JPS6318334B2 - - Google Patents
Info
- Publication number
- JPS6318334B2 JPS6318334B2 JP58119404A JP11940483A JPS6318334B2 JP S6318334 B2 JPS6318334 B2 JP S6318334B2 JP 58119404 A JP58119404 A JP 58119404A JP 11940483 A JP11940483 A JP 11940483A JP S6318334 B2 JPS6318334 B2 JP S6318334B2
- Authority
- JP
- Japan
- Prior art keywords
- diode
- large diameter
- diameter portion
- electrode
- diameter part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/492—Bases or plates or solder therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11940483A JPS6010761A (ja) | 1983-06-30 | 1983-06-30 | ダイオ−ド電極部品 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11940483A JPS6010761A (ja) | 1983-06-30 | 1983-06-30 | ダイオ−ド電極部品 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6010761A JPS6010761A (ja) | 1985-01-19 |
| JPS6318334B2 true JPS6318334B2 (enrdf_load_stackoverflow) | 1988-04-18 |
Family
ID=14760640
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11940483A Granted JPS6010761A (ja) | 1983-06-30 | 1983-06-30 | ダイオ−ド電極部品 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6010761A (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61182040U (enrdf_load_stackoverflow) * | 1985-04-30 | 1986-11-13 | ||
| JPS62188791A (ja) * | 1986-02-15 | 1987-08-18 | Nishimura Watanabe Chiyuushiyutsu Kenkyusho:Kk | Ｎｉ，Ｃｏ，Ｚｎ，Ｃｕ，Ｍｎ及びＣｒの電解採取方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5883154U (ja) * | 1981-11-30 | 1983-06-06 | 日本電気ホームエレクトロニクス株式会社 | 電子部品 |
-
1983
- 1983-06-30 JP JP11940483A patent/JPS6010761A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6010761A (ja) | 1985-01-19 |
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