A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3616687A JPS63204697A (ja) 1987-02-19 1987-02-19 混成集積回路の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3616687A JPS63204697A (ja) 1987-02-19 1987-02-19 混成集積回路の製造方法

Publications (2)

Publication Number Publication Date
JPS63204697A true JPS63204697A (ja) 1988-08-24
JPH0556878B2 JPH0556878B2 (enrdf_load_stackoverflow) 1993-08-20

Family

ID=12462174

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3616687A Granted JPS63204697A (ja) 1987-02-19 1987-02-19 混成集積回路の製造方法

Country Status (1)

Country Link
JP (1) JPS63204697A (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPH0556878B2 (enrdf_load_stackoverflow) 1993-08-20

Similar Documents

Publication Publication Date Title
US6482674B1 (en) Semiconductor package having metal foil die mounting plate
EP1041633B1 (en) Semiconductor device, method of manufacture thereof, circuit board, and electronic device
JP2953899B2 (ja) 半導体装置
JP2001085592A (ja) 半導体装置及びその製造方法、回路基板並びに電子機器
JPH03112688A (ja) Ｉｃカード
JPH0319703B2 (enrdf_load_stackoverflow)
JP3417095B2 (ja) 半導体装置
JP4208490B2 (ja) 半導体電力用モジュール及びその製造方法
JPH11243172A (ja) チップサイズ半導体パッケージ及びその製造方法
JPS63204697A (ja) 混成集積回路の製造方法
JP2524482B2 (ja) Ｑｆｐ構造半導体装置
JP4859016B2 (ja) 半導体パッケージ
JPH0442937Y2 (enrdf_load_stackoverflow)
JPH043500Y2 (enrdf_load_stackoverflow)
JP4247623B2 (ja) 半導体装置及びその製造方法、回路基板並びに電子機器
JP2737332B2 (ja) 集積回路装置
JPH0442938Y2 (enrdf_load_stackoverflow)
JPH04139737A (ja) 半導体チップの実装方法
JPH04348049A (ja) Ｉｃモジュールの接続方法
JPH0810746B2 (ja) メモリーモジュール
JP2003007964A (ja) 積層半導体装置およびその製造方法
JPS60129897A (ja) 小型電子機器
JPH0621248Y2 (ja) ピングリッドアレイパッケージ用回路基板
JP3161203B2 (ja) テープキャリアパッケージ式の半導体実装構造
JPH0739244Y2 (ja) 混成集積回路装置

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term